DSA00435067.pdf by Xilinx

Partial File Text Application Note: Packaging R Implementing Xilinx Flip-Chip BGA Packages XAPP426 (v1.3) March 3, 2006 Summary Xilinx flip-chip BGA package is offered for Xilinx high-performance FPGA pro
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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Alpha WS609 Alpha WS609 solder BGA heatsink compressive force BGA PROFILING C-145 Device Reliability report XILINX FF1152 pcb warpage after reflow reballing bga solder paste alpha WS609 WS609 XAPP426 XAPP427

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