DSAZIHA2X00053378.pdf by Intersil

Partial File Text Technical Brief 451 PCB Assembly Guidelines for Intersil Wafer Level Chip Scale Package Devices Introduction SOLDER BALL: Sn/Ag/Cu There is an industry-wide trend towards using the smallest
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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intersil standard part marking TB451 wlcsp inspection

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