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    0E8000 Search Results

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    0E8000 Price and Stock

    SiTime Corporation SIT8008BI-82-30E-8.000000

    MEMS OSC XO 8.0000MHZ H/LV-CMOS
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    DigiKey SIT8008BI-82-30E-8.000000 233 1
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    Bridgelux Inc BXEB-L1120Z-40E8000-C-D3

    LED MOD EB SER WH LNR STRP 4000K
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    DigiKey BXEB-L1120Z-40E8000-C-D3 Bulk 181 1
    • 1 $17.15
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    Newark BXEB-L1120Z-40E8000-C-D3 Bulk 100
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    EBV Elektronik BXEB-L1120Z-40E8000-C-D3 8 Weeks 100
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    Bridgelux Inc BXEB-L1120Z-50E8000-C-D3

    LED MOD EB SER WH LNR STRP 5000K
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    DigiKey BXEB-L1120Z-50E8000-C-D3 Bulk 95 1
    • 1 $17.09
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    Bridgelux Inc BXEB-L1120Z-30E8000-C-D3

    LED MOD EB SER WH LNR STR 3000K
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    DigiKey BXEB-L1120Z-30E8000-C-D3 Bulk 71 1
    • 1 $16.98
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    Newark BXEB-L1120Z-30E8000-C-D3 Bulk 100
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    Gedore Torque Ltd 1500-E-8000-L

    ES TOOL MODULE EMPTY
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    DigiKey 1500-E-8000-L Bulk 1
    • 1 $44.59
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    0E8000 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Sharp LH28F320BFHE-PBTLEZ Driver

    Abstract: LH28F320BFHE-PBTLEZ
    Text: PRODUCT SPECIFICATION Integrated Circuits Group LH28F320BFHE-PBTLEZ Flash Memory 32Mbit 2Mbitx16 (Model Number: LHF32FEZ) Spec. Issue Date: September 13, 2004 Spec No: EL169103 LHF32FEZ • Handle this document carefully for it contains material protected by international copyright law. Any reproduction,


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    PDF LH28F320BFHE-PBTLEZ 32Mbit 2Mbitx16) LHF32FEZ) EL169103 LHF32FEZ Sharp LH28F320BFHE-PBTLEZ Driver LH28F320BFHE-PBTLEZ

    FW82815EM

    Abstract: FW82807A INTEL PENTIUM PROCESSOR MOBILE MODULE FW82815E gfx e4 GFX E6 pentium pro architecture FW82815EM SL4MP FW82815 360-pin BGA IBM
    Text: R Intel 815EM Chipset: 82815EM Graphics and Memory Controller Hub GMCH2-M Datasheet April 2003 Document Reference Number: 290689-002 Intel® 82815EM GMCH R Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


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    PDF 815EM 82815EM 82815EM FW82815EM FW82807A INTEL PENTIUM PROCESSOR MOBILE MODULE FW82815E gfx e4 GFX E6 pentium pro architecture FW82815EM SL4MP FW82815 360-pin BGA IBM

    Untitled

    Abstract: No abstract text available
    Text: FUJITSU SEMICONDUCTOR DATA SHEET DS05-50304-2E Stacked MCP Multi-Chip Package FLASH MEMORY & FCRAM CMOS 64 M ( x 16) FLASH MEMORY & 16 M ( × 16) Mobile FCRAMTM MB84VD23381FJ-80 • FEATURES • Power Supply Voltage of 2.7 V to 3.1 V • High Performance


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    PDF DS05-50304-2E MB84VD23381FJ-80 65-ball

    MARKING HRA

    Abstract: 4kw marking
    Text: FUJITSU SEMICONDUCTOR DATA SHEET SMCP0.2E Stacked MCP Multi-Chip Package FLASH MEMORY & SRAM CMOS 16M (x8/×16) FLASH MEMORY & 4M (×8/×16) STATIC RAM MB84VD2118XEM-70/MB84VD2119XEM-70 • FEATURES • Power Supply Voltage of 2.7 V to 3.3 V • High Performance


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    PDF MB84VD2118XEM-70/MB84VD2119XEM-70 56-ball MB84VD2118XEM/MB84VD2119XEM MARKING HRA 4kw marking

    ba4410

    Abstract: Samsung MCP Flash Memory SAMSUNG k5 dual diode BA45 BA6511 samsung MCP K5 BA40 BA-36 BA5111 bga221
    Text: K5A3x41YT B A MCP MEMORY Document Title Multi-Chip Package MEMORY 32M Bit (2Mx16) Dual Bank NOR Flash Memory / 4M(256Kx16) Full CMOS SRAM Revision History Revision No. History Draft Date Remark Preliminary 0.0 Initial Draft August 28, 2001 1.0 Final Specification


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    PDF K5A3x41YT 2Mx16) 256Kx16) 66-Ball 80x11 08MAX ba4410 Samsung MCP Flash Memory SAMSUNG k5 dual diode BA45 BA6511 samsung MCP K5 BA40 BA-36 BA5111 bga221

    fw912

    Abstract: MT28F642D18 MT28F642D20 fw911 FY912 fw905
    Text: ADVANCE‡ 4 MEG x 16 ASYNC/PAGE/BURST FLASH MEMORY FLASH MEMORY MT28F642D18 MT28F642D20 Low Voltage, Extended Temperature 0.18µm Process Technology FEATURES PIN ASSIGNMENT 59-Ball FBGA • Single device supports asynchronous, page, and burst operations • Flexible dual-bank architecture


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    PDF MT28F642D18 MT28F642D20 59-Ball MT28F642D18 MT28F642D20 fw912 fw911 FY912 fw905

    am29dl323cb

    Abstract: DL323 DL322
    Text: PRELIMINARY Am29DL322C/Am29DL323C 32 Megabit 4 M x 8-Bit/2 M x 16-Bit CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory DISTINCTIVE CHARACTERISTICS ARCHITECTURAL ADVANTAGES • Simultaneous Read/Write operations — Data can be continuously read from one bank while


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    PDF Am29DL322C/Am29DL323C 16-Bit) sectm29DL323C Am29DL323 am29dl323cb DL323 DL322

    ES29DL320

    Abstract: 3FE00
    Text: EE SS II ADVANCED INFORMATION Excel Semiconductor inc. ES29DL320 32Mbit 4M x 8/2M x 16 CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory GENERAL FEATURES • Power consumption (typical values) - 15uA in standby or automatic sleep mode - 10mA active read current at 5MHz


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    PDF ES29DL320 32Mbit 125oC ES29DL320 3FE00

    AM29DL320GT70

    Abstract: marking e3 6-pin
    Text: ADVANCE INFORMATION Am29DL320G 32 Megabit 4 M x 8-Bit/2 M x 16-Bit CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory DISTINCTIVE CHARACTERISTICS ARCHITECTURAL ADVANTAGES • Minimum 1 million write cycles guaranteed per sector ■ Simultaneous Read/Write operations


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    PDF Am29DL320G 16-Bit) 048--Thin AM29DL320GT70 marking e3 6-pin

    A0-A21

    Abstract: M29W641D M29W641DH M29W641DL M29W641DU
    Text: M29W641DH, M29W641DL M29W641DU 64 Mbit 4Mb x16, Uniform Block 3V Supply Flash Memory PRODUCT PREVIEW FEATURES SUMMARY • SUPPLY VOLTAGE Figure 1. Packages – VCC = 2.7V to 3.6V Core Power Supply – VCCQ = 1.8V to 3.6V for Input/Output ■ – VPP =12 V for Fast Program (optional)


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    PDF M29W641DH, M29W641DL M29W641DU 120ns 32-KWord TSOP48 A0-A21 M29W641D M29W641DH M29W641DL M29W641DU

    pa 66 gf

    Abstract: M36W432BG M36W432TG AI07927 PA 6.6 GF 13
    Text: M36W432TG M36W432BG 32 Mbit 2Mb x16, Boot Block Flash Memory and 4 Mbit (256Kb x16) SRAM, Multiple Memory Product PRELIMINARY DATA FEATURES SUMMARY • MULTIPLE MEMORY PRODUCT – 32 Mbit (2Mb x 16), Boot Block, Flash Memory – 4 Mbit (256Kb x 16) SRAM Memory


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    PDF M36W432TG M36W432BG 256Kb M36W432TG: 88BAh M36W432BG: 88BBh pa 66 gf M36W432BG M36W432TG AI07927 PA 6.6 GF 13

    samsung k5 mcp

    Abstract: SAMSUNG MCP A3240 Flash Memory SAMSUNG k5
    Text: K5A3x40YT B A MCP MEMORY Document Title Multi-Chip Package MEMORY 32M Bit (4Mx8/2Mx16) Dual Bank NOR Flash Memory / 4M(512Kx8/256Kx16) Full CMOS SRAM Revision History Revision No. History Draft Date Remark Preliminary 0.0 Initial Draft August 28, 2001 1.0


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    PDF K5A3x40YT 4Mx8/2Mx16) 512Kx8/256Kx16) 69-Ball 08MAX samsung k5 mcp SAMSUNG MCP A3240 Flash Memory SAMSUNG k5

    DS05-50205-1E

    Abstract: MB84VD2208XEA SA70
    Text: FUJITSU SEMICONDUCTOR DATA SHEET DS05-50205-1E Stacked MCP Multi-Chip Package FLASH MEMORY & SRAM CMOS 32M (x 8/×16) FLASH MEMORY & 2M (× 8/×16) STATIC RAM MB84VD2208XEA-90/MB84VD2209XEA-90 • FEATURES • Power supply voltage of 2.7 to 3.3V • High performance


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    PDF DS05-50205-1E MB84VD2208XEA-90/MB84VD2209XEA-90 73-ball BGA-73P-M01) MB84VDatives DS05-50205-1E MB84VD2208XEA SA70

    floppydiskdrive

    Abstract: 4258h keyboard block diagram A218h Am486 DX instruction set real time microcontroller 8254 applications a258h pmc 4351 configuration 8250 uart HIGH SPEED FREQUENCY DIVIDER
    Text: Élan SC310 Microcontroller Programmer’s Reference Manual Rev. A, April 1996  1996 by Advanced Micro Devices, Inc. Advanced Micro Devices reserves the right to make changes in its products without notice in order to improve design or performance characteristics.


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    PDF lanTMSC310 33-MHz floppydiskdrive 4258h keyboard block diagram A218h Am486 DX instruction set real time microcontroller 8254 applications a258h pmc 4351 configuration 8250 uart HIGH SPEED FREQUENCY DIVIDER

    TFBGA63

    Abstract: M29DW323D M29DW323DB M29DW323DT TFBGA48
    Text: M29DW323DT M29DW323DB 32 Mbit 4Mb x8 or 2Mb x16, Dual Bank 8:24, Boot Block 3V Supply Flash Memory FEATURES SUMMARY • SUPPLY VOLTAGE Figure 1. Packages – VCC = 2.7V to 3.6V for Program, Erase and Read ■ – VPP =12V for Fast Program (optional) ACCESS TIME: 70, 90ns


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    PDF M29DW323DT M29DW323DB TSOP48 24Mbit TFBGA63 TFBGA63 M29DW323D M29DW323DB M29DW323DT TFBGA48

    M36W432

    Abstract: M36W432B M36W432T
    Text: M36W432T M36W432B 32 Mbit 2Mb x16, Boot Block Flash Memory and 4 Mbit (256K x16) SRAM, Multiple Memory Product PRODUCT PREVIEW FEATURES SUMMARY • SUPPLY VOLTAGE – VDDF = 2.7V to 3.3V SRAM ■ 4 Mbit (256K x 16 bit) – VDDS = VDDQF = 2.7V to 3.3V ■


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    PDF M36W432T M36W432B M36W432T: 88BAh M36W432B: 88BBh M36W432 M36W432B M36W432T

    SGA17

    Abstract: No abstract text available
    Text: IS71V08F32XS08 IS71V16F32XS08 ISSI 3.0 Volt-Only Flash & SRAM COMBO with Stacked Multi-Chip Package MCP — 32 Mbit Simultaneous Operation Flash Memory and 8 Mbit Static RAM MCP FEATURES • Power supply voltage 2.7V to 3.3V • High performance: Flash: 70ns maximum access time


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    PDF IS71V08F32XS08 IS71V16F32XS08 73-ball IS71V16F32AS08-8585BI IS71V16F32BS08-8585BI IS71V16F32CS08-8585BI SGA17

    Transistor 5C5

    Abstract: No abstract text available
    Text: IC71V08F32xS08 IC71V16F32xS08 Document Title 3.0 Volt-Only Flash & SRAM COMBO with Stacked Multi-Chip Package MCP - 32 Mbit Simultaneous Operation Flash Memory and 8 Mbit Static RAM Revision History Revision No History Draft Date 0A 0B Initial Draft Add 73 ball BGA package


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    PDF IC71V08F32xS08 IC71V16F32xS08 MCP001-0B 73-ball IC71V16F32CS08-85B73 IC71V16F32DS08-85B73 Transistor 5C5

    MARKING HRA

    Abstract: SEC MCP 4kw marking
    Text: FUJITSU SEMICONDUCTOR DATA SHEET SMCP0.3E Stacked MCP Multi-Chip Package FLASH MEMORY & SRAM CMOS 16M (x8/×16) FLASH MEMORY & 2M (×8/×16) STATIC RAM MB84VD2108XEM-70/MB84VD2109XEM-70 • FEATURES • Power Supply Voltage of 2.7 V to 3.3 V • High Performance


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    PDF MB84VD2108XEM-70/MB84VD2109XEM-70 56-ball MB84VD2108XEM/MB84VD2109XEM MARKING HRA SEC MCP 4kw marking

    LRS1806A

    Abstract: No abstract text available
    Text: Date Aug. 7.2001 64M x16 Flash + 16M (x16) SCRAM LRS1806A sharp LRS1806A • Handle this document carefully for it contains material protected by international copyright law. Any reproduction, full or in part, of this material is prohibited without the express written permission


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    PDF LRS1806A LRS1806A

    Untitled

    Abstract: No abstract text available
    Text: FUJITSU SEMICONDUCTOR DATA SHEET AE0.2E FLASH MEMORY CMOS 16 M 2M x 8/1M × 16 BIT MirrorFlashTM MBM29LV160TM/BM 90 n DESCRIPTION The MBM29LV160TM/BM is a 32M-bit, 3.0 V-only Flash memory organized as 4M bytes by 8 bits or 2M words by 16 bits. The MBM29LV160TM/BM is offered in 48-pin TSOP(I) and 48-ball FBGA. The device is designed to


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    PDF MBM29LV160TM/BM 32M-bit, 48-pin 48-ball

    LH28F640BFHB-PTTL60

    Abstract: No abstract text available
    Text: PRELIMINARY PRODUCT SPECIFICATIONS Integrated Circuits Group LH28F640BFHB-PTTL60 Flash Memory 64M 4M x 16 (Model No.: LHF64FBD) Spec No.: FM028013 Issue Date: August 27,2002 sharp LHF64FBD x Handle this document carefully for it contains material protected by international copyright law. Any reproduction,


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    PDF LH28F640BFHB-PTTL60 LHF64FBD) FM028013 LHF64FBD LH28F640BFHB-PTTL60

    LRS1B06

    Abstract: No abstract text available
    Text: PRODUCT SPECIFICATIONS Integrated Circuits Group LRS1B06 Stacked Chip 128M x16 Boot Block Flash and 32M (x16) SCRAM and 8M (x16) SRAM (Model No.: LRS1B06) Spec No.: EL147068 Issue Date: January 27, 2003 sharp L R S1 B 0 6 • Handle this document carefully for it contains material protected by international copyright law.


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    PDF LRS1B06 LRS1B06) EL147068 LRS1B06

    Untitled

    Abstract: No abstract text available
    Text: FUJITSU SEMICONDUCTOR DATA SHEET AE2E Stacked MCP Multi-Chip Package FLASH MEMORY & SRAM CMOS 32M (x 8/x16) FLASH MEMORY & 4M (x 8/x16) STATIC RAM MB84VD2218XA-10/MB84VD2219XA-10 • FEATURES • Power supply voltage of 2.7 to 3.6 V • High performance


    OCR Scan
    PDF 8/x16) MB84VD2218XA-10/MB84VD2219XA-10 100ns 77-ball F9903