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    npo 22j

    Abstract: C2012COG1H capacitor type 104z 50v capacitors 22j NPO ceramic Y5V 104Z V104Z CC0603HNP0120J CC0805C CC0805HNPO C3216Y5V1C105
    Text: CAPACITORS C A P AC ITO R S Ceramic Chip TDK’s n4k> Sub-Miniature chip capacitor additions answer tbe electronics industry’s needfo r , bigber density packaging. TDK’s advanced technology allows fo r smaller size, bigbest capaci­ tance, increased reliability, and automated assembly. Applications include computers and


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    PDF 30ppm/ VoltageR1C473M CKCA43X7R1C104M CKCA43Y5V1H223Z CKCA43V5V1H473Z CKCA43Y5V1H1 CKCA43X7R1H471M CA43X7R1H102M OCA43X7R1H222M CA43X7R npo 22j C2012COG1H capacitor type 104z 50v capacitors 22j NPO ceramic Y5V 104Z V104Z CC0603HNP0120J CC0805C CC0805HNPO C3216Y5V1C105

    capacitor 104m z5u 50

    Abstract: 104m Z5U 50 TDK CC0805HNP CC0603H CC0805HX7R104K CC0805HX7R103K Z5U 104M C3216COG1H CC1206HNP0392J CC0603HX7R103K
    Text: CAPACITORS Ceramic Chip Electrical Specification Capacitance Range Temperature Characteristic 10pF to 10.0p,F NPO: 0±30ppm /°C -55°C to + 125°C 1Vrms, 1kHz 25°C X7R: NPO 1,000pF and less: 1MHz X5R: ±15% (-55°C to +85°C) Y5V: +22-82% (-30°C to +85°C)


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    PDF 000pF 30ppm C3216Y5V1H474Z C3216Y5V1H105Z 1206EZ5U CC1206EZ5U224M C3216Z5U1E104M C3216Z5U1E224M CC1210CY5V106Z C3225Y5V1C capacitor 104m z5u 50 104m Z5U 50 TDK CC0805HNP CC0603H CC0805HX7R104K CC0805HX7R103K Z5U 104M C3216COG1H CC1206HNP0392J CC0603HX7R103K

    CC0603HNP0

    Abstract: C1608COG1H 1h473m CC0805HNP0 CC0805HNP0151J C1608COG1H820J
    Text: CAPACITORS CAPACITORS Ceramic Chip ti TDK’s ndbi Sub-Miniature chip capacitor additions answer tbe electronics industry’s need fo r , higher density packaging. TDK’s advanced technology allows fo r smaller size, highest capaci­ tance, increased reliability, and automated assembly. Applications include computers and


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    PDF CA43X7R1H CKCA43X7R1H CKCA43Y5V1H223Z CKCA43V5V1H473Z 43Y5V1H C224Z CKCA43Y5V1C474Z CC0603HNP0 C1608COG1H 1h473m CC0805HNP0 CC0805HNP0151J C1608COG1H820J