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    24 LEADS QFN 5X5 Search Results

    24 LEADS QFN 5X5 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    BQ24751BRHDT Texas Instruments Multi-Cell Synchronous Switch-mode Charger in 5x5 QFN 28-VQFN -40 to 125 Visit Texas Instruments Buy
    BQ24751BRHDR Texas Instruments Multi-Cell Synchronous Switch-mode Charger in 5x5 QFN 28-VQFN -40 to 125 Visit Texas Instruments Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    24 LEADS QFN 5X5 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    24 leads qfn 5x5

    Abstract: qfn 3X3 land pattern JESD47D 28 leads qfn 4x5 QFN 20 5x5 "recommended PCB Layout" JEDEC J-STD-033b marking 8206 Jedec jesd47d AN0017 qfn 5x5 thermal resistance
    Text: AN0017 Application Note for Molded Plastic QFN Packages GaAs Monolithic Packaged Microwave IC 1. General considerations on plastic molded packages Surface Mount Device type packages SMD* for microwave applications are appearing more and more on the market. The use of such packages requires some


    Original     		AN0017 AN0017-8206 24 leads qfn 5x5 qfn 3X3 land pattern JESD47D 28 leads qfn 4x5 QFN 20 5x5 "recommended PCB Layout" JEDEC J-STD-033b marking 8206 Jedec jesd47d AN0017 qfn 5x5 thermal resistance PDF

    QFN 76 9x9 footprint

    Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance


    Original     		AN1902 QFN 76 9x9 footprint QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220 PDF

    tqfp 7X7X1.4mm

    Abstract: 14x14x1.4mm wlcsp inspection MO-169 TB347 TQFP 48-1 PACKAGE
    Text: Tape and Reel Specification for Integrated Circuits Technical Brief April 13, 2009 TB347.12 Author: Laszlo Nemeth Introduction • EIA-481 for the. . . . . . . . . . . . . . . . 8, 12, 16, 24, 32, 44 and 56mm Wide Tape Many surface mounted devices SMD are being packaged


    Original     		TB347 EIA-481 NOMINA24) tqfp 7X7X1.4mm 14x14x1.4mm wlcsp inspection MO-169 TQFP 48-1 PACKAGE PDF

    Untitled

    Abstract: No abstract text available
    Text: Technical Brief 347 Tape and Reel Specification for Integrated Circuits Introduction Many Surface Mounted Devices SMDs are being packaged for shipment in embossed tape and wound onto reels. The Intersil tape and reel specifications are in compliance with


    Original     		EIA-481 TB347 PDF

    QFn 64 tape carrier

    Abstract: Techwell 7x7x1 TB347 MO-169 1748 QFN
    Text: Technical Brief 347 Author: Laszlo Nemeth Tape and Reel Specification for Integrated Circuits Introduction Many surface mounted devices SMD are being packaged for shipment in embossed tape and wound onto reels. The Intersil Tape and Reel specifications are in compliance with


    Original     		EIA-481 TB347 QFn 64 tape carrier Techwell 7x7x1 MO-169 1748 QFN PDF

    FOOTPRINT MO-229 2X3 SOLDERING

    Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level


    Original     		AN1902 FOOTPRINT MO-229 2X3 SOLDERING Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220 PDF

    BD 4914

    Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
    Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.


    Original     		AN1902/D BD 4914 QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8 PDF

    EIA 481 QFN pin 1

    Abstract: smd transistor 5c sot-23 TB347 SMD 504 5E smd transistor 5d sot-23 MO-169 fbga196 TQFP 48-1 PACKAGE WLCSP 7x7x1
    Text: Tape and Reel Specification for Integrated Circuits Technical Brief January 5, 2007 TB347.10 Author: Laszlo Nemeth Introduction • EIA-481 for the. . . . . . . . . . . . . . . . 8, 12, 16, 24, 32, 44 and 56mm Wide Tape Many surface mounted devices SMD are being packaged


    Original     		TB347 EIA-481 EIA 481 QFN pin 1 smd transistor 5c sot-23 SMD 504 5E smd transistor 5d sot-23 MO-169 fbga196 TQFP 48-1 PACKAGE WLCSP 7x7x1 PDF

    DUAL ROW QFN leadframe

    Abstract: QFN tray qfn 4x4 JEDEC qfn tray tray qfn 8x8 tray qfn 6x6 QFN tray 8x8 tray qfn 9x9 QFN 64 8x8 PACKAGE TRAY AN 7823 JEDEC qfn tray 5x5
    Text: QFN Quad Flat No-Lead Package • Punch or Saw singulated formats • Body sizes from 2 x 2mm to 12 x 12mm • Pin counts from 4L to 156L • Square or rectangular body sizes • Leads on four sides of the body QFN • Leads on two opposing sides of the


    Original     		PDF

    JEDEC qfn tray

    Abstract: JEDEC TRAY DIMENSIONS ssop 20 JEDEC TRAY DIMENSIONS ssop-28 JEDEC TRAY DIMENSIONS QFN
    Text: Packaging Product Specification PS007230-0812 Copyright 2012 by Zilog , Inc. All rights reserved. www.zilog.com Packaging Product Specification Warning: DO NOT USE THESE PRODUCTS IN LIFE SUPPORT SYSTEMS. LIFE SUPPORT POLICY ZILOG'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE


    Original     		PS007230-0812 2500/BAG 1600/BAG 900/BAG 600/BAG 2000/REEL 1500/REEL JEDEC qfn tray JEDEC TRAY DIMENSIONS ssop 20 JEDEC TRAY DIMENSIONS ssop-28 JEDEC TRAY DIMENSIONS QFN PDF

    AH315-G

    Abstract: No abstract text available
    Text: AH315 3.3-3.8 GHz WiMAX 2W Driver Amplifier • +33 dBm P1dB • RoHS-compliant/Lead-free 5x5 mm QFN SMT package Applications • 802.16 WiMAX infrastructure AH315 uses a high reliability +5V InGaP/GaAs HBT process technology. The device incorporates proprietary


    Original     		AH315 AH315 stD22-C101 J-STD-020 1-800-WJ1-4401 AH315-G PDF

    s parameters 4ghz

    Abstract: 12923 AH314G AH314-G
    Text: AH314 2.3-2.9 GHz WiMAX 2W Driver Amplifier • +5V Single Supply Voltage  +33 dBm P1dB  Lead-free/RoHS-compliant 5x5 mm QFN SMT package Applications  802.16 WiMAX infrastructure  WiBro infrastructure AH314 uses a high reliability +5V InGaP/GaAs HBT


    Original     		AH314 AH314 JESD22-C101 J-STD-020 1-800-WJ1-4401 s parameters 4ghz 12923 AH314G AH314-G PDF

    marking 18w sot23

    Abstract: marking code 564 SC-74 BRD8011/D sot23-6 marking code 561 QFN 64 8x8 footprint On semiconductor date Code sot-143 24w cooler tvs SMC MARKING lg diode 923 SMA marking code LG
    Text: Tape and Reel Packaging Specifications BRD8011/D Rev. 7, January−2007 SCILLC, 2007 Previous Edition @ 2006 “All Rights Reserved’’ http://onsemi.com Micro8 is a trademark of International Rectifier. PowerFLEX is a trademark of Texas Instruments Incorporated.


    Original     		BRD8011/D January-2007 marking 18w sot23 marking code 564 SC-74 BRD8011/D sot23-6 marking code 561 QFN 64 8x8 footprint On semiconductor date Code sot-143 24w cooler tvs SMC MARKING lg diode 923 SMA marking code LG PDF

    UF 5807

    Abstract: 06035J0R8ABTTR AH315 AH315-PCB LL1608-FSL18NJ QAM-64 "738 819" 2W High Amplifier qfn
    Text: AH315 3.3 – 3.8 GHz WiMAX 2W Driver Amplifier Applications • 802.16 WiMAX infrastructure 24-pin 5x5mm leadless QFN SMT package General Description GND / NC Vcc1 GND / NC Vbias2 Iref2 20 19 18 17 16 RF Out RF In 4 12 RF Out RF In 5 11 RF Out 10 13 GND / NC


    Original     		AH315 24-pin UF 5807 06035J0R8ABTTR AH315 AH315-PCB LL1608-FSL18NJ QAM-64 "738 819" 2W High Amplifier qfn PDF

    Untitled

    Abstract: No abstract text available
    Text: AH314 2.3-2.9 GHz 2W 5V Linear Driver Amplifier Applications • • WCDMA / WiMAX / WiBro / WiFi / LTE Wireless infrastructure 24-pin 5x5mm leadless QFN SMT package Product Features • • • • • • • • Functional Block Diagram 2.3 – 2.9 GHz


    Original     		AH314 24-pin 33dBm AH314 PDF

    QAM64

    Abstract: QAM-64 wimax AH315 AH315-PCB 20symbols QAM driver QAM 1024, OFDM
    Text: AH315 3.3-3.8 GHz WiMAX 2W Driver Amplifier Product Features Product Description • 3.3 – 3.8 GHz • 25 dB Gain • EVM <2.5 %@ 25 dBm Pout • Internal Active Bias • +5V Single Supply Voltage • +33 dBm P1dB • RoHS-compliant/Lead-free 5x5 mm QFN SMT package


    Original     		AH315 AH315 JESD22-C101 JESD22-A114 J-STD-020 QAM64 QAM-64 wimax AH315-PCB 20symbols QAM driver QAM 1024, OFDM PDF

    CATV DISTRIBUTION NETWORK

    Abstract: 0603LS-561XGLB ADTL1-15-75 JESD22-A114 TGA2807-SM 0603 footprint IPC
    Text: TGA2807-SM CATV Ultra Linear Gain Amplifier Applications •  CATV EDGE QAM Cards CMTS Equipment 28-pin 5x5 mm QFN Package Product Features            Functional Block Diagram 40-1000 MHz Bandwidth DOCSIS 3.0 Compliant ACPR: -69 dBc at 61 dBmV Pout


    Original     		TGA2807-SM 28-pin TGA2807 TGA2807-SM CATV DISTRIBUTION NETWORK 0603LS-561XGLB ADTL1-15-75 JESD22-A114 0603 footprint IPC PDF

    Untitled

    Abstract: No abstract text available
    Text: TGA2807-SM CATV Ultra Linear Gain Amplifier Applications •  CATV EDGE QAM Cards CMTS Equipment 28-pin 5x5 mm QFN Package Product Features            Functional Block Diagram 40-1000 MHz Bandwidth DOCSIS 3.0 Compliant ACPR: -69 dBc at 61 dBmV Pout


    Original     		TGA2807-SM 28-pin TGA2807 TGA2807-SM PDF

    0603af

    Abstract: 37dBmV
    Text: TGA2807-SM CATV Ultra Linear Gain Amplifier Applications •  CATV EDGE QAM Cards CMTS Equipment 28-pin 5x5 mm QFN Package Product Features            Functional Block Diagram 40-1000 MHz Bandwidth DOCSIS 3.0 Compliant ACPR: -69 dBc at 61 dBmV Pout


    Original     		TGA2807-SM 28-pin TGA2807 TGA2807-SM 0603af 37dBmV PDF

    s2083

    Abstract: qfn 32 5x5 STENCIL rf 4 mm PQFN s2083 application PQFN jedec package MO-220 32 5x5 qfn 3X3 land pattern PDFN STQFN-14 MO-220
    Text: Application Note S2083 Surface Mount Instructions for QFN / DFN Packages Rev. V9 Introduction Via Design The layout of the surface mount board plays a critical role in product design and must be done properly to achieve the intended performance of an integrated circuit. An accurate PCB pad and solder


    Original     		S2083 s2083 qfn 32 5x5 STENCIL rf 4 mm PQFN s2083 application PQFN jedec package MO-220 32 5x5 qfn 3X3 land pattern PDFN STQFN-14 MO-220 PDF

    qfn 48 7x7 stencil

    Abstract: qfn 28 land pattern land pattern for QFN 7x7 24 leads qfn 5x5 qfn 3X3 land pattern "exposed pad" PCB via XAPP439 pcb design 0,5 mm pitch 5x5 matrix qfg48 dimensions QFN PACKAGE thermal resistance
    Text: Application Note: CoolRunner, CPLD R PCB Pad Pattern Design and SurfaceMount Considerations for QFN Packages XAPP439 v1.0 April 11, 2005 Summary Xilinx Quad Flat No-Lead (QFN) package is a robust and low profile leadframe-based plastic package that has several advantages over traditional leadframe packages.The exposed die


    Original     		XAPP439 qfn 48 7x7 stencil qfn 28 land pattern land pattern for QFN 7x7 24 leads qfn 5x5 qfn 3X3 land pattern "exposed pad" PCB via XAPP439 pcb design 0,5 mm pitch 5x5 matrix qfg48 dimensions QFN PACKAGE thermal resistance PDF

    SS-0259

    Abstract: QFN-36 LAND PATTERN 24E1G nRF24XX nRF2401 nRF2401AG nRF2402G nRF24E1G ase qfn QFN-24
    Text: Nordic Semiconductor ASA T e l: +47 72 89 89 00 Fax: +47 72 89 89 89 NORDIC Reg. n r ./V A T no.: 966011726 Product Change Notification PCN Device affected (product name): PCN no.: nRF2401 AG, nRF2402G, nRF24E1G, nRF24E2G PCN-nRF24xx-004 rev. 1.1 Agreem ent reference (number + version):


    OCR Scan     		nRF2401 nRF2402G nRF24E1G nRF24E2G PCN-nRF24xx-004 2401AG, 2402G, 24E1G, 24E2G SS-0259 QFN-36 LAND PATTERN 24E1G nRF24XX nRF2401AG ase qfn QFN-24 PDF

    H2A SOT-23-6

    Abstract: sot-23 marking code 18w 26 transistor MARKING CODE LAYOUT G SOT89 sot-23 diode marking code 20W sot-143 marking code 20W marking h5 sot-23-5 MARKING CODE diode sod123 t3 18w sot23 transistor
    Text: BRD8011/D Rev. 0, May-2002 Tape and Reel Packaging Specifications ON Semiconductor ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC SCILLC . SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular


    Original     		BRD8011/D May-2002 r14525 BRD8011/D H2A SOT-23-6 sot-23 marking code 18w 26 transistor MARKING CODE LAYOUT G SOT89 sot-23 diode marking code 20W sot-143 marking code 20W marking h5 sot-23-5 MARKING CODE diode sod123 t3 18w sot23 transistor PDF

    marking H5 sot 23-5

    Abstract: H2A SOT-23-6 18w sot23 transistor SC82 TR13 LPCC-16 marking h5 sot-23-5 20w sc82 sot-23 diode marking code 20W H1 SOT-89
    Text: BRD8011/D Rev. 0, May-2002 Tape and Reel Packaging Specifications ON Semiconductor ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC SCILLC . SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular


    Original     		BRD8011/D May-2002 r14525 marking H5 sot 23-5 H2A SOT-23-6 18w sot23 transistor SC82 TR13 LPCC-16 marking h5 sot-23-5 20w sc82 sot-23 diode marking code 20W H1 SOT-89 PDF