Untitled
Abstract: No abstract text available
Text: □PM Dense-Pac Microsystems. Inc. <T DPV32X16A 32K X 16 UVEPROM PGA MODULE O PRELIM IN ARY DESCRIPTION: The DPV32X16A is a 40-pin Pin G rid Array PGA consisting o f tw o 32K X 8 UVEPROM devices in ceram ic LCC packages surface m ounted on a co-fired ceram ic substrate w ith m atched thermal coefficients.
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OCR Scan
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DPV32X16A
DPV32X16A
40-pin
200ns
250ns
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PDF
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0-32k
Abstract: CERAMIC PIN GRID ARRAY 120 pins 6A14
Text: £ n jS ¡^ DPV32X16A Dense-Pac Microsystems, Inc. 0 _ 32K X 16 UVEPROM PGA MODULE PRELIMINARY DESCRIPTION: The DPV32X16A is a 40-pin Pin Grid Array PGA consisting of two 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired
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OCR Scan
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dpv32XI6A
DPV32X16A
40pin
250ns
l/OO-1/015
30a04902
0-32k
CERAMIC PIN GRID ARRAY 120 pins
6A14
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PDF
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Untitled
Abstract: No abstract text available
Text: □PM D P V 3 2 X 1 6 A Dense-Pac Microsystems. Inc. 32K X 16 UVEPROM PGA MODULE O PRELIMINARY DESCRIPTION: The D PV32X16A is a 40-pin Pin Grid Array PGA consisting of two 32K X 8 U VEPRO M devices in ceramic LC C packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.
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OCR Scan
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PV32X16A
40-pin
32KX16
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PDF
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MEAB
Abstract: No abstract text available
Text: DENSE-PAC 0,5 Megabit UVEPROM DPV32X16A M I C R O S Y S T E M S DESCRIPTION: The D PV32X16A is a 40-pin Pin Grid Array PGA consisting of two 32K X 8 U VEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.
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OCR Scan
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DPV32X16A
DPV32X16A
40-pin
250ns
120ns
150ns
170ns
200ns
MEAB
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PDF
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Untitled
Abstract: No abstract text available
Text: _ ' / f ' _ DENSE-PAC 0.5 Megabit UVEPROM D P V3 2 X 16A MICROSYSTEMS DESCRIPTION: The DPV32X16A is a 40-pin Pin Grid Array PGA consisting of two 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired
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OCR Scan
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DPV32X16A
40-pin
250ns
120ns
150ns
170ns
200ns
250ns
64KXB
32KX16
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PDF
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