ebonol
Abstract: 637-10ABEP WTS001 MO-169 217-36CT6 634-20ABEP 637-15ABEP 236-150ABE-01 abe sot-223 sot-223 package dimensions
Text: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
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WTS001
p1-25
O-220,
OT-223,
SOL-20
ebonol
637-10ABEP
MO-169
217-36CT6
634-20ABEP
637-15ABEP
236-150ABE-01
abe sot-223
sot-223 package dimensions
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Untitled
Abstract: No abstract text available
Text: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
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WTS001
p1-25
O-220,
OT-223,
SOL-20
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY MULTILAYER CERAMIC CHIP CAPACITORS RESISTORS MCAPS & COILS MDELAY LINES +-5-41-5 L T t FEATURES H Miniature size H Wide range of capacitance, tolerance, TC, and voltage H High reliability, long life H Excellent frequency response H Available on 8mm and 12mm T&R
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1000pF,
000pF)
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217-36CTT6
Abstract: ebonol 217-36CT6 230-75AB-10 MO-169 204-CB 260-6SH5B 215AP 627 Series 260-4T5
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
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O-220,
OT-223,
SOL-20
217-36CTT6
ebonol
217-36CT6
230-75AB-10
MO-169
204-CB
260-6SH5B
215AP
627 Series
260-4T5
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ebonol
Abstract: 260-4TH5B ebonol c black 205cb AB-275 204-CB TUBE 1625 5 lead dd pak weight 260-6SH5B 205-CB
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
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O-220,
OT-223,
SOL-20
ebonol
260-4TH5B
ebonol c black
205cb
AB-275
204-CB
TUBE 1625
5 lead dd pak weight
260-6SH5B
205-CB
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UL1015 awg12
Abstract: ac 680 DF22A-1416SC AWG10 AWG12 AWG14 AWG16 DF22 "1015 AWG 12"
Text: NEW 7.92 mm Contact Pitch, High-Current Connectors for Internal Power Supplies UL, C-UL and TÜV Listed DF22 Series Complete Locking Function Completely enclosed locking system Protection from shorts circuits between adjacent Contacts •Features 1. 30 A maximum current
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DF22-1416SC
DF22A-1416SC
DF22A-1012SC
DF22-1416PC
DF22A-1416PC
UL1015 awg12
ac 680
AWG10
AWG12
AWG14
AWG16
DF22
"1015 AWG 12"
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550028
Abstract: No abstract text available
Text: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
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E52653
Abstract: R9950703 AWG10 AWG12 AWG14 AWG16 DF22 connector dep series 1155 socket
Text: NEW 7.92 mm Contact Pitch, High-Current Connectors for Internal Power Supplies UL, C-UL and TÜV Listed DF22 Series Complete Locking Function Completely enclosed locking system Protection from shorts circuits between adjacent Contacts •Features 1. 30 A maximum current
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DF22R-1S-7
DF22R-2S-7
DF22R-3S-7
DF22R-4S-7
DF22R-5S-7
DF22L-1S-7
DF22L-2S-7
DF22L-3S-7
DF22L-4S-7
DF22L-5S-7
E52653
R9950703
AWG10
AWG12
AWG14
AWG16
DF22
connector dep series
1155 socket
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AWG10
Abstract: AWG12 AWG14 AWG16 B107 DF22 UL1430 DF22-1416SCF
Text: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
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DF22-1EP-7.92C
Abstract: UL1015 awg10 AWG10 AWG12 AWG14 AWG16 DF22 DF22-3S-7
Text: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
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DF22-1416SC
DF22A-1416SC
DF22A-1012SC
DF22-1416PC
DF22A-1416PC
DF22-1EP-7.92C
UL1015 awg10
AWG10
AWG12
AWG14
AWG16
DF22
DF22-3S-7
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637-10ABEP
Abstract: 677-15ABEP 677-20ABEP 657-10ABEPN 657-10ABEP 657-20ABEPSC do-5 package MATERIAL 667-15ABESP weight TO66 66720
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 634 SERIES Slim Profile Unidirectional Fin Vertical Mount Heat Sink Standard P/N Without Pin Plain Pin 634-10AB 634-10ABEP 634-15AB 634-15ABEP 634-20AB 634-20ABEP Material: Aluminum, Black Anodized.
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O-220
O-218
634-10AB
634-10ABEP
634-15AB
634-15ABEP
634-20AB
634-20ABEP
O-218
637-10ABEP
677-15ABEP
677-20ABEP
657-10ABEPN
657-10ABEP
657-20ABEPSC
do-5 package MATERIAL
667-15ABESP
weight TO66
66720
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AWG10
Abstract: AWG12 AWG14 AWG16 DF22 UL1015 awg10
Text: NEW 7.92 mm Contact Pitch, High-Current Connectors for Internal Power Supplies UL, C-UL and TÜV Listed DF22 Series Complete Locking Function Completely enclosed locking system Protection from shorts circuits between adjacent Contacts •Features 1. 30 A maximum current
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DF22-1416SC
DF22A-1416SC
DF22A-1012SC
DF22-1416PC
DF22A-1416PC
AWG10
AWG12
AWG14
AWG16
DF22
UL1015 awg10
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1-534-24
Abstract: 221-233 R50-821
Text: MULTILAYER CERAMIC CHIP CAPACITORS RESISTORS MCAPS & COILS MDELAY LINES +-5-41-5 L T t FEATURES H Miniature size H Wide range of capacitance, tolerance, TC, and voltage H High reliability, long life H Excellent frequency response H Available on 8mm and 12mm T&R
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1000pF,
000pF)
1-534-24
221-233
R50-821
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UL1015 awg16
Abstract: AWG10 AWG12 AWG14 AWG16 DF22 ul1430
Text: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. 7.92 mm Contact Pitch, High-Current Connectors for Internal Power Supplies UL, C-UL and TÜV Listed
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coshh
Abstract: solid solubility 680102 fume smoke MS24 MS25 solder coshh assessment
Text: EXTRUDED SOLDER BAR Health and Safety Data Sheet 1. Identification of Substance/Preparation and of the Supplier Description : CEL extruded solder bar, 60/40 and 63/37 alloy containing lead. Part No./Code : 60/40 Alloy CEL Part No. Anglia Order Code 500g 45A501B
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45A501B
45A501A
45A102C
45B501B
45B501A
45B102C
91/155/EEC,
93/112/EEC)
coshh
solid solubility
680102
fume smoke
MS24
MS25
solder coshh assessment
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BMS13-78
Abstract: BMS13 408-7424 68011-1 68008-1 58422-1 Terminal crimping training crimping die 448044 BMS-1378
Text: Instruction Sheet Crimping Die Assemblies for COPALUM* Sealed Terminals and Splices 2. DESCRIPTION Nest Stationary Die 408-2281 21 NOV 08 Rev W (Figure 1) The die assemblies consist of stationary dies (nests) and moving dies (anvils). Refer to Figure 2 to ensure
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CM-105
Abstract: AP109A-DF22A-1416 CL680 AWG10 AWG12 AWG14 AWG16 DF22 UL1430
Text: NEW 7.92 mm Contact Pitch, High-Current Connectors for Internal Power Supplies UL, C-UL and TÜV Listed DF22 Series Complete Locking Function Completely enclosed locking system Protection from shorts circuits between adjacent Contacts •Features 1. 30 A maximum current
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DF22-1416SC
DF22A-1416SC
DF22A-1012SC
DF22-1416PC
DF22A-1416PC
CM-105
AP109A-DF22A-1416
CL680
AWG10
AWG12
AWG14
AWG16
DF22
UL1430
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E52653
Abstract: UL1015 awg10 UL1015 awg12 DF222 connector dep series
Text: •Right angle header A B C 9.45 12.2 P=7.92 3.5 15.2 0.8 9 17.6 24 1.6 Ø1.5 Contact No.1 A 5 Cavity No. No. of contacts indicator 3.7 5 1.2 Standard Type Guide Key: Inside, Color: Natural Beige Part Number CL No. Number of contacts A DF22-2P-7.92DS DF22-3P-7.92DS
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DF22-2P-7
DF22-3P-7
DF22-4P-7
DF22-5P-7
DF22R-2P-7
DF22R-3P-7
DF22R-4P-7
DF22R-5P-7
E52653
UL1015 awg10
UL1015 awg12
DF222
connector dep series
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EN29453
Abstract: 680102 68010 183C
Text: SOLDERING WAVE / FLOW SOLID SOLDER BARS EXTRUDED SOLDER Solid bars of high purity extruded solder, each polythene protected, with a choice of tin/lead alloy composition. Suitable for soldering machines, baths and pots. Available in 500g or 1kg bars. ◆ High purity extruded solder made from virgin
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45A50ns.
45A501A
45A102C
EN29453,
45B501A
45B102C
EN29453
680102
68010
183C
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680-125220
Abstract: TO-220 footprint Heat Sinks 680-5K 680-125A 680-Series TO66 PLASTIC package 6903b 6805A
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 690 SERIES HIghest Efficiency/Lowest Unit Cost Heat Sinks Height Above PC Board in. mm Standard P/N Thermal Performance at Typical Load Natural Forced Convection Convection Outline Dimensions
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690-3B
690-66B
690-220B
O-220
types00
O-220
680-5K)
680-125220
TO-220 footprint
Heat Sinks
680-5K
680-125A
680-Series
TO66 PLASTIC package
6903b
6805A
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221-233
Abstract: No abstract text available
Text: MULTILAYER CERAMIC CHIP CAPACITORS RESISTORS MCAPS & COILS MDELAY LINES +-5-41-5 L T t FEATURES H Miniature size H Wide range of capacitance, tolerance, TC, and voltage H High reliability, long life H Excellent frequency response H Available on 8mm and 12mm T&R
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CE1206
1000pF,
000pF)
221-233
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ebonol
Abstract: abe sot-223 217-36CTRE6 217-36CT6 MO-169
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
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Original
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O-220,
OT-223,
SOL-20
ebonol
abe sot-223
217-36CTRE6
217-36CT6
MO-169
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680-125220
Abstract: 603K 637-10ABP 637-15ABP 680-5K 657-10ABPSC 627-15ABP 635-75B2
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 634 SERIES Slim Profile Unidirectional Fin Vertical Mount Heat Sink Standard P/N Plain Pin Without Pin 634-10ABP ̆ 634-10AB 634-15ABP 634-15AB 634-20ABP ̆ 634-20AB Material: Aluminum, Black Anodized.
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634-10ABP
634-10AB
634-15ABP
634-15AB
634-20ABP
634-20AB
O-220
O-218
O-218
680-125220
603K
637-10ABP
637-15ABP
680-5K
657-10ABPSC
627-15ABP
635-75B2
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Untitled
Abstract: No abstract text available
Text: Value Code Inductor ph Code ph Code .01 .012 .015 .018 000 Oil 001 009 .022 dF H I 010 012 015 018 002 .10 .12 .15 .18 .22 .027 007 .27 027 .033 003 - - - * .039 - .047 - - - - 009 - 004 - - .33 - - - 033 - 039 .47 047 - - .056 005 .56 056 .068 006 .68 068
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