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    Catalog Datasheet MFG & Type Document Tags PDF

    MO-195

    Abstract: sot747
    Text: PDF: 2002 Jan 15 Philips Semiconductors Package outline TFBGA72: plastic thin fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.7 mm D SOT747-1 A B ball A1 index area E A A2 A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C L K J H G F E D C B A


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    TFBGA72: OT747-1 FBGA72: MO-195 MO-195 sot747 PDF

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA72 package SOT761-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


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    TFBGA72 OT761-1 OT761-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA72 package SOT747-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


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    TFBGA72 OT747-1 OT747-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline TFBGA72: plastic thin fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.7 mm D SOT747-1 A B ball A1 index area E A A2 A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C L K J H G F E D C B A e e2 ball A1 index area X 1 2 3 4 5 6 7 8 9 10 11


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    TFBGA72: OT747-1 MO-195 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline TFBGA72: plastic thin fine-pitch ball grid array package; 72 balls; body 6 x 6 x 0.8 mm D SOT761-1 A B ball A1 index area A E A2 A1 detail X C e1 e 1/2 e y y1 C ∅v M C A B b ∅w M C K J H e G F e2 E 1/2 e D C B A ball A1 index area 1 2 3


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    TFBGA72: OT761-1 MO-195 PDF

    MO-195

    Abstract: sot761
    Text: PDF: 2002 Apr 11 Philips Semiconductors Package outline TFBGA72: plastic thin fine-pitch ball grid array package; 72 balls; body 6 x 6 x 0.8 mm D SOT761-1 A B ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M C A B b y y1 C ∅w M C K J H e G F e2


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    TFBGA72: OT761-1 MO-195 MO-195 sot761 PDF

    SC28L198

    Abstract: SCC2691AC1A28 LCD 09151 CSOT109 PCA9552 PCK2002 PCF8591 APPLICATION pecl clock so8 PCA9550 PCA9553
    Text: Interface Products Interface Products 67 I2C Logic Family Overview • Analog/Digital Converters It is frequency required to record analog information, such as temperature, pressure, battery level, signal strength, etc. The analog voltage information from the diode, pressure sensor,


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    dh14

    Abstract: CBTV4020EE JESD22-A114 JESD22-A115 JESD78 F DH13
    Text: INTEGRATED CIRCUITS CBTV4020 20-bit DDR SDRAM 2:1 mux Product data Philips Semiconductors 2002 Sep 27 Philips Semiconductors Product data 20-bit DDR SDRAM 2:1mux CBTV4020 FEATURES DESCRIPTION • SEL signal is SSTL_2 compatible • Optimized for use in Double Data Rate DDR SDRAM


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    CBTV4020 20-bit dh14 CBTV4020EE JESD22-A114 JESD22-A115 JESD78 F DH13 PDF

    dh14

    Abstract: Transistors Diodes smd dh18 Transistors smd dh10 JESD22-A114 JESD22-A115 JESD78
    Text: CBTV4020 20-bit DDR SDRAM 2 : 1 MUX Rev. 03 — 4 April 2008 Product data sheet 1. General description This 20-bit bus switch is designed for 2.3 V to 2.7 V VDD operation and SSTL_2 select input levels. Each host port pin is multiplexed to one of two DIMM port pins. When the SEL pin is HIGH


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    CBTV4020 20-bit CBTV4020 dh14 Transistors Diodes smd dh18 Transistors smd dh10 JESD22-A114 JESD22-A115 JESD78 PDF

    DDR2 SSTL class

    Abstract: SSTL_18 DDR1-400 DDR2 SDRAM with SSTL_18 interface TVSOP-48 SSTL-18 PCK2059 SSTV16857 DDR200 hp SSTU32866
    Text: Memory interfaces Support logic for memory modules and other memory subsystems Portfolio overview PC100 to PC133 • AVC, ALVC, AVCM, and ALVCH series registered drivers • PCK2509 and PCK2510 series PLL clock buffers DDR200 to DDR266 • SSTV and SSTL series registered drivers


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    PC100 PC133 PCK2509 PCK2510 DDR200 DDR266 DDR333 DDR400 PCKVF857 DDR2-400 DDR2 SSTL class SSTL_18 DDR1-400 DDR2 SDRAM with SSTL_18 interface TVSOP-48 SSTL-18 PCK2059 SSTV16857 hp SSTU32866 PDF

    74hc273

    Abstract: 74hct273 74HCT390 3Gxxx hef4750 hef4066 toshiba datecode 74HC4520 dual sot363 marking code dp 74f3037
    Text: Logic Logic 93 5 Volt Logic Product Spectrum FEATURES AND FUNCTIONS FUNCTIONAL MATRIX • ALVT • • HEF4000 • • • • • • • • • • • HC/HCT • • • • • • • • • • • FAST • • • • • • • • • • • ABT


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    HEF4000 MB2245 16-Bit MB2543 MB2652 74hc273 74hct273 74HCT390 3Gxxx hef4750 hef4066 toshiba datecode 74HC4520 dual sot363 marking code dp 74f3037 PDF

    IC ax 2008 USB FM PLAYER

    Abstract: STi7110 IC ax 2008 used for mp3 player le88221 PI7C9X440SL PI7C9X111SL bl3458 pi3eqx6701 PI3EQX5701 PAS5201
    Text: Table of Contents PAGE 2 3 About Pericom Applications 13 Products - Signal Integrity 14 17 18 19 PCI Express ReDriver SAS/SATA/XAUI ReDriver Digital Video Signal Integrity DisplayPort, HDMI, DVI USB3 ReDriver 21 Products - Connectivity 23 25 27 33 35 45


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    smd code marking 56 sot23-6

    Abstract: marking code 604 SOT23-6 PD-1503 smd zG sot 23 smd marking sot23 W16 ic SMD MARKING CODE ad 5.9 ic ap 2068 PD2029 SMD MARKING ed sot23-5 MARKING CODE SMD IC sot23-5
    Text: PACKAGING Package Information Packaging & Ordering Packaging Solutions for Modern Electronic Design In addition to standard legacy packaging, Pericom leads the industry in smaller, more advanced packaging profiles and footprints for today’s designers. Our offerings include very small packages,


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    PI3USB412 PI74STX1GU04A PI3USBA03 PI74STX2G04 PI3USBA201 PI74STX2G14 PI5A121 PI74STX2G4245 PI5A122 smd code marking 56 sot23-6 marking code 604 SOT23-6 PD-1503 smd zG sot 23 smd marking sot23 W16 ic SMD MARKING CODE ad 5.9 ic ap 2068 PD2029 SMD MARKING ed sot23-5 MARKING CODE SMD IC sot23-5 PDF

    t06 sot23

    Abstract: TQFN-56 TQFN-64 ZL42 SC70-5 w08 SOT23-5 w08 TQFN56 TQFN-72 LQFP64 reel size ZG12
    Text: Plastic IC Package Information Tape & Reel Tape and Reel packing system protects Pericom’s products from mechanical and electrical damage and is designed for automatic pick-and-place equipment. Pericom’s tape and reel specifications are in compliance with Electronics Industries Association standards for embossed carrier taping of sur face mount components for Automatic Handling EIA-481, current


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    EIA-481, 13-inch t06 sot23 TQFN-56 TQFN-64 ZL42 SC70-5 w08 SOT23-5 w08 TQFN56 TQFN-72 LQFP64 reel size ZG12 PDF

    Untitled

    Abstract: No abstract text available
    Text: T-FBGA720-3535-0.80B5 Unit : mm T-FBGA720-3535-0.80B5 Unit o o o o o oooooo <t>o ooooo ® 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 9 1 oooooooooooooooooooo oooooooooooooooooooo® o o o o o o o o o o o oo o oo o oo o oooooooooooooooooooo® oooooooooooooooooooo


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