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    AA04A Search Results

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    AA04A Price and Stock

    Honeywell Sensing and Control GSAA04A1B

    SWITCH SNAP ACTION DPST 6A 120V
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    Newark GSAA04A1B Bulk 5
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    Carling Technologies 2FAA04-A7

    SWITCH TOGGLE SPST
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    Sager 2FAA04-A7 10
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    Honeywell Sensing and Control GLAA04A

    Limit Switches LIMIT SWITCH
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    Master Electronics GLAA04A
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    Honeywell Sensing and Control GLAA04A1B

    Limit Switches LIMIT SWITCH
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    Mouser Electronics GLAA04A1B
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    Master Electronics GLAA04A1B
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    Dwyer Instruments Inc PTGD-AA04A

    Differential Piston Gage, in-Line Connections, range 0-20 Psid. |Dwyer PTGD-AA04A
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    Newark PTGD-AA04A Bulk 1
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    RS PTGD-AA04A Bulk 1
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    AA04A Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    merlin gerin fuse

    Abstract: IR 2544S MICRO FUSE-LINKS 1608 TYPE HRC fuse gg GEC MGI1252 THERMAL Fuse m20 tf 115 c smd marking 1pn ns 1000 n merlin gerin microtemp g4a01
    Text: 2189 Technical portal and online community for Design Engineers - www.element-14.com Fuses & Circuit Breakers Page 10x35mm Fuses . . . . . . . . . . . . . . . . . . . . . . . . . . . 10x38mm Fuses . . . . . . . . . . . . . . . . . . . . . . . . . . . 14x51mm Fuses . . . . . . . . . . . . . . . . . . . . . . . . . . .


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    element-14 10x35mm 10x38mm 14x51mm 22x58mm 5x20mm 5x25mm 35x25 3x32mm merlin gerin fuse IR 2544S MICRO FUSE-LINKS 1608 TYPE HRC fuse gg GEC MGI1252 THERMAL Fuse m20 tf 115 c smd marking 1pn ns 1000 n merlin gerin microtemp g4a01 PDF

    MPC821

    Abstract: No abstract text available
    Text: MPC8BUG USER'S MANUAL MPC8BUG SOFTWARE USER'S MANUAL FOR THE MPC821ADS APRIL 27, 1996 SOURCE REVISION 0.6 1 MPC8BUG USER'S MANUAL 2 MPC8BUG USER'S MANUAL CHAPTER 1 MPC8BUG OVERVIEW 1 . 1 INTRODUCTION This document describes the monitor debugger for the Motorola MPC821 processor device. This


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    MPC821ADS MPC821 MPC821 MPC821ADS) MPC821) 0x10000. PDF

    TGI1314-50L

    Abstract: TOSHIBA HEMT
    Text: MICROWAVE POWER GaN HEMT TGI1314-50L MICROWAVE SEMICONDUCTOR TECHNICAL DATA Draft FEATURES „ HIGH POWER Pout=47.0dBm at Pin=42.0dBm „ HIGH GAIN GL=8.0dB at 13.75GHz to 14.5GHz „ BROAD BAND INTERNALLY MATCHED HEMT HERMETICALLY SEALED PACKAGE „ LOW INTERMODULATION DISTORTION


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    TGI1314-50L 75GHz -25dBc 42dBm 20dBm AA04A TGI1314-50L TOSHIBA HEMT PDF

    TGI8596-50

    Abstract: TGI8596
    Text: MICROWAVE POWER GaN HEMT TGI8596-50 MICROWAVE SEMICONDUCTOR TECHNICAL DATA FEATURES „ HIGH POWER Pout=47.0dBm at Pin=41.0dBm „ HIGH GAIN GL=9.0dB at 8.5GHz to 9.6GHz „ BROAD BAND INTERNALLY MATCHED HEMT HERMETICALLY SEALED PACKAGE RF PERFORMANCE SPECIFICATIONS Ta= 25°C


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    TGI8596-50 41dBm 20dBm AA04A TGI8596-50 TGI8596 PDF

    TGI1414-50L

    Abstract: TOSHIBA HEMT
    Text: MICROWAVE POWER GaN HEMT TGI1414-50L MICROWAVE SEMICONDUCTOR TECHNICAL DATA FEATURES „ HIGH POWER Pout=47.0dBm at Pin=42.0dBm „ HIGH GAIN GL=8.0dB at 14.0GHz to 14.5GHz „ BROAD BAND INTERNALLY MATCHED HEMT HERMETICALLY SEALED PACKAGE „ LOW INTERMODULATION DISTORTION


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    TGI1414-50L -25dBc 42dBm 20dBm AA04A TGI1414-50L TOSHIBA HEMT PDF

    Untitled

    Abstract: No abstract text available
    Text: MICROWAVE POWER GaN HEMT TGI1414-50L MICROWAVE SEMICONDUCTOR TECHNICAL DATA FEATURES „ HIGH POWER Pout=47.0dBm at Pin=42.0dBm „ HIGH GAIN GL=8.0dB at 14.0GHz to 14.5GHz „ BROAD BAND INTERNALLY MATCHED HEMT HERMETICALLY SEALED PACKAGE „ LOW INTERMODULATION DISTORTION


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    TGI1414-50L -25dBc 42dBm 20dBm AA04A PDF

    TGI7785-25L

    Abstract: No abstract text available
    Text: MICROWAVE POWER GaN HEMT TGI7785-25L MICROWAVE SEMICONDUCTOR TECHNICAL DATA FEATURES „ HIGH POWER Pout=44.5dBm at Pin=35.0dBm „ HIGH GAIN GL=12.0dB at 7.7GHz to 8.5GHz „ BROAD BAND INTERNALLY MATCHED HEMT HERMETICALLY SEALED PACKAGE „ LOW INTERMODULATION DISTORTION


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    TGI7785-25L -40dBc 20dBm AA04A TGI7785-25L PDF

    TGI1314-50L

    Abstract: No abstract text available
    Text: MICROWAVE POWER GaN HEMT TGI1314-50L MICROWAVE SEMICONDUCTOR TECHNICAL DATA Draft FEATURES „ HIGH POWER Pout=47.0dBm at Pin=42.0dBm „ HIGH GAIN GL=8.0dB at 13.75GHz to 14.5GHz „ BROAD BAND INTERNALLY MATCHED HEMT HERMETICALLY SEALED PACKAGE „ LOW INTERMODULATION DISTORTION


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    TGI1314-50L 75GHz -25dBc 42dBm 20dBm AA04A TGI1314-50L PDF

    TGI1414-50L

    Abstract: No abstract text available
    Text: MICROWAVE POWER GaN HEMT TGI1414-50L MICROWAVE SEMICONDUCTOR TECHNICAL DATA Preliminary FEATURES „ HIGH POWER Pout=47.0dBm at Pin=42.0dBm „ HIGH GAIN GL=8.0dB at 14.0GHz to 14.5GHz „ BROAD BAND INTERNALLY MATCHED HEMT HERMETICALLY SEALED PACKAGE „ LOW INTERMODULATION DISTORTION


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    TGI1414-50L -25dBc 42dBm 20dBm AA04A TGI1414-50L PDF

    MPC860

    Abstract: MPC8Bug
    Text: MPC8BUG USER'S MANUAL JANUARY 1998 TABLE OF CONTENTS Paragraph Title Page Section 1 MPC8BUG Overview 1.1 Introduction . 5 1.2 Features . 5


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    MPC860 0x10000. MPC8Bug PDF

    TGI7785-50L

    Abstract: No abstract text available
    Text: MICROWAVE POWER GaN HEMT TGI7785-50L MICROWAVE SEMICONDUCTOR TECHNICAL DATA FEATURES „ HIGH POWER Pout=47.0dBm at Pin=40.0dBm „ HIGH GAIN GL=11.0dB at 7.7GHz to 8.5GHz „ BROAD BAND INTERNALLY MATCHED HEMT HERMETICALLY SEALED PACKAGE „ LOW INTERMODULATION DISTORTION


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    TGI7785-50L -40dBc 40dBm 20dBm AA04A TGI7785-50L PDF

    TGI0910-50

    Abstract: No abstract text available
    Text: MICROWAVE POWER GaN HEMT TGI0910-50 MICROWAVE SEMICONDUCTOR TECHNICAL DATA FEATURES „ HIGH POWER Pout=47.0dBm at Pin=41.0dBm „ HIGH GAIN GL=9.0dB at 9.5GHz to 10.5GHz „ BROAD BAND INTERNALLY MATCHED HEMT HERMETICALLY SEALED PACKAGE RF PERFORMANCE SPECIFICATIONS Ta= 25°C


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    TGI0910-50 41dBm 20dBm AA04A TGI0910-50 PDF

    MPC801

    Abstract: MPC821 MPC823 MPC850 MPC860 MPC860SAR 4000 SERIES MOTOROLA MPC8Bug
    Text: 1.1 1.2 2.1 2.2 3.1 3.2 3.3 4.1 4.1.1 4.1.2 Section 1 MPC8xx MPC8BUG Overview Introduction . 3 Features . 3


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    0x10000. MPC801 MPC821 MPC823 MPC850 MPC860 MPC860SAR 4000 SERIES MOTOROLA MPC8Bug PDF

    TGI1414-50L

    Abstract: TOSHIBA HEMT 1.5
    Text: MICROWAVE POWER GaN HEMT TGI1414-50L MICROWAVE SEMICONDUCTOR TECHNICAL DATA Preliminary FEATURES „ HIGH POWER Pout=47.0dBm at Pin=42.0dBm „ HIGH GAIN GL=8.0dB at 14.0GHz to 14.5GHz „ BROAD BAND INTERNALLY MATCHED HEMT HERMETICALLY SEALED PACKAGE „ LOW INTERMODULATION DISTORTION


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    TGI1414-50L -25dBc 42dBm 20dBm AA04A TGI1414-50L TOSHIBA HEMT 1.5 PDF

    TGI8596-50

    Abstract: TOSHIBA HEMT 41dBm
    Text: MICROWAVE POWER GaN HEMT TGI8596-50 MICROWAVE SEMICONDUCTOR TECHNICAL DATA Preliminary FEATURES „ HIGH POWER Pout=47.0dBm at Pin=41.0dBm „ HIGH GAIN GL=9.0dB at 8.5GHz to 9.6GHz „ BROAD BAND INTERNALLY MATCHED HEMT HERMETICALLY SEALED PACKAGE RF PERFORMANCE SPECIFICATIONS Ta= 25°C


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    TGI8596-50 41dBm AA04A TGI8596-50 TOSHIBA HEMT 41dBm PDF

    MPC860

    Abstract: 860ADS
    Text: MPC8BUG USER'S MANUAL MPC8BUG USER'S MANUAL APRIL 27, 1996 REVISION 0.6 1 MPC8BUG USER'S MANUAL CHAPTER 1 MPC8BUG OVERVIEW 1 . 1 INTRODUCTION This document describes the monitor debugger for the Motorola MPC860 PowerQUICC processor device. This debugger runs on a host machince such as an IBM-PC or Sun and controls the


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    MPC860 860ADS) MPC860) 0x10000. 860ADS PDF