G12-l
Abstract: LSI Logic ASIC g12 High Voltage G12L g12 transistor G12 000
Text: G12 ASIC Cell-Based Product Features/ Benefits Twelfth Generation ASIC Technology • ASIC technology with 0.18 micron L-drawn Overview LSI Logic’s G12 ASIC Cell-Based product, with its three digital libraries, offers unprecedented options for system ASIC designers to optimize their ASIC or
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18-micron
13-micron
B20023
G12-l
LSI Logic ASIC g12
High Voltage G12L
g12 transistor
G12 000
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transistor P2P
Abstract: FCBGA-896 LSI Rapidchip DDR PHY ASIC epbga ARM926 RC1812 RC1832 RC1840 RC1845
Text: RapidChip Foundation Platform ASIC The Cornerstone of Platform ASICs OVERVIEW FEATURES High performance Platform ASIC The RapidChip Foundation Platform ASIC IP-rich slices are designed for a broad range of applications. The RapidChip™ Foundation Platform ASIC family delivers
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B20041
transistor P2P
FCBGA-896
LSI Rapidchip
DDR PHY ASIC
epbga
ARM926
RC1812
RC1832
RC1840
RC1845
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250 mhz IBM PowerPC Processor
Abstract: IBM PCI Express serdes architecture ibm ASIC SRAM SA-12E IBM ASIC Products ibm ip IBM supports ccga 0.25-um standard cell library IBM ASIC
Text: Standard cell/gate array ASIC for mainstream and cost-sensitive applications SA-12E ASIC Highlights Integration and performance deliver exceptional value. The IBM SA-12E ASIC is a standard 0.25-µm process technology cell and gate array ASIC, featuring a
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SA-12E
SA14-2173-03
250 mhz IBM PowerPC Processor
IBM PCI Express serdes architecture
ibm ASIC SRAM
IBM ASIC Products
ibm ip
IBM supports ccga
0.25-um standard cell library
IBM ASIC
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Untitled
Abstract: No abstract text available
Text: HES-7 ASIC Prototyping HES-7™ ASIC Prototyping Platform Scalable, Flexible Solution Wi-Fi FPGA2 Bluetooth HDMI Mother Board FPGA1 up to 24m ASIC gates CONNECTOR HES-7™ provides SoC/ASIC hardware verification and software validation teams with a scalable and high quality FPGA-based
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2000T
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82C55
Abstract: SCXI-1140 PCI-6111E NEC 82c55 "Hot Plug and Play"
Text: E Series Overview E Series Overview E Series Multifunction I/O Products Unique Components NI-DAQ Software NI-PGIA Instrumentation Amplifier DAQ-STC Counter/Timer ASIC RTSI Synchronization Bus MITE PCI Bus Master ASIC DAQ-PnP ISA Plug and Play ASIC Windows NT/95/3.1
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NT/95/3
82C55
SCXI-1140
PCI-6111E
NEC 82c55
"Hot Plug and Play"
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io64
Abstract: MHz frequency counter
Text: E Series Technology and Product Overview Unique Components RTSI MITE NI-PGIA DAQ-STC RTSI MITE DAQ-PnP instrumentation amplifier advanced counter/timer ASIC synchronization bus PCI bus master interface ASIC ISA Plug and Play ASIC Common Features DAQ-STC NI-DAQ Software
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AMUX-64T
io64
MHz frequency counter
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LCA500K
Abstract: LSI LOGIC Oak Frequency Control Transistors alternatives scan TTL johnson ring counter LCA50 logic diagram of johnson and ring counter
Text: An ASIC Primer Table of Contents Preface - Preface .0-1 Chapter 1 - What is an ASIC? .1-1 Section 1 - Uses of ASICs .1-1
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PSS-04-103
Abstract: saab space packet wire TME 87 PSS-04-151 P-ASIC-NOT-00122-SE PSS-04-106 K1784 TME 57 PSS-04-107 SAAB
Text: Saab Space AB Dokument ID Document ID Frisläppt datum Date Released Utgåva Issue Informationsklass Classification P-ASIC-NOT-00122-SE 2007-04-23 12 Company Restricted Sida Page 2 SUMMARY The SCTMTC ASIC User's Manual defines how the SCTMTC ASIC is to be used.
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P-ASIC-NOT-00122-SE
ESA/C/290,
PSS-04-103
saab space packet wire
TME 87
PSS-04-151
P-ASIC-NOT-00122-SE
PSS-04-106
K1784
TME 57
PSS-04-107
SAAB
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SA-27E
Abstract: IBM PCI Express serdes architecture
Text: Standard cell/gate array ASIC for mainstream and cost-sensitive applications requiring fast time-to-market SA-27E ASIC Highlights Integration and performance deliver exceptional value. The IBM SA-27E ASIC is a dense, • Gate delay: 33 picoseconds
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SA-27E
SA14-2183-03
IBM PCI Express serdes architecture
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lvds to eDP
Abstract: qpsk implementation using verilog EDA 2500 manual LSI gigablaze "ASIC Products Databook" vhdl code hamming oak dsp EDP LVDS BZ75 LSI Logic EPBGA
Text: G10 -p Deep Submicron ASIC Technology Datasheet The G10-p cell-based CMOS ASIC technology is the highest performance, highest density 3.3 V product in LSI Logic’s portfolio, and supports consumer, computer, and communications applications. The G10-p ASIC product combined with specialized cores enable optimized
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G10TM-p
G10-p
35-micron
lvds to eDP
qpsk implementation using verilog
EDA 2500 manual
LSI gigablaze
"ASIC Products Databook"
vhdl code hamming
oak dsp
EDP LVDS
BZ75
LSI Logic EPBGA
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actel PLL schematic
Abstract: 624 CCGA hardness tester radhard overview HX2000 RH1020 RH1280 XC8100 624-CCGA 256-CQFP
Text: Semicustom Products FPGA to ASIC Conversions Fact Sheet July 2010 OVERVIEW Aeroflex Colorado Springs has over 20 years experience in converting FPGA and 3rd-party ASIC netlists into Aeroflex RadHard and non-RadHard ASICs. We maintain a growing database of FPGA and 3rd-party ASIC cell libraries used for conversion, and
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RH1020,
RH1280,
RT54SX32S/72S,
RTAX250S/1000S/2000S
XC2/3/4000,
XC8100,
EMP5/7000
HR2/3000,
HX2000
actel PLL schematic
624 CCGA
hardness tester
radhard overview
HX2000
RH1020
RH1280
XC8100
624-CCGA
256-CQFP
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OC-3c
Abstract: RFC-826 chorus 3 processor ENT3003 ICMP messages Ternary CAM "OSPF"
Text: CONFIDENTAIL Chorus - ENT3003 Wire-Speed Packet Forwarding ASIC for Access Aggregation Routers Product Brief, version 1.4 Chorus ENT3003 Product Brief Wire-Speed Packet Forwarding ASIC for Access Aggregation Routers Description Features and Architecture
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ENT3003
ENT3003)
OC-3c
RFC-826
chorus 3 processor
ENT3003
ICMP messages
Ternary CAM
"OSPF"
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RFC-826
Abstract: ip dslam ENT3041
Text: CONFIDENTAIL Solo - ENT3041 Wire-Speed Packet Forwarding ASIC for Enterprise Networks Product Brief, version 1.4 Solo ENT3041 Product Brief Wire-Speed Packet Forwarding ASIC for Enterprise Networks Description Features and Architecture Features • • •
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ENT3041
ENT3041)
RFC-826
ip dslam
ENT3041
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Untitled
Abstract: No abstract text available
Text: Cover Story Senior Vice President, Synopsys Inc. Leveraging ASIC Expertise for Platform FPGAs As Platform FPGAs encroach into ASIC territory, the need for ever more complex synthesis tools and strategic alliances with industryleading EDA vendors becomes essential.
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MPC601
Abstract: MC6800 MC68000 MC68020 MPC7455 MPC860 MC603 90-nm CMOS standard cell library process technology 65-nm CMOS standard cell library process technology
Text: Freescale Semiconductor ASIC Solutions Scalability Meets Flexibility. Flexible Customer Engagement Model A hallmark of Freescale’s ASIC capability is our flexible customer engagement model and design flow. We support the use of industry-standard tools for conformance with customer
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MPC601,
MPC860
MPC7455
BR1587
MPC601
MC6800
MC68000
MC68020
MC603
90-nm CMOS standard cell library process technology
65-nm CMOS standard cell library process technology
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Untitled
Abstract: No abstract text available
Text: Perspective Industry Trend Platform FPGAs Take on ASIC SOCs Here are seven good reasons why Platform FPGAs provide a superior design environment and faster time to market than ASIC SOCs. by Milan Saini Technical Marketing Manager, Alliance Software Marketing
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actel a40mx02
Abstract: A40MX04 ProASICPLUS Flash Family FPGAs v2.0
Text: v2.0 MX Automotive Family FPGAs Features Ease of Integration • Single-Chip ASIC Alternative for Automotive Applications • Synthesis-Friendly Architecture Supports ASIC Design Methodologies • 3,000 to 54,000 System Gates • Up to 100% Resource Utilization and 100% Pin Fixing
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gp-ib cable
Abstract: NAT4882 PD7210 NI-488 IBM POS Turbo488
Text: GPIB Interfaces for IBM Computers and Workstations MC-GPIB, GPIB-RS/6000 MC-GPIB, GPIB-RS/6000 NAT4882 ASIC Completely IEEE 488.2 compatible Compatible with NEC µPD7210 controller chip Additional features reduce software overhead Turbo488 ASIC FIFO buffers for decoupling GPIB
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GPIB-RS/6000
NAT4882
PD7210
Turbo488
16-bit
NI-488
24-pin
gp-ib cable
PD7210
IBM POS
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Heimann lhi 958
Abstract: LHi 954 heimann pir sensor free schematic diagram LHi 954 trigger coil heimann SF389 passive infra red Heimann LHi 954 HEIMANN trigger coil LHi 954 heimann circuit test
Text: SF389 PASSIVE INFRA-RED ALARM The SF389 is a CMOS, mixed signal ASIC designed for PIR motion detection and similar alarm applications. The ASIC interfaces directly between a Pyroelectric Infrared PIR sensor and control panel using a normally closed, low
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SF389
SF389
SF389H
Heimann lhi 958
LHi 954 heimann
pir sensor free schematic diagram
LHi 954
trigger coil heimann
passive infra red
Heimann LHi 954
HEIMANN trigger coil
LHi 954 heimann circuit test
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ibm ASIC SRAM
Abstract: IBM "embedded dram" IBM supports ccga
Text: Standard cell/gate array ASIC for high-function, high-density applications Blue Logic Cu-11 ASIC Highlights 0.11-µm L drawn enables designs of up to 40 million gates Advanced technologies include copper metallurgy and low-k dielectric Choice of packaging options
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Cu-11
07SA14245100*
SA14-2451-00
ibm ASIC SRAM
IBM "embedded dram"
IBM supports ccga
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80C51
Abstract: TMS320C50 scl* by national TMS320C50 architecture
Text: N Customizable Solutions – ASIC N Customizable Solutions – ASIC Table of Contents National Semiconductor offers customizable “systems-on-a-chip” solutions to all process flows and extensive packaging options. A unique competency-based alliance with Cadence Design Systems and Aspec Technology
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verilog code for spi4.2 to fifo
Abstract: verilog code for spi4.2 interface LFSC25 qdr2 sram DDR2 routing Tree LFSC115 R28C9A Signal Path Designer RLDRAM
Text: DELIVERING FPGA-BASED PRE-ENGINEERED IP USING STRUCTURED ASIC TECHNOLOGY A Lattice Semiconductor White Paper February 2006 Lattice Semiconductor 5555 Northeast Moore Ct. Hillsboro, Oregon 97124 USA Telephone: 503 268-8000 www.latticesemi.com 1 Delivering FPGA Based Pre-Engineered IP Using Structured ASIC Technology
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700Mhz
verilog code for spi4.2 to fifo
verilog code for spi4.2 interface
LFSC25
qdr2 sram
DDR2 routing Tree
LFSC115
R28C9A
Signal Path Designer
RLDRAM
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Dupont 9476
Abstract: No abstract text available
Text: ASIC FLIP CHIPS Application Note ASIC Flip Chips: Manufacture and Use By Barbara L. Gibson, Applications Engineer plastic encapsulated device: wire bonds and wire damage during assembly, are avoided. By attaching directly to the substrate without being mounted on a lead frame or
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