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Catalog Datasheet	MFG & Type	PDF	Document Tags
dallas date code ds1230 Abstract: 25091 e8 sot223 24446 Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 JUN '99 24325 9915 ATP Anam, PI DK815282AAB SOIC 50 47 DS1869 A3 SEP '99 24445 9907 NSEB DJ824247ABA SOIC	Original	PDF	DS1621 DS1869 DK815282AAB DJ824247ABA DM846764AA DS2502 DS87C520 DN901118AAB DK935356AAB dallas date code ds1230 25091 e8 sot223 24446
Hyundai 9944 Abstract: nseb ds1000m-100 DS2165Q Text: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CODE LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 DIP 300 CPS ChipPac, C 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7	Original	PDF	DS1000M-100 DS1000 DH927108AJC DS87C520 DN901118AAB Hyundai 9944 nseb DS2165Q
DS1233 a5 Abstract: e8 sot223 9915 dallas 25010 DN819 densit DS1232L ds1232l datasheet DS1869 DK815282AAB Text: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY DATE PRODUCT REV JOB NO CODE FACILITY LOT NO. DS1621 A7 JUN '99 24325 9915 ATP Anam, PI DK815282AAB SOIC 50 45 DS1621 A7 SEP '99 24466 9930 ATP (Anam, PI) DK906731AAC SOIC	Original	PDF	DS1621 DK815282AAB DK906731AAC DS1869 DJ821534ABB DJ824252AAC DJ824247ABA DS1233 a5 e8 sot223 9915 dallas 25010 DN819 densit DS1232L ds1232l datasheet DS1869
Untitled Abstract: No abstract text available Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY READ POINT QTY FAILS LOT NO. PACKAGE DS2502 C3 MAR '00 25253 0005 Carsem S DM941226AA	Original	PDF	DM941226AA DM941230AG DS2502 DM941230AG DM941226AA
DN901118AAB Abstract: c5 99 sot223 dk91 Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C2 JUN '99 24169 9915 Carsem S DM846764AA	Original	PDF	DM846764AA DM849359AC DS2502 DM849359AC DN901118AAB c5 99 sot223 dk91
DS-1000 Abstract: DS1302 DIE REVISION DH020 ds1000m-100 25409 Text: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 300 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 PDIP CPS ChipPac, China 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%	Original	PDF	DS1000M-100 DS1000 DH927108AJC J-STD-020 30C/60% DS-1000 DS1302 DIE REVISION DH020 25409
dallas date code ds1230 Abstract: dallas date code dallas ds1230 code 25807 Text: RELIABILITY MONITOR STRESS: VAPOR PHASE REFLOW CONDITIONS: 217C MONITOR DATE ASSEMBLY DATE PRODUCT REV JOB NO CODE FACILITY LOT NO. DS5002 C4 PACKAGE READ POINT QTY FAIL APR '00 25428 0004 Carsem DM925587AAF MQFP 3 203 DS87C520 A14 NOV '99 24798 9931 ATK Anam, K	Original	PDF	DS5002 DS87C520 DM925587AAF DN901118AAB DK935356AAB J-STD-020 DM929359AB DS1232 DS1233 dallas date code ds1230 dallas date code dallas ds1230 code 25807
74 HTC 00 Abstract: 74 HTC 08 DS1302 DIE REVISION Hyundai 9944 Text: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 300 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 PDIP CPS ChipPac, China 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%	Original	PDF	DS1000M-100 DS1000 DH927108AJC DK935356AAB J-STD-020 30C/60% 74 HTC 00 74 HTC 08 DS1302 DIE REVISION Hyundai 9944
218E-08 Abstract: ti 9919 Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY READ POINT QTY FAILS LOT NO. PACKAGE DS2502 C2 MAR '99 24153 9913 Carsem S DM842206AL	Original	PDF	DM842206AL DM846764AA DS2502 DM846764AA DM842206AL 218E-08 ti 9919