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    FBGA10 Search Results

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    FDI Future Designs Inc SAB-TFBGA100

    BOARD SCKT ADAPTER FOR TFBGA100
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    DigiKey SAB-TFBGA100 Box 10
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    Avnet Americas SAB-TFBGA100 Box 2
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    FBGA10 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    fBGA package tray 12

    Abstract: JEDEC TRAY DIMENSIONS FBGA JEDEC FBGA 236-PIN fBGA package tray FBGA-10 FBGA10 236PIN 277-PIN
    Text: TRAY CONTAINER NEC A' 10.65 7 135°C MAX. 12.80 A FBGA10x10ESP 10.35 135.9 115.2 PPE 10×24=240 UNIT : mm 10.65 12.80 10.30 294.4 315.0 322.6 SECTION A – A' 10.65 (5.95) (5.62) 7.62 10.00 Applied Package Quantity (pcs) FBGA10×10 ESP Tray 113-pin Plastic FBGA (10×10)


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    FBGA10 10ESP 113-pin 161-pin 236-pin 277-pin 289-pin SSD-A-H6961-4 fBGA package tray 12 JEDEC TRAY DIMENSIONS FBGA JEDEC FBGA fBGA package tray FBGA-10 236PIN PDF

    clc014aje

    Abstract: LMV8244 Video sync splitter lm DS34C86 LMH0074SQ DS8921 HV servo thermopile array 2N3960 DP838640 DS8921 equivalent
    Text: Analog Design Guide for Xilinx FPGAs www.national.com/xilinx 2008 Vol. 1 Analog Solutions for FPGAs .2 Design Tools .3 PowerWise Solutions . 4-5 Data Conversion . 6-12 Amplifiers. 13-23


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    HDMI TO VGA MONITOR PINOUT

    Abstract: SEMINAR ON 4G TECHNOLOGY GSM BTS antenna sot23-5 code BBB GSM repeater HDMI to vga pinout microwave products HSPA Module LM5070 12v output DS90LV804TSQ
    Text: Wireless Infrastructure 2G/3G/4G Base Station Solutions Guide 2008 Vol. 1 1Q 2008 High-Speed Data Converters . 4-6 Low-Power Data Converters and Temperature Sensors . 7-8 RF Detectors and High-Speed Comparators.9 Precision and


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    taiyo PSR4000

    Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5
    Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2


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    NAND FLASH BGA

    Abstract: BGA NAND Flash BGA PACKAGE thermal profile BGA-56P-M01 MCP NAND FBGA56 FBGA69 32M X 32 MEMORY FLASH BGA FBGA71
    Text: Stacked MCP Stacked Multi-Chip Package Stacked MCP is one of the most suitable chip scale packages for wireless applications. Its advantage is the compact stacked chip configuration. In the Flash memory and SRAM configuration, the pin layout can accomodate a 128 MB combination.Typical package construction


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    FBGA69) IR250 NAND FLASH BGA BGA NAND Flash BGA PACKAGE thermal profile BGA-56P-M01 MCP NAND FBGA56 FBGA69 32M X 32 MEMORY FLASH BGA FBGA71 PDF

    fBGA package tray 12 x 19

    Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125
    Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2


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    1f1-1717-a19

    Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
    Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O


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    60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48TBGA 48-TBGA-10 0-8X16-O LA69-00267A ADS11981 1f1-1717-a19 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9 PDF

    1LQ1

    Abstract: national an-1 voltage regulator MCF528x DSLV010A CLC01A DP83849 bsdl DS90LV110T
    Text: ナショナル セミコンダクター インタフェース製品 セレクションガイド 2006年12月 LVDS/BusLVDS/M-LVDS. ドライバ・レシーバ・. トランシーバ. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-6 マルチギガビット LVDS.


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    AN-10 CLC01 DS92LV16. 03-5639-7300www 550064-010-JP 1LQ1 national an-1 voltage regulator MCF528x DSLV010A CLC01A DP83849 bsdl DS90LV110T PDF

    Virtex-4 serdes

    Abstract: camera-link to hd-SDI converter schematic satellite finder BELDEN 1700A dp83848 1470 LM camera-link to SDI converter CAT5E Pinout DP83865 SCHEMATIC dp83848 data sheet
    Text: Interface Selection Guide March 2007 LVDS Drivers/Receivers Tranceivers . 5-6 LVDS and CML PHYs Differential to Differential . 7-10 SerDes . . 11-13 Serial Digital Interface (SDI) . . 14-16


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    AN-1113 LMH0031 AN-1320 LMH0034 AN-1372 Virtex-4 serdes camera-link to hd-SDI converter schematic satellite finder BELDEN 1700A dp83848 1470 LM camera-link to SDI converter CAT5E Pinout DP83865 SCHEMATIC dp83848 data sheet PDF

    blm21p221sn

    Abstract: RJ45INTLED MICTOR38P 3 7segment k168 K163 4R7 w24 2S180 Up board date sheet BLM21P221SN1
    Text: A B C D 8/18/05 3 2 1 5 4 Created schematic and changed the component from the 2S60 on the DSP board to the 2S180 on this Pro version of the board Change Description 3 01 Rev Thursday, August 18, 2005 Date: 2 Document Number P06-10217-01 DSP Pro Stratix II 2S180 Maine Pro


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    2S180 P06-10217-01 2S180 U47MMBD3004BRM U46MMBD3004BRM blm21p221sn RJ45INTLED MICTOR38P 3 7segment k168 K163 4R7 w24 Up board date sheet BLM21P221SN1 PDF

    1LQ1

    Abstract: LM201 IC ASIC LQFP128 LM5035 LMH7332 picocell DS15CP154 LM5002 LM5070 12v output LMH6515
    Text: 無線通信網絡基建設備 2G/3G/4G 基站解決方案概覽 2008 年 第 2 季 1Q 2008 2G2.5G、3G、LTE 及 4G 無線移動電話基站 例如 GSM/ EDGE/GPRS、W-CDMA、 CDMA2000、TD-SCDMA、 WiMAX 以及其他應用的解 決方案 高速數據轉換器. 4-6


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    CDMA2000TD-SCDMA 1LQ1 LM201 IC ASIC LQFP128 LM5035 LMH7332 picocell DS15CP154 LM5002 LM5070 12v output LMH6515 PDF

    Untitled

    Abstract: No abstract text available
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    P-FBGA107-0912-0

    Abstract: No abstract text available
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    P-FBGA107-0912-0 /Ba11* PDF

    Untitled

    Abstract: No abstract text available
    Text: P—FBGA107—091S—0.80DZ Uniti nn Jul.2003


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    P-FBGA101-1012-0

    Abstract: No abstract text available
    Text: P—FBGA101—101E—0.80A3 Uniti nn Jul.2003


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    FBGA101â P-FBGA101-1012-0 PDF

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    Abstract: No abstract text available
    Text: P—FBGA103—091S—0.80A4 Uniti nn Jul.2003


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    FBGA103â 091E-0 PDF

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    Abstract: No abstract text available
    Text: P—FBGA107—091S—0.80AZ Uniti nn Ja n ,2004


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    Abstract: No abstract text available
    Text: P—FBGA107—091S—0.80BZ Unit' nn 0 ^ 1. 40MAX nrroi, . 0. 26±0. 04 <|>O ! 10,80I iHJ- o o o o o|o o o o o 000001 1 0000 XEO o o o | o o o o o o o o o ojo o o o o o_o_o gpio o_o_o % o o o o o]o o o o o oooo oooooo O O O O 0-0 o o o o o o o o olo o o o o


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    Abstract: No abstract text available
    Text: P —FBGA107—0912—0.80FZ


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    P-FBGA107-0912-0 80FZP-FBGA107-0912-0 PDF

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    Abstract: No abstract text available
    Text: P—FBGA107—091S—0.80FZ Uniti nn Jan,2004


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    FBGA107â 091E-0 PDF

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    Abstract: No abstract text available
    Text: P—FBGA109—1111—0.80C3 Uniti nn lES H 3 ] EH] -oooooooooooo -ooooooloooooo ooooooioooooo ooo !I ooo ooo ooo hO _O Q _ L ooo_ òoo T óoò OOO I Oooo OOOO ! OO ooooooloooooo OOOOOOIOOOOOO -OOOOOOIOOOOOO L 3 4 5 6 7 8 9 10 11 12 00. 5±0. 0 5 1 fiei0O , 08 M3I STABI


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    Abstract: No abstract text available
    Text: P—FBGA107—091S—0.80FZ Unit' nn 0 ^ 1. 40MAX nrroi, . 0. 26±0. 04 <|>O ! 10,80I iHJ- o o o o o|o o o o o 000001 1 0000 XEO o o o | o o o o o o o o o ojo o o o o o_o_o gpio o_o_o % o o o o o]o o o o o oooo oooooo O O O O 0-0 o o o o o o o o olo o o o o


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    Abstract: No abstract text available
    Text: P—FBGA107—0912—0.80BZ


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    P-FBGA107-0912-0 80BZP-FBGA107-0912-0 PDF

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    Abstract: No abstract text available
    Text: P—FBGA107—0912—0.80EZ


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    P-FBGA107-0912-0 80EZP-FBGA107-0912-0 PDF