223011-2
Abstract: 536511 536510-4 9588 223004-5 tyco MGCD0-00008 223000-4
Text: Data downloaded from http://www.anglia.com - the website of Anglia - tel: 01945 474747 METRIC Catalogue 1654741 Z-PACK 2mm FutureBus+ Connectors Revised 1-04 Dimensions are millimetres over inches 4 Row Signal Modules, Vertical Pin Assemblies, Fixed-Board Connector, 2mm x 2mm Circuit Grid
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fad27
Abstract: FAD47 FRQ01 FAD21 FAD30 FAD45 FAD26 fca 173 FAD 203 FAD37
Text: NEUBRIDGE MICROSYSTEMS NEWBRIDGE fc.4E D • b5öölQl JANUARY, 1993 MICROSYSTEMS Fully compatible with IEEE Std 896.1 - 1991 - Profiles A & B register selectable TTL input/output levels Low power CMOS implementation Futurebus+ interface - 896.1 compelled mode data transfer protocol
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0DD203
CA91C899
64-bit
fad27
FAD47
FRQ01
FAD21
FAD30
FAD45
FAD26
fca 173
FAD 203
FAD37
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DIN41626
Abstract: No abstract text available
Text: r TEMPUS C B C 20 2mm Interconnect Hybrid Modules Features Allows application of high power, coaxial inserts, guiding features and fibre optics into an industry standard DIN41626 style cavity Designed to conform with IEC 48b237, EIAis64, IEEEP896 Futurebus+, IEEE P1596
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DIN41626
48b237,
EIAis64,
IEEEP896
P1596
IEC917
2OXOO-OOIFA3-002
CBC20X00-001FA1
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Untitled
Abstract: No abstract text available
Text: 2mm Interconnect TEMPUS CBC 20 Shrouds Features Designed to conform with IEC 48b237, EIAis64, IEEE P896 Futurebus+, IEEE P1596 SCI and IEC917 metric modular order To be used in conjunction with TEM PU S CBC 20 male pressfit long tail modules Stackable with other TEM PU S CBC 20
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48b237,
EIAis64,
P1596
IEC917
AO0-O24WR1
CBC20A00-024WR3
CBC20B00-048WR1
CBC20B00-048WR3
CBC20X00-072WR1
CBC20C00-096WR1
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CBC20B00-048MDS1-5-1
Abstract: TRI-1.25-6
Text: 2mm Interconnect TEMPUS C B C 20 Male Signal Modules — Narrow Wall — Solder Termination — 4 Row Features Designed to conform with IEC 48b237, EIAis64, IEEE P896 Futurebus+, IEEE P1596 SCI and IEC 917 metric modular order Stackable with other TEMPUS modules, with
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48b237,
EIAis64,
P1596
CBC20B00-048MDS1-5-1
TRI-1.25-6
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Untitled
Abstract: No abstract text available
Text: Catalog 1307515 Issued 9-99 Z-PACK 2mm FutureBus+ Connectors Continued IEC61076-4-0X(48B) 4 Row — Power Modules, Vertical Pin Assemblies (Fixed-Board Connector), 2mm x 2mm Circuit Grid 11.50 [ 453 ] 16 m m W id e Body Pin A s s e m b lie s w ith S o ld e r
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IEC61076-4-0X
1-80Q-522-6752
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205ae
Abstract: No abstract text available
Text: C a ta log 1 3 0 7 5 1 5 Issued 9-99 Z-PACK 2mm FutureBus+ Connectors Continued IEC61076-4-0X(48B) 5 Row — Power Modules, Right Angle Receptacle A ssem blies (Free-Board Connector), 2mm x 2mm Circuit Grid Receptacle Assemblies with Solder Leads and Compliant Press-Fit Leads
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IEC61076-4-0X
IPC-D-300
205ae
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Untitled
Abstract: No abstract text available
Text: m o le x 2.00mm .079" Pitch MFB (Futurebus+) Receptacle Code Key FEATURES AND SPECIFICATIONS Physical Features and Benefits • Integral keying on bottom row does not interrupt pin grid Housing: Glass-filled PBT and leaves full front face of connector available for signals
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J-101
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Untitled
Abstract: No abstract text available
Text: TEMPUS C B C 20 2mm Interconnect Male Signal Modules — Wide Wall — Pressfit Termination — 4 Row Features * Designed to conform with IEC 48b237, EIAis64, IEEE P896 Futurebus+, IEEE P1596 SCI and IEC 917 metric modular order Stackable with other TEMPUS modules, with
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48b237,
EIAis64,
P1596
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Untitled
Abstract: No abstract text available
Text: TEMPUS CBC 20 2mm Interconnect Male Signal Modules — Wide Wall — Solder Termination — 5 Row Features » Designed to conform with IEC 48b237, EIAis64, IEEE P896 Futurebus+, IEEE P1596 SCI and IEC 917 metric modular order Stackable with other TEMPUS modules, with
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48b237,
EIAis64,
P1596
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51153-I
Abstract: No abstract text available
Text: m o le x 2.00mm .079" Pitch MFB (Futurebus+) Header Code Key FEATURES AND SPECIFICATIONS Features and Benefits Physical • Integral keying on bottom row does not interrupt pin grid Housing: Glass-filled PBT and leaves full front face of connector available for signals
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51153-I
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CBC20D00-192WDS2-4-1
Abstract: CBC20A00-024WDS2-5-1 CBC20B00-048WDS1-8-1
Text: TEMPUS C B C 20 2mm Interconnect Male Signal Modules — Wide Wall — Solder Termination — 4 Row Features - Designed to conform with IEC 4 8 b 2 3 7, EIAis64, IE E E P896 Futurebus+, IE E E P1596 SCI and IEC 9 17 metric modular order - Stackable with other T E M P U S modules, with
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EIAis64,
P1596
Term197)
CBC20D00-192WDS2-4-1
CBC20A00-024WDS2-5-1
CBC20B00-048WDS1-8-1
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Untitled
Abstract: No abstract text available
Text: 2mm Interconnect TEMPUS C B C 20 Male Signal Modules — Wide Wail — Solder Termination — 5 Row Features • Designed to conform with IEC 48b237, EIAis64, IEEE P896 Futurebus+, IEEE P1596 SCI and IEC 917 metric modular order • Stackable with other TEMPUS modules, with
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48b237,
EIAis64,
P1596
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IPC-D300
Abstract: 223004-5 IPC-D-300
Text: Catalog 1307515 Issued 9-99 Z-P A C K 2mm FutureBus+ Connectors Continued IEC61076-4-0X(48B) 5 Row — Signal Modules, Right Angle Receptacle Assemblies (Free-Board Connector), 2mm x 2mm Circuit Grid Receptacle Assem blies with Solder Leads and Com pliant Press-Fit Leads
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IEC61076-4-0X
IPC-D300
223004-5
IPC-D-300
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Untitled
Abstract: No abstract text available
Text: Catalog 1307515 Issued 9 -9 9 Z-PACK 2mm FutureBus+ Connectors Contin ued IEC61076-4-0X(48B) 4 Row — Power Modules, Right Angle Receptacle Assemblies (Free-Board Connector), 2mm x 2mm Circuit Grid Receptacle Assemblies with Solder Leads and Compliant Press-Fit Leads
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IEC61076-4-0X
IPC-D-300
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Untitled
Abstract: No abstract text available
Text: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Right Angle, Solder Tail MP2 Series • • • • • • • • Three levels of early mate, late break EMLB sequencing or selective loading options Footprint compatible with standard Futurebus+ Solder tail with true-position wafer
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TS-1122-C
RIA-2217B-E
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Futurebus
Abstract: No abstract text available
Text: 3M MetPak™ 2-FB Power Header 2 mm 4/5 Row, Vertical, Press-Fit Tail MP2 Series • 6.50 Amps per contact • Early mate late break EMLB for hot swap or selective loading options • End-to-end stackable • Optional feed-through tail (Press-Fit) • Futurebus+ compatible
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TS-1126-D
RIA-2217B-E
Futurebus
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Untitled
Abstract: No abstract text available
Text: 3M MetPak™ 2-FB Power Socket 2 mm 4/5-Row, Right Angle, Solder or Press-Fit Tail • • • • • MP2 Series 6.50 Amps per contact End-to-end stackable Press or heat stake peg solder tail Futurebus+ compatible See the Regulatory Information Appendix (RIA)
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TS-1125-D
RIA-2217B-E
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DS3884A
Abstract: DS3884AVF VF44B
Text: DS3884A BTL Handshake Transceiver General Description The DS3884A is one in a series of transceivers designed specifically for the implementation of high performance Futurebus+ and proprietary bus interfaces. The DS3884A is a BTL 6-bit Handshake Transceiver designed to conform to
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DS3884A
DS3884A
DS3884AVF
VF44B
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Untitled
Abstract: No abstract text available
Text: DS2112 PRELIMINARY Di?2112 DALLAS BTL Terminator s e m ic o n d u c to r PIN ASSIGNMENT FEATURES • Complies with Backplane Transceiver Logic BTL specifications (IEEE 1194.1-1991) and Futurebus+ specifications (IEEE 896.2-1991) • Provides active termination for eight signal lines
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DS2112
16-PIN
16-PIN
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Untitled
Abstract: No abstract text available
Text: DS2112 PRELIMINARY DALLAS SEMICONDUCTOR DS2112 BTL Terminator PIN ASSIGNMENT FEATURES • Com plies with Backplane Transceiver Logic BTL specifications (IEEE 1194.1-1991) and Futurebus+ specifications (IEEE 8 9 6.2-1991) • Provides active term ination for eight signal lines
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DS2112
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b 0787
Abstract: cc 089
Text: 7300 Series Futurebus CCS 4 Row Right Angle Female Power Specifications Insulator Material: Liquid Crystal Polymer LCP 94V-O, UL Recognized. Contact Material: Phosphor Bronze Contact Plating: Gold and Tin over .000050” Ni (See contact plating options)
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E146967
E176234
b 0787
cc 089
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Untitled
Abstract: No abstract text available
Text: Backplane Connectors C FEATURES AND SPECIFICATIONS Features and Benefits • High density 2mm metric connector in the same form factor as Futurebus ■ 6-row connector provides 30 contacts per linear centimeter over 75 per inch ■ Designed for high-density/high-speed applications
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PS-73670-9999
E29179
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DS3890
Abstract: DS3893A FB1650 FB2031 FB2040 TFB2010
Text: Next-Generation Futurebus+/BTL Transceivers Allow Single-Sided SMT Manufacturing SCBA003 13–1 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version
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SCBA003
DS3890
DS3893A
FB1650
FB2031
FB2040
TFB2010
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