MIFARE Card IC Coil Design Guide
Abstract: mifare s50 mifare s50 MIFARE MF1ICS2005 Mifare MF1 IC S 70
Text: MF1 IC S20 05 Sawn bumped 120µm wafer addendum Rev. 3.0 — 18 July 2007 Product data sheet 141130 PUBLIC 1. General description The MF1 IC S20 05 is a contactless Smart Card IC designed for card IC coils following the “Mifare card IC coil design guide” and is qualified to work properly in NXP´ reader
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MF1ICS2005W/U7D
MIFARE Card IC Coil Design Guide
mifare s50
mifare s50 MIFARE
MF1ICS2005
Mifare MF1 IC S 70
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ic u11
Abstract: MIFARE Card IC Coil Design Guide 74x74 LCR meter for ICs package MIFARE Card Coil Design Guide
Text: MF0 IC U10 01 MF0 IC U11 01 Bumped sawn wafer on UV-tape Rev. 3.2 — 16 March 2007 Product data sheet 102132 PUBLIC 1. General description 1.1 Scope The MF0 IC U10 01 and the MF0 IC U11 01 are contactless Smart Card ICs designed for card IC coils following the mifare card IC coil design guide and are qualified to work
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MF0ICU1001W/V1D
MF0ICU1101W/V1D
ic u11
MIFARE Card IC Coil Design Guide
74x74
LCR meter for ICs package
MIFARE Card Coil Design Guide
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MF1ICS5005
Abstract: mifare s50 MIFARE MIFARE Card IC Coil Design Guide mifare s50 LCR meter for ICs package S5005
Text: MF1 IC S50 05 Bumped sawn wafer on UV-tape addendum Rev. 3.2 — 4 April 2007 Product data sheet 102032 PUBLIC 1. General description The MF1 ICS 50 05 is a contactless smart card IC designed for card IC coils following the mifare card IC coil design guide and is qualified to work properly in NXP reader
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MF1ICS5005W/V1D
MF1ICS5005
mifare s50 MIFARE
MIFARE Card IC Coil Design Guide
mifare s50
LCR meter for ICs package
S5005
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MIFARE s70 chip
Abstract: Philips MF1 IC S70 General Wafer Specification MIFARE s70 UV-tape MIFARE Card IC Coil Design Guide S7001 MIFARE Card Coil Design Guide
Text: INTEGRATED CIRCUITS ADDENDUM Standard 4Kbyte Card IC MF1 IC S70 01 Specification “sawn wafer on UV-tape” Product Specification Revision 3.0 PUBLIC Philips Semiconductors August 2004 Philips Semiconductors Rev. 3.0 August 2004 Sawn wafer on UV-tape MF1 IC S70 01
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SCA74
MIFARE s70 chip
Philips MF1 IC S70
General Wafer Specification
MIFARE s70
UV-tape
MIFARE Card IC Coil Design Guide
S7001
MIFARE Card Coil Design Guide
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MIFARE Card IC Coil Design Guide
Abstract: MIFARE s70 chip Philips MF1 IC S70 General Wafer Specification MF1 IC S70 k 1356 12NC ordering code philips MIFARE s70 philips application notes philips 15601
Text: INTEGRATED CIRCUITS ADDENDUM Standard 4Kbyte Card IC MF1 IC S70 01 Wafer Specification Product Specification Revision 3.1 PUBLIC Philips Semiconductors October 2002 Philips Semiconductors Wafer Specification Rev. 3.1 October 2002 Standard 4Kbyte Card IC MF1 IC S70 01
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SCA74
MIFARE Card IC Coil Design Guide
MIFARE s70 chip
Philips MF1 IC S70
General Wafer Specification
MF1 IC S70
k 1356
12NC ordering code philips
MIFARE s70
philips application notes
philips 15601
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X118
Abstract: S7001
Text: MF1 IC S70 01 Standard 4Kbyte card IC bumped sawn wafer on UV-tape addendum Rev. 3.1 — 4 April 2007 Product data sheet 101831 PUBLIC 1. General description The MF1 IC S70 01 is a contactless smart card IC designed for card IC coils following the mifare card IC coil design guide and is qualified to work properly in NXP reader
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MF1ICS7001W/V1D
X118
S7001
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Untitled
Abstract: No abstract text available
Text: RoHS Multilayer Chip Inductors MLC20 0.043±0.008 0.126±0.008 Dimensions: 1.09±0.20 (3.20±0.20) Inches (mm) 0.063±0.008 (1.60±0.20) 0.043±0.008 (1.09±0.20) 0.047 (1.19) 0.078 (1.98) Allied Part Number Inductance Tolerance (µh) (%) Q Min. Test Freq.
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MLC20
MLC20-R047M-RC
MLC20-R056M-RC
MLC20-R068M-RC
MLC20-R082M-RC
MLC20-R10M-RC
MLC20-R12M-RC
MLC20-R15M-RC
MLC20-R18M-RC
MLC20-R22M-RC
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MIFARE Card IC Coil Design Guide
Abstract: Mifare MF1 S50 mifare mf1 ic s50 uv-tape S5005
Text: MF1 IC S50 05 Sawn wafer on UV-tape addendum Rev. 3.2 — 18 April 2007 Product data sheet 101932 PUBLIC 1. General description The MF1 ICS 50 05 is a contactless Smart Card IC designed for card IC coils following the “Mifare card IC coil design guide” and is qualified to work properly in NXP
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MF1ICS5005W/V9D
MIFARE Card IC Coil Design Guide
Mifare MF1 S50
mifare mf1 ic s50
uv-tape
S5005
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MIFARE s70 chip
Abstract: Philips MF1 IC S70 MIFARE Card IC Coil Design Guide ICS70 S7001
Text: INTEGRATED CIRCUITS ADDENDUM Standard 4Kbyte Card IC MF1 IC S70 01 Specification “bumped sawn wafer on UV-tape” Product Specification Revision 3.0 PUBLIC Philips Semiconductors August 2004 Philips Semiconductors Rev. 3.0 August 2004 Bumped sawn wafer on UV-tape
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SCA74
MIFARE s70 chip
Philips MF1 IC S70
MIFARE Card IC Coil Design Guide
ICS70
S7001
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MIFARE Card Coil Design Guide
Abstract: MF0ICU1 LCR meter for ICs package contactless Functional Specification
Text: MF0 IC U10 01 120 mm Bumped unsawn wafer on UV-tape contactless single-trip ticket ICs Rev. 3.2 — 16 March 2007 Product data sheet 127632 PUBLIC 1. General description 1.1 Scope The MF0 IC U10 01 is a contactless smart card IC designed for card IC coils following the
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MF0ICU1001U/U7D
MIFARE Card Coil Design Guide
MF0ICU1
LCR meter for ICs package
contactless Functional Specification
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mifare s50 MIFARE
Abstract: MF1 S50 mifare s50 Card Mifare 1 S50 S50 Application Note MF1 IC S50 Mifare MF1 S50 LCR meter for ICs package
Text: MF1 IC S50 06 Wafer specification addendum Rev. 3.2 — 16 March 2007 Product data sheet 075932 PUBLIC 1. General description The MF1 ICS 50 06 is a contactless smart card IC designed for card IC coils following the mifare card IC coil design guide and is qualified to work properly in NXP reader
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MF1ICS5006W/V5D
mifare s50 MIFARE
MF1 S50
mifare s50
Card Mifare 1 S50
S50 Application Note
MF1 IC S50
Mifare MF1 S50
LCR meter for ICs package
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ibis format
Abstract: IBIS wafer map format ic u11 MF-0
Text: INTEGRATED CIRCUITS ADDENDUM Contactless Single-trip Ticket ICs MF0 IC U10 01 MF0 IC U11 01 Bumped Wafer Specification Product Specification Revision 3.0 PUBLIC Philips Semiconductors March 2003 Philips Semiconductors Product Specification Rev. 3.0 March 2003
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ibis format
IBIS wafer map format
ic u11
MF-0
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MIFARE Card IC Coil Design Guide
Abstract: Philips MF1 IC S50 Mifare MF1 S50 Philips Mifare 1 S50 Philips Mifare 1 S50 specifications philips S50 MF1 S50 mifare s50 MIFARE card MF1 IC S50 S5005
Text: INTEGRATED CIRCUITS ADDENDUM Standard Card IC MF1 IC S50 05 Wafer Specification Revision 3.0 PUBLIC Philips Semiconductors October 2002 Philips Semiconductors Rev. 3.0 October 2002 Wafer Specification Standard Card IC MF1 IC S50 05 CONTENTS 1 SCOPE 3 2 REFERENCE DOCUMENTS
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SCA74
MIFARE Card IC Coil Design Guide
Philips MF1 IC S50
Mifare MF1 S50
Philips Mifare 1 S50
Philips Mifare 1 S50 specifications
philips S50
MF1 S50
mifare s50 MIFARE card
MF1 IC S50
S5005
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UV-tape
Abstract: MIFARE Card Coil Design Guide contactless Functional Specification
Text: MF0 IC U10 01 120 µm Bumped sawn wafer on UV-tape contactless single-trip ticket ICs Rev. 3.2 — 16 March 2007 Product data sheet 124832 PUBLIC 1. General description 1.1 Scope The MF0 IC U10 01 is a contactless Smart Card IC designed for card IC coils following the
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MF0ICU1001W/U7D
UV-tape
MIFARE Card Coil Design Guide
contactless Functional Specification
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MIFARE Card IC Coil Design Guide
Abstract: Mifare MF1 IC S 70 MIFARE s70 chip X118 AN MIFARE Card Coil Design Guide 101730 S7001
Text: MF1 IC S70 01 Standard 4Kbyte card IC sawn wafer on UV-tape addendum Rev. 3.1 — 18 April 2007 Product data sheet 101731 PUBLIC 1. General description The MF1 IC S70 01 is a contactless smart card IC designed for card IC coils following the MIFARE card IC coil design guide and is qualified to work properly in NXP reader
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MF1ICS7001W/V9D
MIFARE Card IC Coil Design Guide
Mifare MF1 IC S 70
MIFARE s70 chip
X118
AN MIFARE Card Coil Design Guide
101730
S7001
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MOA4 S50
Abstract: MOA4 MOA4 package specification MOA4 Package mifare s50 MIFARE mf1 s50 mifare s50 "Chip card module"
Text: MF1 MOA4 S50 Contactless Chip Card Module Specification Rev. 3.2 — 19 December 2006 Product data sheet 083032 PUBLIC 1. General description 1.1 Addendum This document gives specifications for the product MF1 MOA4 S50. The MF1 MOA4 S50 is the integrated circuit MF1 ICS50 in the package SOT500BA2.
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ICS50
OT500BA2.
MOA4 S50
MOA4
MOA4 package specification
MOA4 Package
mifare s50 MIFARE
mf1 s50
mifare s50
"Chip card module"
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AN MIFARE Card Coil Design Guide
Abstract: marking code s20 LCR meter for ICs package MIFARE Card Coil Design Guide MF1ICS5006
Text: MF1 IC S20 07 Sawn wafer on UV-tape addendum Rev. 1.1 — 16 March 2007 Product data sheet 132311 PUBLIC 1. General description The MF1 ICS 20 20 is a contactless Smart Card IC designed for card IC coils following the “Mifare card IC coil design guide” and is qualified to work properly in NXP´ reader
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MF1ICS2007W/V6D
AN MIFARE Card Coil Design Guide
marking code s20
LCR meter for ICs package
MIFARE Card Coil Design Guide
MF1ICS5006
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MLC20
Abstract: No abstract text available
Text: RoHS Multilayer Chip Inductors MLC20 0.043±0.008 0.126±0.008 Dimensions: 1.09±0.20 (3.20±0.20) Inches (mm) 0.063±0.008 (1.60±0.20) 0.043±0.008 (1.09±0.20) 0.047 (1.19) 0.078 (1.98) Allied Part Number Inductance Tolerance (µh) (%) Q Min. Test Freq.
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MLC20
MLC20-R047M-RC
MLC20-R056M-RC
MLC20-R068M-RC
MLC20-R082M-RC
MLC20-R10M-RC
MLC20-R12M-RC
MLC20
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MF0 IC U1X
Abstract: philips 22c Specification FCP2 Flip Chip Package SOT732CA2 12NC ordering code philips MF0ICU10
Text: INTEGRATED CIRCUITS ADDENDUM MF0 FCP2 U1 Flip Chip Package Specification Product Specification Revision 3.0 PUBLIC Philips Semiconductors October 2004 Philips Semiconductors Product Specification Rev 3.0 October 2004 Flip Chip Package Specification MF0 FCP2 U1
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MF0 IC U1X
philips 22c
Specification FCP2 Flip Chip Package
SOT732CA2
12NC ordering code philips
MF0ICU10
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MIFARE Card Coil Design Guide
Abstract: uv-tape mifare s50 mifare s50 MIFARE MF1 IC S50 LA 7124
Text: MF1 IC S50 07 Sawn bumped wafer on UV-tape addendum Rev. 3.2 — 4 April 2007 Product data sheet 118832 PUBLIC 1. General description The MF1 ICS 50 07 is a contactless Smart Card IC designed for card IC coils following the “Mifare card IC coil design guide” and is qualified to work properly in NXP´ reader
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MF1ICS5007W/V7D
MIFARE Card Coil Design Guide
uv-tape
mifare s50
mifare s50 MIFARE
MF1 IC S50
LA 7124
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LA 7124
Abstract: mifare s50 mifare s50 MIFARE mifare mf1 ic s50 MF1 IC S50 CONTACTLESS SMART CARD READER
Text: MF1 IC S50 07 Sawn wafer addendum Rev. 3.2 — 16 March 2007 Product data sheet 118732 PUBLIC 1. General description The MF1 ICS 50 07 is a contactless Smart Card IC designed for card IC coils following the “Mifare card IC coil design guide” and is qualified to work properly in NXP´ reader
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MF1ICS5007W/V6D
LA 7124
mifare s50
mifare s50 MIFARE
mifare mf1 ic s50
MF1 IC S50
CONTACTLESS SMART CARD READER
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Untitled
Abstract: No abstract text available
Text: Multilayer Chip Inductors Dimensions In. MLC20 A MLC20 A .126 ± .008 C B .063 ± .008 B D C .043 ± .008 D .020 ± .012 E .078 G F .054 G .047 Allied Part Number Inductance Tolerance (µh) (%) Q Min. Test Freq. (MHz) E SRF Min. (MHz) DCR Max. (Ω) Rated
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MLC20
MLC20-R047M
MLC20-R068M
MLC20-R10M
MLC20-R12M
MLC20-R15M
MLC20-R18M
MLC20-R22M
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ic u11
Abstract: uv-tape HP4258 ibis format IBIS wafer map format MIFARE Card IC Coil Design Guide philips 22c la 4620 ic
Text: INTEGRATED CIRCUITS ADDENDUM Contactless Single-trip Ticket ICs MF0 IC U10 01 MF0 IC U11 01 Specification “bumped sawn wafer on UV-tape” Product Specification Revision 3.0 PUBLIC Philips Semiconductors August 2004 Philips Semiconductors Rev. 3.0 August 2004
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ic u11
uv-tape
HP4258
ibis format
IBIS wafer map format
MIFARE Card IC Coil Design Guide
philips 22c
la 4620 ic
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Untitled
Abstract: No abstract text available
Text: Multilayer Chip Inductors MLC20 Dimensions In. MLC20 A .1261.008 B .063 + .008 C* .024+ .008 C .043 ±.011 D .020+ .011 Allied Part Number Inductance Tolerance (^H) (%) Q Min. SRF Test Freq. (MHz) Min. (MHz) DCR Max. (G) Rated Current (mA) MLC20-R047M* .047
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OCR Scan
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MLC20
MLC20
MLC20-R047M*
MLC20-R068M*
MLC20-R10M*
MLC20-R12M*
MLC20-R15M*
MLC20-R18M*
MLC20-R2OOOIE
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