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    128k x 8 eeprom

    Abstract: 64k x 8 64k x 8 sram
    Text: GENERAL INFORMATION THE SUBSYSTEM'S “FLEXI-PAK ” CMOS MODULE FAMILY Integrated Device Technology, Inc. SRAM, EPROM, & EEPROM MODULES FEATURES: DESCRIPTION: • High-density modules using high-speed CMOS SRAM, EPROM, and EEPROM components. • Inter-changeable modules, with equivalent footprints,


    OCR Scan     		PDF util7004 IDT7M7014 IDT7M7012 16/32K IDT7M7002 IDT7M7022* -256K IDT7M7032* 128k x 8 eeprom 64k x 8 64k x 8 sram

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    Abstract: No abstract text available
    Text: I N T E G R A T E » DE VI CE 3ÔE D • M Ö 2 S 7 7 1 O D G S I S M 1 ■ IDT THE SU B SY ST EM 'S “FLEXI-PAK ” CM O S MODULE FAMILY Integrated Device Technology, Inc. GENERAL INFORMATION SRAM, EPROM, & EEPROM MODULES \ Ol FEATURES: DESCRIPTION: • High-density modules using high-speed C M O S SRAM,


    OCR Scan     		PDF 66-pin, IDT7M7014 IDT7M7012 16/64KX8 IDT7M7002 1DT7M7022* -256K 128Kx