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    Abstract: No abstract text available
    Text: IGC168T170S8RH IGBT3 Power Chip Features: • 1700V Trench + Field stop technology  low switching losses and saturation losses  soft turn off  positive temperature coefficient  easy paralleling Chip Type VCE IC IGC168T170S8RH 1700V 150A This chip is used for:


    Original     		IGC168T170S8RH IGC168T170S8RH L7793N, L7793U, L7793F, PDF

    soft solder die bonding

    Abstract: No abstract text available
    Text: IGC168T170S8RH IGBT3 Power Chip Features: • 1700V Trench + Field stop technology • low switching losses and saturation losses • soft turn off • positive temperature coefficient • easy paralleling Chip Type IGC168T170S8RH VCE IC 1700V 150A This chip is used for:


    Original     		IGC168T170S8RH L7783N, soft solder die bonding PDF