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    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: YAMAICHI Q.F.P. Production Sockets Body M aterial: Polyphenylene Sulfide PPS Contact M aterial: Beryllium Copper (BeCu) Contact Plating; Tin over Nickel Mating Package: JEDEC100 pin Bumpered QFP IC157-100-001-SS4 • CHARACTERISTICS Insulation Resistance


    OCR Scan     		JEDEC100 IC157-100-001-SS4 500MO 500VDC 10mA/20mV IC157 PDF

    Untitled

    Abstract: No abstract text available
    Text: YAMAICHI ELECTRONICS INC 0QG0S7Ö SSfl • bflE D YAMAICHI IC157-100-001-SS4 Q.F.P. Production Sockets RECOMMENDED PC BOARO LAYOUT 10* V « W M U M SOCKET 1 D0- *0. ss talsrttr jjf H; =1 “ Bodv Material : Polyphenylene Sulfide PPS Contact Material: Beryllium Copper (BeCu)


    OCR Scan     		IC157-100-001-SS4 JEDEC100 500MQ 500VDC 10mA/20mV IC157- PDF

    Untitled

    Abstract: No abstract text available
    Text: YA HA IC HI E L E C T R O N I C S Q.F.P. SMT INC bflE D TTHSSati D O D G S ? 1! MTM YAMAICHI IC198 Series + 0.05 I SPE C IF IC A T IO N S • Low profile 4.0mm. Easy for ROM upgrade. • SMT terminals • C H A R A C T E R IS T IC S Insulation Resistance


    OCR Scan     		IC198 IC157-100-001-SS4 JEDEC100 500MQ 500VDC 10mA/20mV IC157- PDF