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Abstract: No abstract text available
Text: Intel Core i7 Processor Family for the LGA-2011 Socket Datasheet, Volume 2 Supporting Desktop Intel® Core™ i7-3960X Extreme Edition Processor for the LGA-2011 Socket Supporting Desktop Intel® Core™ i7-3000K and i7-3000 Processor Series for the LGA-2011 Socket
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LGA-2011
i7-3960X
i7-3000K
i7-3000
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LGA 2011 Socket diagram
Abstract: LGA2011 LGA 2011 Socket 3930k ddr3 controller transistors F6 DD52 BJ13 VCCD01 pcie gen 2 payload i7-3930
Text: Intel Core i7 Processor Family for the LGA-2011 Socket Datasheet, Volume 1 Supporting Desktop Intel® Core™ i7-3960X Extreme Edition Processor for the LGA-2011 Socket Supporting Desktop Intel® Core™ i7-39xxK and i7-38xx Processor Series for the LGA-2011 Socket
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LGA-2011
i7-3960X
i7-39xxK
i7-38xx
LGA 2011 Socket diagram
LGA2011
LGA 2011 Socket
3930k
ddr3 controller
transistors F6 DD52
BJ13
VCCD01
pcie gen 2 payload
i7-3930
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reflow profile FOR LGA COMPONENTS
Abstract: LGA PACKAGE thermal resistance an103r paste profile solder joint AN103 lga components LGA land pattern stencil Enpirion
Text: Enpirion, Inc. EN53x0D AN103_R0.9 Soldering Module Packages Having Large Asymmetric Pads 1.0 INTRODUCTION Enpirion’s power converter packages utilize module package technology to form Land Grid Array LGA packages. LGA module package technology provides additional
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EN53x0D
reflow profile FOR LGA COMPONENTS
LGA PACKAGE thermal resistance
an103r
paste profile
solder joint
AN103
lga components
LGA land pattern
stencil
Enpirion
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EIA-364 65A
Abstract: lga components LGA resistance EIA-364-65A 0.5mm pitch BGA EIA-364-27 EIA-364-28 EIA-364-31 EIA-364-32 LGA PACKAGE thermal resistance
Text: 0.5 mm LGA/BGA Sockets DESCRIPTION Tyco Electronics’ polymer interconnect technology optimizes socketing of 0.5 mm pitch LGA or BGA devices. This highly conductive polymer contact provides electrically transparent signal transfer. APPLICATIONS • • •
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8-1773444-1-CC
LH-PDF-07/06
EIA-364 65A
lga components
LGA resistance
EIA-364-65A
0.5mm pitch BGA
EIA-364-27
EIA-364-28
EIA-364-31
EIA-364-32
LGA PACKAGE thermal resistance
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LGA16 footprint
Abstract: TN0018 lga16 land pattern LGA16 L footprint 788755 LGA voiding LGA16 JESD97 LGA14 lga16 land
Text: TN0018 Technical note Linear accelerometers in LGA package surface mounting guidelines Abstract This document is a general guidelines about soldering accelerometer products packaged in LGA surface mount. October 2006 Rev 1 1/13 www.st.com Contents TN0018 Contents
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TN0018
LGA16 footprint
TN0018
lga16 land pattern
LGA16 L footprint
788755
LGA voiding
LGA16
JESD97
LGA14
lga16 land
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mems pedometer
Abstract: mems sensor feature LIS3LV02DL LIS3LV02DL code Accelerometer Chip MEMS Filter Three-axis
Text: Three-axis digital accelerometer in LGA High performance, low-power and cost effective STMicroelectronics offers a complete family of linear accelerometers, in an LGA package, with analog or digital output. The LIS3LV02DL is a low-power, low voltage linear
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LIS3LV02DL
FLMEMSLIS0906
mems pedometer
mems sensor feature
LIS3LV02DL code
Accelerometer Chip
MEMS Filter
Three-axis
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LGA voiding
Abstract: AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale
Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.0, 10/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style
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AN3311
MC1320x
MC1321x
LGA voiding
AN3281
Lead Free reflow soldering profile BGA
AN1902
AN3311
fr-5 laminate
BGA PACKAGE thermal resistance Freescale
bga PCB footprint
reflow profile FOR LGA COMPONENTS
LGA PACKAGE thermal resistance Freescale
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AN3281
Abstract: LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate
Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.1, 12/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style
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AN3311
MC1320x
MC1321x
AN3281
LGA voiding
LGA PACKAGE thermal resistance Freescale
reflow profile FOR LGA COMPONENTS
"LGA footprint"
lga components
AN1902
AN3311
BGA cte
fr-5 laminate
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Untitled
Abstract: No abstract text available
Text: Thin-Film Directional Couplers CP0603 High Directivity LGA Termination GENERAL DESCRIPTION ITF Integrated Thin-Film TECHNOLOGY DIMENSIONS: (Bottom View) The ITF LGA Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency
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CP0603
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2S110
Abstract: lp0603a1880antr 535056 LP0603
Text: Thin-Film Low Pass Filter LP0603 Lead-Free LGA Type GENERAL DESCRIPTION APPLICATIONS The LP0603 ITF Integrated Thin Film Lead-Free LGA Low Pass Filter is based on thin-film multilayer technology. The technology provides a miniature part with excellent high
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LP0603
2S110
lp0603a1880antr
535056
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CP0402A0836AL
Abstract: CP0402A0881AL CP0402A0897AL CP0402A0902AL CP0402A0942AL CP0402A0947AL CP0402A1441AL CP0402A1747AL SMA connector termination instruction 0402LGA
Text: Thin-Film Directional Couplers CP0402 High Directivity LGA Termination GENERAL DESCRIPTION ITF Integrated Thin-Film TECHNOLOGY DIMENSIONS: (Bottom View) The ITF High Directivity LGA Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high
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CP0402
CP0402A0836AL
CP0402A0881AL
CP0402A0897AL
CP0402A0902AL
CP0402A0942AL
CP0402A0947AL
CP0402A1441AL
CP0402A1747AL
SMA connector termination instruction
0402LGA
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Untitled
Abstract: No abstract text available
Text: Thin-Film Low Pass Filter LP0603 Lead-Free LGA Type GENERAL DESCRIPTION APPLICATIONS The LP0603 ITF Integrated Thin Film Lead-Free LGA Low Pass Filter is based on thin-film multilayer technology. The technology provides a miniature part with excellent high
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LP0603
900MHz-5
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Untitled
Abstract: No abstract text available
Text: Thin-Film Directional Couplers CP0402 High Directivity LGA Termination GENERAL DESCRIPTION ITF Integrated Thin-Film TECHNOLOGY DIMENSIONS: (Bottom View) The ITF High Directivity LGA Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high
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CP0402
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Untitled
Abstract: No abstract text available
Text: Thin-Film Directional Couplers CP0603 High Directivity LGA Termination GENERAL DESCRIPTION ITF Integrated Thin-Film TECHNOLOGY DIMENSIONS: (Bottom View) The ITF LGA Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency
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CP0603
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LGA rework
Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework
Text: Freescale Semiconductor Application Note Document Number: AN3241 Rev. 1.0, 10/2009 Land Grid Array LGA Package Rework 1 Introduction This application note describes rework considerations for the Land Grid Array (LGA) style package. Freescale has introduced radio frequency (RF) modules
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AN3241
MC1320x
MC1321x
LGA rework
AN2920
cte table flip chip substrate
Solder Paste, Indium reflow process control
LGA voiding
AN1902
AN3241
BGA cte
reflow profile FOR LGA COMPONENTS
ceramic rework
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CP0603A0942CL
Abstract: CP0603A0881BL CP0603A0836AL CP0603A0881AL CP0603A0836CL CP0603
Text: Thin-Film Directional Couplers CP0603 High Directivity LGA Termination GENERAL DESCRIPTION ITF Integrated Thin-Film TECHNOLOGY DIMENSIONS: (Bottom View) The ITF LGA Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency
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CP0603
CP0603A0942CL
CP0603A0881BL
CP0603A0836AL
CP0603A0881AL
CP0603A0836CL
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PDF
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Untitled
Abstract: No abstract text available
Text: Thin-Film Directional Couplers CP0603 High Directivity LGA Termination GENERAL DESCRIPTION ITF Integrated Thin-Film TECHNOLOGY DIMENSIONS: (Bottom View) The ITF LGA Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency
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CP0603
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Untitled
Abstract: No abstract text available
Text: Thin-Film Directional Couplers CP0603 High Directivity LGA Termination GENERAL DESCRIPTION ITF Integrated Thin-Film TECHNOLOGY DIMENSIONS: (Bottom View) The ITF LGA Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency
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CP0603
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Untitled
Abstract: No abstract text available
Text: Thin-Film Directional Couplers CP0402 High Directivity LGA Termination GENERAL DESCRIPTION ITF Integrated Thin-Film TECHNOLOGY DIMENSIONS: (Bottom View) The ITF High Directivity LGA Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high
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CP0402
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PDF
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Untitled
Abstract: No abstract text available
Text: Thin-Film Low Pass Filter LP0603 Lead-Free LGA Type GENERAL DESCRIPTION APPLICATIONS The LP0603 ITF Integrated Thin Film Lead-Free LGA Low Pass Filter is based on thin-film multilayer technology. The technology provides a miniature part with excellent high
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LP0603
900MHz
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CP0603A1880BN
Abstract: CP0603A0942BN CP0603A0881AN CP0603A1747CN CP0603A0836BN CP0603A1960HN CP0603A2442CN CP0603A0902DN CP0603A2442AN CP0603A0942CN
Text: Thin-Film Directional Couplers CP0603 High Directivity LGA Termination GENERAL DESCRIPTION ITF Integrated Thin-Film TECHNOLOGY DIMENSIONS: (Bottom View) The ITF LGA Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency
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CP0603
CP0603A1880BN
CP0603A0942BN
CP0603A0881AN
CP0603A1747CN
CP0603A0836BN
CP0603A1960HN
CP0603A2442CN
CP0603A0902DN
CP0603A2442AN
CP0603A0942CN
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LICC
Abstract: kyocera mlcc military capacitors lga components
Text: Land Grid Array LGA Low Inductance Capacitor Advantages in Military and Aerospace Applications A B S T R A C T : The benefits of Land Grid Array (LGA) capacitors and superior low inductance performance in modern military and aerospace designs. Sonja Brown
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S-LGA0M806-N
LICC
kyocera mlcc
military capacitors
lga components
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LP0603A0947ANTR
Abstract: LP0603A1747ANTR LP0603A1842ANTR LP0603A1880ANTR LP0603A1950ANTR LP0603A2140ANTR LP0603A2442ANTR LP0603
Text: Thin-Film Low Pass Filter LP0603 Lead-Free LGA Type GENERAL DESCRIPTION APPLICATIONS The LP0603 ITF Integrated Thin Film Lead-Free LGA Low Pass Filter is based on thin-film multilayer technology. The technology provides a miniature part with excellent high
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LP0603
900MHz
LP0603A0947ANTR
LP0603A1747ANTR
LP0603A1842ANTR
LP0603A1880ANTR
LP0603A1950ANTR
LP0603A2140ANTR
LP0603A2442ANTR
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CP0603A5000DN
Abstract: No abstract text available
Text: Thin-Film Directional Couplers CP0603 High Directivity LGA Termination GENERAL DESCRIPTION ITF Integrated Thin-Film TECHNOLOGY DIMENSIONS: (Bottom View) The ITF LGA Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency
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CP0603
CP0603A5000DN
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