LGA voiding
Abstract: AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale
Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.0, 10/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style
|
Original
|
AN3311
MC1320x
MC1321x
LGA voiding
AN3281
Lead Free reflow soldering profile BGA
AN1902
AN3311
fr-5 laminate
BGA PACKAGE thermal resistance Freescale
bga PCB footprint
reflow profile FOR LGA COMPONENTS
LGA PACKAGE thermal resistance Freescale
|
PDF
|
AN3281
Abstract: LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate
Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.1, 12/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style
|
Original
|
AN3311
MC1320x
MC1321x
AN3281
LGA voiding
LGA PACKAGE thermal resistance Freescale
reflow profile FOR LGA COMPONENTS
"LGA footprint"
lga components
AN1902
AN3311
BGA cte
fr-5 laminate
|
PDF
|
LGA rework
Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework
Text: Freescale Semiconductor Application Note Document Number: AN3241 Rev. 1.0, 10/2009 Land Grid Array LGA Package Rework 1 Introduction This application note describes rework considerations for the Land Grid Array (LGA) style package. Freescale has introduced radio frequency (RF) modules
|
Original
|
AN3241
MC1320x
MC1321x
LGA rework
AN2920
cte table flip chip substrate
Solder Paste, Indium reflow process control
LGA voiding
AN1902
AN3241
BGA cte
reflow profile FOR LGA COMPONENTS
ceramic rework
|
PDF
|
LICC
Abstract: kyocera mlcc military capacitors lga components
Text: Land Grid Array LGA Low Inductance Capacitor Advantages in Military and Aerospace Applications A B S T R A C T : The benefits of Land Grid Array (LGA) capacitors and superior low inductance performance in modern military and aerospace designs. Sonja Brown
|
Original
|
S-LGA0M806-N
LICC
kyocera mlcc
military capacitors
lga components
|
PDF
|
reflow profile FOR LGA COMPONENTS
Abstract: LGA PACKAGE thermal resistance an103r paste profile solder joint AN103 lga components LGA land pattern stencil Enpirion
Text: Enpirion, Inc. EN53x0D AN103_R0.9 Soldering Module Packages Having Large Asymmetric Pads 1.0 INTRODUCTION Enpirion’s power converter packages utilize module package technology to form Land Grid Array LGA packages. LGA module package technology provides additional
|
Original
|
EN53x0D
reflow profile FOR LGA COMPONENTS
LGA PACKAGE thermal resistance
an103r
paste profile
solder joint
AN103
lga components
LGA land pattern
stencil
Enpirion
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 3x3 mm LGA Package Guidelines for Printed Circuit Board Design This technical note is intended to provide information about Kionix’s 3 x 3 mm LGA packages and guidelines for developing PCB land pattern layouts. These guidelines are general in nature and based on recommended industry practices.
|
Original
|
03-July-08
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 2x2 mm LGA Package Guidelines for Printed Circuit Board Design This technical note is intended to provide information about Kionix’s 2 x 2 mm LGA packages and guidelines for developing PCB land pattern layouts. These guidelines are general in nature and based on recommended industry practices.
|
Original
|
20-April-2012
|
PDF
|
LGA land pattern
Abstract: cases lga components
Text: LGA LAND PATTERN DIMENSIONS b2 e b2 e P-FLGA Unit:mm Pin pitch Land Pattern Dimensions Remark e Land dimeter φ b 2 0.80 0.65 0.45 0.35 0.50 0.24 to 0.30 (The reference value) Only representative dimensions are inscribed above. As there are cases where the dimensions
|
Original
|
|
PDF
|
ST LGA marking code
Abstract: No abstract text available
Text: 3x5 mm LGA Package Guidelines for Printed Circuit Board Design This technical note is intended to provide information about Kionix’s 3 x 5 mm LGA packages and guidelines for developing PCB land pattern layouts. These guidelines are general in nature and based on recommended industry practices.
|
Original
|
03-July-2008
ST LGA marking code
|
PDF
|
Untitled
Abstract: No abstract text available
Text: LGPS SERIES CONNECTORS 1.27mm .050" Contact Spacing, Land Grid Array Sockets • • • • • • • • • • • • • • The LGPS Series connector is a low profile connector for LGA (Land Grid Array) Packages with 599 contacts. The connector
|
Original
|
UL94V-0,
|
PDF
|
lga 115
Abstract: No abstract text available
Text: LGPS SERIES CONNECTORS 1.27mm .050" Contact Spacing, Land Grid Array Sockets • • • • • • • • • • • • • • The LGPS Series connector is a low profile connector for LGA (Land Grid Array) Packages with 599 contacts. The connector
|
Original
|
|
PDF
|
IPC-7527
Abstract: LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT
Text: Application Note 100 February 2006 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single
|
Original
|
101752C
01049A
an100fb
AN100-10
434-0507CAwww
IPC-7527
LGA voiding
koki solder paste
LTM4600
IPC-7525
reflow profile FOR LGA COMPONENTS
LGA land pattern
IPC7525 for lga
LGA 32 land pattern
Solder Paste, Indium 5.1 AT
|
PDF
|
IPC-7527
Abstract: IPC-7525 koki solder paste IPC7527
Text: Application Note 100 June 2005 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single
|
Original
|
101752C
01049A
an100p
AN100-10
434-0507CAwww
IPC-7527
IPC-7525
koki solder paste
IPC7527
|
PDF
|
C2084
Abstract: AM05-0006 AM05-0005 AM05-0005-TB AM05-0006-TB
Text: Application Note C2084 Ceramic Surface Mount Amplifier Rev. V3 1. Introduction M/A-COM’s Ceramic Surface Mount amplifier platform offers superior intermodulation performance for IF amplifiers in a commercial LGA Land Grid Array package. This design approach
|
Original
|
C2084
AM05-0006
AM05-0006-TB
AM05-0005
AM05-0005-TB
AM05-000reserve
AM05-0005/6
C2084
AM05-0006
AM05-0005
AM05-0005-TB
AM05-0006-TB
|
PDF
|
|
|
LGA1366
Abstract: 1981467-1 LGA-1366 LGA rework Socket 1366 reflow profiles MMC socket socket LGA 1366 PEAK tray drawing X-1981837-X pcb warpage* in smt reflow
Text: Lever Actuated Land Grid Array LGA1366 Socket Application Specification 114-5432 24 Sep ’08 Rev.A 1. INTRODUCTION This specification covers the requirements for application of lever-actuated LGA1366 Socket position onto printed circuit board PCB . The socket accepts 1366-position LGA
|
Original
|
LGA1366
LGA1366
1366-position
016mm
Table12.
Table12
1981467-1
LGA-1366
LGA rework
Socket 1366 reflow profiles
MMC socket
socket LGA 1366
PEAK tray drawing
X-1981837-X
pcb warpage* in smt reflow
|
PDF
|
C25704-002
Abstract: LGA 775 SOCKET PIN LAYOUT Nidec fan C25704-002 intel fan socket 775 air output lga 775 motherboard drawings lga 775 socket details C25704 6010a AL322 Loctite 7452
Text: Intel Celeron® D Processor in the 775-Land LGA Package for Embedded Applications Thermal Design Guide July 2005 Order #303730-002 Contents INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS
|
Original
|
775-Land
C69175
PSC-2U001
C25704-002
LGA 775 SOCKET PIN LAYOUT
Nidec fan C25704-002
intel fan socket 775 air output
lga 775 motherboard drawings
lga 775 socket details
C25704
6010a
AL322
Loctite 7452
|
PDF
|
Untitled
Abstract: No abstract text available
Text: AH4 The Communications Edge Advanced Product Information High Dynamic Range Amplifier Product Features Product Description Functional Diagram The AH4 is a high dynamic range amplifier • 0.25-6 GHz Bandwidth Pin 1 indicator packaged in a Land Grid Array LGA surface
|
Original
|
1-800-WJ1-4401
|
PDF
|
LGA voiding
Abstract: IPC-7527 IPC7525 lga material koki solder paste LTM4600 an100fc AN100 IPC7525 reflowing profiles lga Water soluble flux
Text: Application Note 100 February 2006 Revised January 2008 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 Introduction The Linear Technology Module solution combines integrated circuits and passive components in a single package.
|
Original
|
101752C
01049A
an100fc
AN100-14
LGA voiding
IPC-7527
IPC7525 lga material
koki solder paste
LTM4600
an100fc
AN100
IPC7525
reflowing profiles lga
Water soluble flux
|
PDF
|
ATT0805-03R0DB-T1
Abstract: No abstract text available
Text: AT02M750.04 - Page 1 of 2 Preliminary Currently in development Construction: • High Purity Alumina Substrate Ni alloy thin-film resistive elements Ground-Signal-Ground GSG , Land Grid Array (LGA) construction Immersion gold over Ni terminations
|
Original
|
AT02M750
0-10dB
DC-30Ghz
ATT0805
10GHz
10GHz
20GHz
20GHz
30GHz
ATT0805-03R0DB-T1
|
PDF
|
RF Board 600-034
Abstract: 25361 895910 data+8873+64+pin+colour+tv+ic
Text: AH4 The Communications Edge High Dynamic Range Amplifier Product Features Product Description Functional Diagram The AH4 is a high dynamic range amplifier • 0.25-6 GHz Bandwidth Pin 1 indicator packaged in a Land Grid Array LGA surface • 41 dBm Output IP3
|
Original
|
1-800-WJ1-4401
RF Board 600-034
25361
895910
data+8873+64+pin+colour+tv+ic
|
PDF
|
AH 05
Abstract: AH05AB
Text: AH4 The Communications Edge High Dynamic Range Amplifier Actual Size Product Description The AH4 is a high dynamic range amplifier packaged in a Land Grid Array LGA surface mount package for applications thru 6 GHz. The combination of low noise figure and high output
|
Original
|
1-800-WJ1-4401
AH 05
AH05AB
|
PDF
|
C25704-002
Abstract: LGA 775 Socket PIN layout Nidec fan C25704-002 LGA775 thermal design guide PENTIUM D lga775 WIRING 33 2U nidec 775 AVC cooler LGA775 SOCKET PIN LAYOUT lga 775 socket details
Text: Intel Pentium® 4 Processor on 90 nm Process in the 775-Land LGA Package for Embedded Applications Thermal Design Guide July 2005 Order #302822-002 Contents INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS
|
Original
|
775-Land
C69175
PSC-2U001
775-Land
C25704-002
LGA 775 Socket PIN layout
Nidec fan C25704-002
LGA775 thermal design guide
PENTIUM D lga775 WIRING
33 2U
nidec 775
AVC cooler
LGA775 SOCKET PIN LAYOUT
lga 775 socket details
|
PDF
|
lga16 land pattern
Abstract: LGA16 footprint TN0018 LGA 16L 4x4x1 LGA16 L footprint LGA16 LGA land pattern ST LGA-16 JESD97
Text: TN0018 Technical note Linear accelerometers in LGA package surface mounting guidelines Introduction This document is a general guidelines about soldering accelerometer products packaged in LGA surface mount. Note: April 2008 Data provided in this document are to be intended as reference for PCB design and
|
Original
|
TN0018
lga16 land pattern
LGA16 footprint
TN0018
LGA 16L
4x4x1
LGA16 L footprint
LGA16
LGA land pattern
ST LGA-16
JESD97
|
PDF
|
LGA16 footprint
Abstract: TN0018 lga16 land pattern LGA16 L footprint 788755 LGA voiding LGA16 JESD97 LGA14 lga16 land
Text: TN0018 Technical note Linear accelerometers in LGA package surface mounting guidelines Abstract This document is a general guidelines about soldering accelerometer products packaged in LGA surface mount. October 2006 Rev 1 1/13 www.st.com Contents TN0018 Contents
|
Original
|
TN0018
LGA16 footprint
TN0018
lga16 land pattern
LGA16 L footprint
788755
LGA voiding
LGA16
JESD97
LGA14
lga16 land
|
PDF
|