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    LGA RESISTANCE Search Results

    LGA RESISTANCE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    NTHBR13A1001SR Amphenol Communications Solutions NETbridge+ 1x3, Right Angle , Unseal A code ,100MΩ insulation resistance,Surface Mount termination. Visit Amphenol Communications Solutions
    NTHBR11B1001SR Amphenol Communications Solutions NETbridge+ 1x1 Right Angle Unseal B code ,100MΩ resistance insulation,3A,Surface Mount termination. Visit Amphenol Communications Solutions
    NTHBR13D1001SR Amphenol Communications Solutions NETbridge+ 1x3 Right Angle Unseal D code ,100MΩ resistance insulation,3A,Surface Mount termination. Visit Amphenol Communications Solutions
    NTHBR22Z1001SR Amphenol Communications Solutions NETbridge+ 2x2 Right Angle Unseal Z code ,100MΩ resistance insulation,3A,Surface Mount termination. Visit Amphenol Communications Solutions
    NTHBV11B1001SR Amphenol Communications Solutions NETbridge+ 1x1 Vertical Seal B code W/O Cap ,100MΩ resistance insulation,3A,Surface Mount termination. Visit Amphenol Communications Solutions

    LGA RESISTANCE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    LGC-KP609

    Abstract: LGA-S601LC LGA-S620LC
    Text: Optical Fiber Connectors MU-Type Optical Fixed Attenuator Optical Fixed Attenuator MU-Type MU-Type Optical Fixed Attenuator Item number Mode Attenuation Quantity and Tolerance LGA-S601KCA 1±0.5dB LGA-S603KCA 3±1.0dB LGA-S605KCA LGA-S610KCA Single Mode 5±1.5dB


    Original     		LGA-S601KCA LGA-S603KCA LGA-S605KCA LGA-S610KCA LGA-S615KCA LGA-S620KCA 100mW LGC-KP609) LGA-S601LC LGA-S603LC LGC-KP609 LGA-S620LC PDF

    Untitled

    Abstract: No abstract text available
    Text: Optical Fiber Connectors SC-Type Optical Fixed Attenuator Optical Fixed Attenuator SC-Type SC-Type Optical Fixed Attenuators Item number Mode Attenuation Quantity and Tolerance LGA-SHP305S 5±1.5dB LGA-SHP310S 10±1.5dB LGA-SHP320S Optical Max Resistance Input


    Original     		LGA-SHP303S LGA-SHP305S LGA-SHP310S LGA-SHP315S LGA-SHP320S LGA-SHP325S LGA-SHP330S LGA-G303L LGA-G305L LGA-G310L PDF

    LGA-G103

    Abstract: No abstract text available
    Text: Optical Fiber Connectors FC-Type Optical Fixed Attenuator Optical Fixed Attenuator FC-Type FC-Type Optical Fixed Attenuator Mode Single Mode 10±1.5dB LGA-SE115C 15±1.5dB LGA-SE120C 20±1.5dB LGA-SHPE105C 5±1.5dB LGA-SHPE110C 10±1.5dB Single Mode 1.55 Single Mode


    Original     		LGA-SE103C LGA-SE105C LGA-SE110C LGA-SE115C LGA-SE120C LGA-SHPE105C LGA-SHPE110C LGA-SHPE115C LGA-SHPE120C LGA-SHPE125C LGA-G103 PDF

    SE115

    Abstract: LGA-SE103C LGA-SE110C LGA-SE115C LGA-SE120C
    Text: t HONDA TSUSHIN KOGYO CO., LTD. Optical fiber connector FC-type optical fixed attenuator Optical fixed Attenuator FC-type jF C T y p e Optical Fixed Attenuator Item number Mode Attenuation and Tolerance LGA-SE103C 3±1.0dB LGA-SE105C 5±1.5dB LGA-SE110C Single Mode


    OCR Scan     		LGA-SE103C LGA-SE105C LGA-SE110C LGA-SE115C LGA-SE120C -10mW LGA-SHPE105C LGA-SIIPE110C LGA-SHPE115C LGA-SHPE120C SE115 LGA-SE103C LGA-SE110C LGA-SE115C LGA-SE120C PDF

    Untitled

    Abstract: No abstract text available
    Text: Intel Core i7 Processor Family for the LGA-2011 Socket Datasheet, Volume 2 Supporting Desktop Intel® Core™ i7-3960X Extreme Edition Processor for the LGA-2011 Socket Supporting Desktop Intel® Core™ i7-3000K and i7-3000 Processor Series for the LGA-2011 Socket


    Original     		LGA-2011 i7-3960X i7-3000K i7-3000 PDF

    LGA 2011 Socket diagram

    Abstract: LGA2011 LGA 2011 Socket 3930k ddr3 controller transistors F6 DD52 BJ13 VCCD01 pcie gen 2 payload i7-3930
    Text: Intel Core i7 Processor Family for the LGA-2011 Socket Datasheet, Volume 1 Supporting Desktop Intel® Core™ i7-3960X Extreme Edition Processor for the LGA-2011 Socket Supporting Desktop Intel® Core™ i7-39xxK and i7-38xx Processor Series for the LGA-2011 Socket


    Original     		LGA-2011 i7-3960X i7-39xxK i7-38xx LGA 2011 Socket diagram LGA2011 LGA 2011 Socket 3930k ddr3 controller transistors F6 DD52 BJ13 VCCD01 pcie gen 2 payload i7-3930 PDF

    LGA1366

    Abstract: LGA 1366 socket LGA 1366
    Text: Introducing Sockets and Hardware for LGA 1366 Processors TE Connectivity’s surface mount LGA socket was designed for use with Intel’s Core i7 LGA 1366 processor. The contacts have .64mm diameter solder balls for surface mount onto the PCB, while the top side provides a cantilever beam interface to the package. The


    Original     		PDF

    socket lga 1156

    Abstract: LGA1156 socket 1156 Intel lga 1156 lga 1156
    Text: Introducing Sockets and Hardware for LGA 1156 Processors TE Connectivity’s surface mount LGA socket was designed for use with Intel’s Core i7 LGA 1156 processor. The contacts have solder balls for surface mount onto the PCB, while the top side provides a cantilever beam interface to the package. The integrated lever


    Original     		PDF

    lga 1366

    Abstract: LGA1366 1981837-1 1981467-1 1939739-1 1981837-2
    Text: Introducing Sockets and Hardware for LGA 1366 Processors Tyco Electronics’ surface mount LGA socket was designed for use with Intel’s Core i7 LGA 1366 processor. The contacts have .64mm diameter solder balls for surface mount onto the PCB, while the top side provides a cantilever beam interface to the package. The


    Original     		PDF

    lga 1156

    Abstract: socket lga 1156 LGA1156 tyco reference Socket gold Intel lga 1156 Intel nor flash
    Text: Introducing Sockets and Hardware for LGA 1156 Processors Tyco Electronics’ surface mount LGA socket was designed for use with Intel’s Core i7 LGA 1156 processor. The contacts have solder balls for surface mount onto the PCB, while the top side provides a cantilever beam interface to the package. The integrated lever


    Original     		PDF

    Solder ball shear

    Abstract: No abstract text available
    Text: SPECIFICATIONS Mechanical Socket compression force:165N min.,372N max. Durability: 20 Cycles min. Solder Ball Shear Force: 500g min. VR 372 LGA/BGA power connector LGA SMT Type 1.27X1.5mm [.05X.06”] Pitch 372 Pos. Electrical Contact Resistance : 18 mΩ max.


    Original     		13x30 Solder ball shear PDF

    Untitled

    Abstract: No abstract text available
    Text: SPECIFICATIONS Mechanical Socket compression force:165N min.,372N max. Durability: 20 Cycles min. Solder Ball Shear Force: 500g min. VR 372 LGA/BGA power connector LGA SMT Type 1.27X1.5mm [.05X.06”] Pitch 372 Pos. Electrical Contact Resistance : 18 mΩ max.


    Original     		13x30 PDF

    Untitled

    Abstract: No abstract text available
    Text: SPECIFICATIONS Mechanical Socket compression force:165N min.,372N max. Durability: 20 Cycles min. Solder Ball Shear Force: 500g min. VR 372 LGA/BGA power connector LGA SMT Type 1.27X1.5mm [.05X.06”] Pitch 372 Pos. Electrical Contact Resistance : 18 mΩ max.


    Original     		13x30 PDF

    reflow profile FOR LGA COMPONENTS

    Abstract: LGA PACKAGE thermal resistance an103r paste profile solder joint AN103 lga components LGA land pattern stencil Enpirion
    Text: Enpirion, Inc. EN53x0D AN103_R0.9 Soldering Module Packages Having Large Asymmetric Pads 1.0 INTRODUCTION Enpirion’s power converter packages utilize module package technology to form Land Grid Array LGA packages. LGA module package technology provides additional


    Original     		EN53x0D reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance an103r paste profile solder joint AN103 lga components LGA land pattern stencil Enpirion PDF

    EIA-364 65A

    Abstract: lga components LGA resistance EIA-364-65A 0.5mm pitch BGA EIA-364-27 EIA-364-28 EIA-364-31 EIA-364-32 LGA PACKAGE thermal resistance
    Text: 0.5 mm LGA/BGA Sockets DESCRIPTION Tyco Electronics’ polymer interconnect technology optimizes socketing of 0.5 mm pitch LGA or BGA devices. This highly conductive polymer contact provides electrically transparent signal transfer. APPLICATIONS • • •


    Original     		8-1773444-1-CC LH-PDF-07/06 EIA-364 65A lga components LGA resistance EIA-364-65A 0.5mm pitch BGA EIA-364-27 EIA-364-28 EIA-364-31 EIA-364-32 LGA PACKAGE thermal resistance PDF

    LGA16 footprint

    Abstract: TN0018 lga16 land pattern LGA16 L footprint 788755 LGA voiding LGA16 JESD97 LGA14 lga16 land
    Text: TN0018 Technical note Linear accelerometers in LGA package surface mounting guidelines Abstract This document is a general guidelines about soldering accelerometer products packaged in LGA surface mount. October 2006 Rev 1 1/13 www.st.com Contents TN0018 Contents


    Original     		TN0018 LGA16 footprint TN0018 lga16 land pattern LGA16 L footprint 788755 LGA voiding LGA16 JESD97 LGA14 lga16 land PDF

    LGA voiding

    Abstract: AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale
    Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.0, 10/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style


    Original     		AN3311 MC1320x MC1321x LGA voiding AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale PDF

    AN3281

    Abstract: LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate
    Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.1, 12/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style


    Original     		AN3311 MC1320x MC1321x AN3281 LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate PDF

    LICC

    Abstract: kyocera mlcc military capacitors lga components
    Text: Land Grid Array LGA Low Inductance Capacitor Advantages in Military and Aerospace Applications A B S T R A C T : The benefits of Land Grid Array (LGA) capacitors and superior low inductance performance in modern military and aerospace designs. Sonja Brown


    Original     		S-LGA0M806-N LICC kyocera mlcc military capacitors lga components PDF

    LGS-5A-15-OV-R

    Abstract: Lambda Hybrid LGS-FA-28-OV-R lambda lgs f 28 ov r LGS-FA-15-0V-R lambda lg lgs-eea lambda lga f lambda lgs-eea-15 lambda LAS
    Text: 5 YEAR GUARANTEED SWITCHING Lambda LG and LGA series Features—LG and LGA series 5-year guaranteed switching power supplies Sprague computer grade hermetically sealed 10-year life electrolytic capacitor 4 package sizes up to 190A, up to 48 Volts Hermetically sealed semiconductors


    OCR Scan     		LAS-3800 MIL-T-27C MIL-STD-810C, MIL-I-6181D 10-year I--13 LGS-5A-15-OV-R Lambda Hybrid LGS-FA-28-OV-R lambda lgs f 28 ov r LGS-FA-15-0V-R lambda lg lgs-eea lambda lga f lambda lgs-eea-15 lambda LAS PDF

    X-RAY INSPECTION

    Abstract: LGA Application Notes motorola 12x12mm BGA package thermal resistance LGA Application Notes pitch 0.4mm BGA solder wire 0.3 mm lga components s3527 LGA PACKAGE thermal resistance
    Text: Freescale Semiconductor, Inc. Application Note AN2265/D Rev. 0, 03/2002 LGA Application Notes Freescale Semiconductor, Inc. by Thomas Koschmieder and Michael Leoni Introduction The Land Grid Array LGA is an area array matrix package that uses solder paste as


    Original     		AN2265/D 26mm-0 X-RAY INSPECTION LGA Application Notes motorola 12x12mm BGA package thermal resistance LGA Application Notes pitch 0.4mm BGA solder wire 0.3 mm lga components s3527 LGA PACKAGE thermal resistance PDF

    lga16 land pattern

    Abstract: LGA16 footprint TN0018 LGA 16L 4x4x1 LGA16 L footprint LGA16 LGA land pattern ST LGA-16 JESD97
    Text: TN0018 Technical note Linear accelerometers in LGA package surface mounting guidelines Introduction This document is a general guidelines about soldering accelerometer products packaged in LGA surface mount. Note: April 2008 Data provided in this document are to be intended as reference for PCB design and


    Original     		TN0018 lga16 land pattern LGA16 footprint TN0018 LGA 16L 4x4x1 LGA16 L footprint LGA16 LGA land pattern ST LGA-16 JESD97 PDF

    land pattern 0805

    Abstract: T5500
    Text: FL02M653.02 - Page 1 of 2 Product Family: Bessel Absorptive Filter—5th Order, LGA Part Number Series: FL5-LGA Series Construction: Features: •       High Purity Alumina Substrate Nickel alloy thin-film resistive element


    Original     		FL02M653 -10dB 100mA 100Mohm 50Vdc land pattern 0805 T5500 PDF

    T5500

    Abstract: thin film filter
    Text: FL02M651.03 - Page 1 of 3 Product Family: Bessel Absorptive Filter—7th Order, LGA Part Number Series: FL7-LGA Series Construction: Features: •      High Purity Alumina Substrate Nickel alloy thin-film resistive element


    Original     		FL02M651 T5500 thin film filter PDF