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Sugatsune Kogyo Co Ltd MC-28/BLK
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MC28B Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
MC28B		National Semiconductor	28 Lead Ceramic Small Outline Package, EPROM NS Package		Original	PDF

MC28B Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
MC28B Abstract: No abstract text available Text: 28 Lead Ceramic Small Outline Package EPROM NS Package Number MC28B All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL	Original	PDF	MC28B MC28B
transistor BC 458 Abstract: transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE Text: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and	Original	PDF	MS011795 transistor BC 458 transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE
iso 1043-1 Abstract: DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A Text: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container	Original	PDF	MS011809-4 MS011809-1 MS011809-5 MS011809-2 MS011809-6 MS011809-3 MS011809-7 MS011809 iso 1043-1 DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A
MC20B Abstract: CERAMIC SMALL OUTLINE PACKAGE CSOP MC16A MC20A MC24A MC28A MC28B csop16 csop Text: Ceramic Small Outline Package CSOP 16 Lead Ceramic Small Outline Package NS package Number MC16A 2000 National Semiconductor Corporation MS101110 www.national.com Ceramic Small Outline Package (CSOP) August 1999 Ceramic Small Outline Package (CSOP) 20 Lead Ceramic Small Outline Package	Original	PDF	MC16A MS101110 MC20A MC20B MC24A MC28A MC20B CERAMIC SMALL OUTLINE PACKAGE CSOP MC16A MC20A MC24A MC28A MC28B csop16 csop
iso 1043-1 Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray Text: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container	Original	PDF	MS011809-4 MS011809-1 MS011809-5 MS011809-2 MS011809-6 MS011809-3 MS011809-7 MS011809 iso 1043-1 DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray
transistor BC 458 Abstract: transistor a42 MO-003 transistor Bc 540 ua109a CERAMIC PIN GRID ARRAY CPGA lead frame transistor bc 577 W144A UA65A CERAMIC QUAD FLATPACK CQFP Text: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and	Original	PDF