Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    MQFP 28X28 Search Results

    MQFP 28X28 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    HSP50214BVI Renesas Electronics Corporation Programmable Downconverter, MQFP-HS, /Tray Visit Renesas Electronics Corporation
    HSP50214BVC Renesas Electronics Corporation Programmable Downconverter, MQFP-HS, /Tray Visit Renesas Electronics Corporation
    ISL54100CQZ Renesas Electronics Corporation TMDS Regenerators with Multiplexers, MQFP, /Tray Visit Renesas Electronics Corporation
    ISL54102CQZ Renesas Electronics Corporation TMDS Regenerators with Multiplexers, MQFP, /Tray Visit Renesas Electronics Corporation
    HSP50415VI Renesas Electronics Corporation Wideband Programmable Modulator (WPM), MQFP-HS, /Tray Visit Renesas Electronics Corporation
    SF Impression Pixel

    MQFP 28X28 Price and Stock

    EPAK MQFP28X28X3.4MM

    Electronic Component
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    ComSIT USA MQFP28X28X3.4MM 90
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 -
    		Get Quote

    ITW CAMTEX MQFP28X28X3.4

    Electronic Component
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    ComSIT USA MQFP28X28X3.4 90
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 -
    		Get Quote

    PCT MQFP28X28

    Electronic Component
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    ComSIT USA MQFP28X28 81
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 -
    		Get Quote

    MQFP 28X28 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ipc-SM-782

    Abstract: 14x14-64 MQFP 14X14 AN49 fairchild 245
    Text: www.fairchildsemi.com Application Note 49 Land Patterns for Surface Mount Metric Quad Flat Pack MQFP Devices The use of MQFP packaged devices has increased over the last several years. Along with the increase comes the need for standard package outlines and standard sets of data to


    Original     		PDF AN30000049 ipc-SM-782 14x14-64 MQFP 14X14 AN49 fairchild 245

    ipc-SM-782

    Abstract: 128 QFP 14x20 footprint jedec mo-108 RAYTHEON Raytheon Electronics MQFP 80 PACKAGE qfp 64 land pattern qfp land pattern QFP-10X10-44 Raytheon Company
    Text: Electronics Semiconductor Division Application Note 49 Land Patterns for Surface Mount Metric Quad Flat Pack MQFP Devices The use of MQFP packaged devices has increased over the last several years. Along with the increase comes the need for standard package outlines and standard sets of data to


    Original     		PDF AN30000049 ipc-SM-782 128 QFP 14x20 footprint jedec mo-108 RAYTHEON Raytheon Electronics MQFP 80 PACKAGE qfp 64 land pattern qfp land pattern QFP-10X10-44 Raytheon Company

    Untitled

    Abstract: No abstract text available
    Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3508A-1 MQFP 28x28 3.2mm 256 pin QFP 28 × 28 Terminal Spacing Linear = 0.4 A B 192 193 129 128 F Q R D C S detail of lead end 256 1 65 64 G H I M J M P K N L NOTE Each lead centerline is located within 0.09 mm (0.004 inch) of


    Original     		PDF LA-3508A-1 S256GD-40-LMV,

    P120GD-80-LBB

    Abstract: No abstract text available
    Text: Packing NEC Tray JEDEC Tray Name LA-3508A-1 MQFP 28x28 3.2mm OT-001T-01 Mounting Pad 120 pin QFP 28 × 28 Terminal Spacing Linear = 0.8 A B 90 61 91 60 F 120 1 R Q S D C detail of lead end 31 30 J G H I M M P K N ITEM NOTE Each lead centerline is located within 0.15 mm (0.006 inch) of


    Original     		PDF LA-3508A-1 OT-001T-01 P120GD-80-LBB, P120GD-80-LBB

    IPC-7351

    Abstract: ipc7351 LQFP_EP IPC 7351 ADSP-21369 land pattern for MQFP MQFP 28x28 ADSP-21371 ADSP21369 EE-notes ee-notes for ADSP-21369
    Text: Engineer-to-Engineer Note a EE-313 Technical notes on using Analog Devices DSPs, processors and development tools Visit our Web resources http://www.analog.com/ee-notes and http://www.analog.com/processors or e-mail [email protected] or [email protected] for technical support.


    Original     		PDF EE-313 28x28 ADSP-21369 ADSP-21371 IPC-7351" IPC-7351, EE-313) IPC-7351 ipc7351 LQFP_EP IPC 7351 land pattern for MQFP MQFP 28x28 ADSP-21371 ADSP21369 EE-notes ee-notes for ADSP-21369

    microprocessors architecture of 8251

    Abstract: microprocessors interface 8086 to 8251 Mitel Semiconductor process flow 8251 uart vhdl UART 8251 DS4812 CLA200
    Text: CLA200 Series CMOS Gate Arrays Advance Information DS4812 - 1.3 July 1997 INTRODUCTION The CLA200 Series Arrays from Mitel Semiconductor offer designers the capability to integrate designs of more than 2 million gates. There are 14 fixed arrays optimised for low to


    Original     		PDF CLA200 DS4812 microprocessors architecture of 8251 microprocessors interface 8086 to 8251 Mitel Semiconductor process flow 8251 uart vhdl UART 8251

    8251 uart vhdl

    Abstract: microprocessors interface 8086 to 8251 microprocessors architecture of 8251 DS4812 8048 8251 8086 microprocessor kit manual
    Text: CLA200 Series CMOS Gate Arrays Advance Information DS4812 ISSUE 1.3 July 1997 INTRODUCTION The CLA200 Series Arrays from Zarlink Semiconductor offer designers the capability to integrate designs of more than 2 million gates. There are 14 fixed arrays optimised for low to


    Original     		PDF CLA200 DS4812 8251 uart vhdl microprocessors interface 8086 to 8251 microprocessors architecture of 8251 DS4812 8048 8251 8086 microprocessor kit manual

    zarlink clt

    Abstract: 8251 uart vhdl microprocessors architecture of 8251 microprocessors interface 8086 to 8251 Zarlink CLA200 CLA200 Series UART 8251 DS4812 zarlink asic
    Text: CLA200 Series CMOS Gate Arrays Advance Information DS4812 ISSUE 1.3 July 1997 INTRODUCTION The CLA200 Series Arrays from Zarlink Semiconductor offer designers the capability to integrate designs of more than 2 million gates. There are 14 fixed arrays optimised for low to


    Original     		PDF CLA200 DS4812 zarlink clt 8251 uart vhdl microprocessors architecture of 8251 microprocessors interface 8086 to 8251 Zarlink CLA200 CLA200 Series UART 8251 DS4812 zarlink asic

    FPQ 208 0.5 10

    Abstract: FPQ Package FPQ-256 FPQ 240 FPQ-240-0 FPQ-240-0.5 FPQ-48-0 FPQ-52-0.65-01A 52 FPQ-64 FPQ-44-0
    Text: QFP QUAD FLAT PACKAGE ORDERING PROCEDURE FPQ □□□ □. □□ □□ Design NO. Pitch Pin Count Socket Series SPECIFICATIONS Contact resistance: Initial 30mΩ At 10 mA Maximum voltage: AC700V RMS (for 1 minute) Below 0.5mm Pitch


    Original     		PDF AC700V AC500V FPQ-44-0 FPQ-44-0. FPQ 208 0.5 10 FPQ Package FPQ-256 FPQ 240 FPQ-240-0 FPQ-240-0.5 FPQ-48-0 FPQ-52-0.65-01A 52 FPQ-64

    EIA 481 QFN pin 1

    Abstract: smd transistor 5c sot-23 TB347 SMD 504 5E smd transistor 5d sot-23 MO-169 fbga196 TQFP 48-1 PACKAGE WLCSP 7x7x1
    Text: Tape and Reel Specification for Integrated Circuits Technical Brief January 5, 2007 TB347.10 Author: Laszlo Nemeth Introduction • EIA-481 for the. . . . . . . . . . . . . . . . 8, 12, 16, 24, 32, 44 and 56mm Wide Tape Many surface mounted devices SMD are being packaged


    Original     		PDF TB347 EIA-481 EIA 481 QFN pin 1 smd transistor 5c sot-23 SMD 504 5E smd transistor 5d sot-23 MO-169 fbga196 TQFP 48-1 PACKAGE WLCSP 7x7x1

    21x21

    Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1
    Text: 検索ツール 1. ツールバーの アイコンをクリックしてください。 2. ［検索］のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して， 検索 F をクリックしてください。


    Original     		PDF P22C100300A1 P8C-100-300B P8CT-100-300B2-1 P8C-100-300A-1 P-DIP8-0300-2 MD300-2A MD300-1A MD300-09A 21x21 MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1

    MD300-10A

    Abstract: P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1
    Text: Find tool 1. Click button in the Toolbar. 2. Search dialog box is displayed. 3. Enter a NEC code to be searched and click Find . Caution Don't use the wild card *) when entering a NEC code. Ex.) Find Find What P22C-100-300A-1 Match Whole Word Only Match Case


    Original     		PDF P22C-100-300A-1 P8C-100-300B P-DIP8-0300-2 MD300-2A P8CT-100-300B2-1 MD300-1A P8C-100-300A-1 X13769XJ2V0CD00 MD300-10A P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1

    Untitled

    Abstract: No abstract text available
    Text: Technical Brief 347 Tape and Reel Specification for Integrated Circuits Introduction Many Surface Mounted Devices SMDs are being packaged for shipment in embossed tape and wound onto reels. The Intersil tape and reel specifications are in compliance with


    Original     		PDF EIA-481 TB347

    ps2 keyboard interface in arm7

    Abstract: ARM720T 16C550 AX07PT7202 AMBA APB UART CABGA 8X8
    Text: Mixed-Signal Products AX07PT7202 Product Summary ARM720T Microcontroller with Embedded Peripherals Preliminary Data Sheet December 1, 2003 www.aeroflex.com/ARM7 FEATURES ‰ Debug interface and boundary scan ‰ 32-bit ARM720T core with cache and MMU ‰ 3.3V supply voltage


    Original     		PDF AX07PT7202 ARM720T® 32-bit ARM720T 70MHz 256-pin ps2 keyboard interface in arm7 16C550 AMBA APB UART CABGA 8X8

    VSSO10

    Abstract: VSSO11 PM5361 PM5371 TA-NWT-000253 TU12 sot-5 theta jc value VSSO12
    Text: PM5371 TUDX DATA SHEET PMC-920525 ISSUE 6 SONET/SDH TRIBUTARY UNIT CROSS CONNECT PM5371 TUDX SONET/SDH TRIBUTARY UNIT CROSS CONNECT DATA SHEET ISSUE 6: SEPTEMBER 1998 PROPRIETARY AND CONFIDENTIAL TO PMC-SIERRA, INC., AND FOR ITS CUSTOMERS’ INTERNAL USE PM5371 TUDX


    Original     		PDF PM5371 PMC-920525 PM5371 PMC-920103 VSSO10 VSSO11 PM5361 TA-NWT-000253 TU12 sot-5 theta jc value VSSO12

    Untitled

    Abstract: No abstract text available
    Text: SEPTEMBER 1993 DS3820 - 2.0 CLA80000 SERIES HIGH DENSITY CMOS GATE ARRAYS INTRODUCTION ARRAY SIZES The new CLA80k gate array series from GEC Plessey Semiconductors offers advantages in speed and density over previous array series. The unique architecture allows


    Original     		PDF DS3820 CLA80000 CLA80k

    Untitled

    Abstract: No abstract text available
    Text: CLA200 Series M IT E L CMOS Gate Arrays Advance Information SEMICONDUCTOR DS4812 -1 .3 July 1997 IN TR O D U C TIO N The CLA200 Series Arrays from Mitel Semiconductor offer designers the capability to integrate designs of more than 2 million gates. There are 14 fixed arrays optimised for low to


    OCR Scan     		PDF CLA200 DS4812

    MQFP 28x28

    Abstract: No abstract text available
    Text: MHiâi a n r u g NOTE : 1. BAKEABLE TRAYS ARE INTENDED TO BE CONTINUOUSLY BAKED FOR 48 HOURS AT THE BAKE TEMPERATURE AS SPECIFIED. 2. TOTAL USABLE CELL COUNT IS 24. 3. TRAY VACUUN PICKUP METHOD REQUIRES A 28 MM SQUARE MINIMUM WALLED PICKUP AREA, LOCATED AS


    OCR Scan     		PDF 5M-1994. 1X1012 28X28 28X28 MQFP 28x28

    Arm processor vlsi technology

    Abstract: PC302 QFP 128 bonding
    Text: VLSI T e ch n o lo g y o.5-m ic r o n in c. _ PRELIMINARY ASIC PRODUCT FAMILY GENERAL SPECIFICATIONS FEATURES BENEFITS • 0.5-micron 0.45-micron effective two- and three-layer metal CMOS technology. Typical 2-input NAND (FO=2) spec


    OCR Scan     		PDF 45-micron Arm processor vlsi technology PC302 QFP 128 bonding

    Untitled

    Abstract: No abstract text available
    Text: HARRIS H S E M I C O N D U C T O R S P 4 5 1 1 6 A Numerically Controlled Oscillator/Modulator December 1996 Features Description • NCO and CMAC on One Chip The Harris HSP45116A combines a high performance quadrature numerically controlled oscillator NCO and a


    OCR Scan     		PDF HSP45116A 16-bit 1-800-4-HARRIS

    PC5004

    Abstract: VGC650 VGC6P52 VGC600 IN01D1 NR02D1 QFP 128 bonding
    Text: V L S I T ech n o lo gy, inc. O.6-MICRON _ ASIC PRODUCT FAMILY GENERAL SPECIFICATIONS FEATURES BENEFITS • 0.6-micron 0.55-micron effective two- and three-layer metal CMOS technology. Typical 2-input NAND (FO=2) spec - 5 V (4.5 to 5.5 V): 190 ps, 2.6 nW/MHz


    OCR Scan     		PDF 55-micron PC5004 VGC650 VGC6P52 VGC600 IN01D1 NR02D1 QFP 128 bonding

    Untitled

    Abstract: No abstract text available
    Text: DATA SHEET PM PMC-920525 ISSUE 6 PMC-Sierra, Inc. PM5371 tudx SONET/SDH TRIBUTARY UNIT CROSS CONNECT PM5371 TUDX SONET/SDH TRIBUTARY UNIT CROSS CONNECT DATA SHEET ISSUE 6: SEPTEMBER 1998 PROPRIETARY AND CONFIDENTIAL TO PMC-SIERRA, INC., AND FOR ITS CUSTOMERS’ INTERNAL USE


    OCR Scan     		PDF PMC-920525 PM5371 PMC-920525

    MUX2T01

    Abstract: MUX4T01
    Text: •JUL J Ü 9 S3- GEC PLES S EY J U N E 1993 S E M I C O N D U C T O R S DS3820 - 1.0 CLA80000 SERIES HIGH DENSITY CMOS GATE ARRAYS INTRODUCTION ARRAY SIZES The new CLA80k gate array series from GEC Plessey Semiconductors offers advantages in speed and density


    OCR Scan     		PDF DS3820 CLA80000 CLA80k MUX2T01 MUX4T01

    DS3820

    Abstract: No abstract text available
    Text: S i GEC PLESS EY SEPTEMBER 1993 S E M I C O N D U C T O R S DS3820 - 2.0 CLA80000 SERIES HIGH DENSITY CMOS GATE ARRAYS IN T R O D U C T IO N ARRAY SIZES The new CLA80k gate array series from GEC Plessey Semiconductors offers advantages in speed and density


    OCR Scan     		PDF DS3820 CLA80000 CLA80k