RS-468
Abstract: No abstract text available
Text: TAPE AND REEL SPECIFICATIONS T-1 PACKAGE Ordering Information To order Infrared IR Products on tape and reel or ammopack, include the appropriate standard product part number and suffix code to specify configuration and optional features. QECXXXC6R0 Category Code
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DS300359
Abstract: "Infrared photodarlington" QSC133
Text: PLASTIC SILICON INFRARED PHOTODARLINGTON QSC133 PACKAGE DIMENSIONS 0.116 2.95 REFERENCE SURFACE 0.052 (1.32) 0.032 (0.082) 0.193 (4.90) 0.030 (0.76) NOM 0.800 (20.3) MIN 0.050 (1.27) EMITTER SCHEMATIC 0.100 (2.54) NOM COLLECTOR 0.155 (3.94) 0.018 (0.46)
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QSC133
QSC133
DS300359
DS300359
"Infrared photodarlington"
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QECXXX
Abstract: QSC113 QSC114C QECXXX LED
Text: PLASTIC SILICON INFRARED PHOTOTRANSISTOR QSC112 QSC113 QSC114 PACKAGE DIMENSIONS 0.116 2.95 REFERENCE SURFACE 0.052 (1.32) 0.032 (0.082) 0.193 (4.90) 0.030 (0.76) NOM 0.800 (20.3) MIN 0.050 (1.27) EMITTER SCHEMATIC 0.100 (2.54) NOM COLLECTOR 0.155 (3.94)
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QSC112
QSC113
QSC114
QSC112/113/114
QSC114
QSC114C
QECXXX
QSC113
QECXXX LED
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QSC11
Abstract: No abstract text available
Text: QSC112, QSC113, QSC114 Plastic Silicon Infrared Phototransistor Features Description • ■ ■ ■ The QSC112/113/114 is a silicon phototransistor encapsulated in an infrared transparent, black T-1 package. Tight production distribution PACKAGE DIMENSIONS
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QSC112,
QSC113,
QSC114
QSC112/113/114
QSC11
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phototransistor infrared
Abstract: No abstract text available
Text: PLASTIC SILICON INFRARED PHOTOTRANSISTOR QSC112 QSC113 QSC114 PACKAGE DIMENSIONS 0.116 2.95 REFERENCE SURFACE 0.052 (1.32) 0.032 (0.082) 0.193 (4.90) 0.030 (0.76) NOM 0.800 (20.3) MIN 0.050 (1.27) EMITTER SCHEMATIC 0.100 (2.54) NOM COLLECTOR 0.155 (3.94)
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QSC112
QSC113
QSC114
QSC112/113/114
QSC114
QSC114C
phototransistor infrared
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4n35 optocoupler spice model
Abstract: L14F1 phototransistor datasheet MOC3043-M spice model H11F1 SPICE MODEL h11D1 spice MOC3010 spice L14F1 PHOTOTRANSISTOR slotted optocouplers DARLINGTON phototransistor l14f1 spice MOC3011
Text: Fairchild PSG.book Page i Wednesday, July 28, 2004 11:12 AM Fairchild Semiconductor Product Catalog Rev. 1 Analog & Mixed Signal Discrete Power Interface & Logic Microcontrollers Optoelectronics RF Power Front Matter.fm Page ii Monday, August 2, 2004 10:09 AM
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TS-16949
ISO-14001,
4n35 optocoupler spice model
L14F1 phototransistor datasheet
MOC3043-M spice model
H11F1 SPICE MODEL
h11D1 spice
MOC3010 spice
L14F1 PHOTOTRANSISTOR
slotted optocouplers
DARLINGTON phototransistor l14f1
spice MOC3011
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Untitled
Abstract: No abstract text available
Text: QSC112, QSC113, QSC114 Plastic Silicon Infrared Phototransistor tm Features Description • Tight production distribution The QSC112/113/114 is a silicon phototransistor encapsulated in an infrared transparent, black T-1 package. PACKAGE DIMENSIONS ■ Steel lead frames for improved reliability in solder
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QSC112,
QSC113,
QSC114
QSC112/113/114
QSC114
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Infrared Phototransistor
Abstract: Phototransistor qsc112 specification qsc112 QSC113 QSC114 QSC113_0040D
Text: QSC112, QSC113, QSC114 Plastic Silicon Infrared Phototransistor tm Features Description • Tight production distribution The QSC112/113/114 is a silicon phototransistor encapsulated in an infrared transparent, black T-1 package. PACKAGE DIMENSIONS ■ Steel lead frames for improved reliability in solder
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QSC112,
QSC113,
QSC114
QSC112/113/114
QSC114
Infrared Phototransistor
Phototransistor qsc112 specification
qsc112
QSC113
QSC113_0040D
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QSC113_0040D
Abstract: Infrared Phototransistor QSC112 QSC113 QSC114
Text: QSC112, QSC113, QSC114 Plastic Silicon Infrared Phototransistor Features Description • Tight production distribution The QSC112/113/114 is a silicon phototransistor encapsulated in an infrared transparent, black T-1 package. PACKAGE DIMENSIONS ■ Steel lead frames for improved reliability in solder
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QSC112,
QSC113,
QSC114
QSC112/113/114
QSC114
QSC113_0040D
Infrared Phototransistor
QSC112
QSC113
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QSC112
Abstract: QSC113 QSC114 QECXXX LED
Text: PLASTIC SILICON INFRARED PHOTOTRANSISTOR QSC112 QSC113 QSC114 PACKAGE DIMENSIONS 0.116 2.95 REFERENCE SURFACE 0.052 (1.32) 0.032 (0.082) 0.193 (4.90) 0.030 (0.76) NOM 0.800 (20.3) MIN 0.050 (1.27) EMITTER SCHEMATIC 0.100 (2.54) NOM COLLECTOR 0.155 (3.94)
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QSC112
QSC113
QSC114
QSC112/113/114
DS300358
QSC112
QSC113
QSC114
QECXXX LED
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QSC133
Abstract: No abstract text available
Text: PLASTIC SILICON PHOTODARLINGTON OPTOELECTRONICS QSC133 DESCRIPTION PACKAGE DIMENSIONS U _ .1 2 6 3.20 R EFER EN C E SURFACE 106(2.69) The QSC133 is a silicon photodarlington encapsulated in an infrared transparent, black T-1 package. FEATURES .042 (1.0 7 )
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QSC133
QSC133
ST2143
100fi
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B345
Abstract: wcn1
Text: [*13 PLASTIC SILICON PHOTODARLINGTON HteuM* OPTOELECTRONICS QSC133 DESCRIPTION PACKAGE DIMENSIONS L _ .126 3.20 106(2.69) REFERENCE SURFACE The QSC133 is a silicon photodarlington encapsulated in an infrared transparent, black T-1 package. FEATURES .042 (1.07)-*
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QSC133
QSC133
ST2143
B345
wcn1
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QECXXX
Abstract: No abstract text available
Text: PLASTIC SILICON PHOTODARLINGTON OPTOELECTROmCS QSC133 PA C K A G E DIM ENSIONS d e s c r ip t io n L _ 126 3.20 R EFER ENC E SURFACE .106(2.69) The QSC133 is a silicon photodarlington encapsulated in an infrared transparent, black T-1 package. FE A T U R B t
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QSC133
QSC133
ST2143
QECXXX
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C11351
Abstract: No abstract text available
Text: ] • PLASTIC SILICON PHOTOTRANSISTOR optoelectronics QSC112/113/114 DESCRIPTION PACKAGE DIMENSIONS The QSC11X is a silicon phototransistor encapsulated in an infrared transparent, black T-1 package. FEATURES Tight production distribution. Steel lead frames for improved reliability in solder
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QSC112/113/114
QSC11X
mW/cm21
C11351
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