QFP64 package
Abstract: D1 Package
Text: PACKAGE DIMENSIONS QFP64-D1 12.0±0.4 0 ~ 10º 10.0±0.3 32 64 17 10.0±0.3 49 16 0.2±0.05 0.15 1.75±0.1 0.5 M 2.05M AX 1 +0.1 0.15 - 0.05 12.0±0.4 33 48 0.5±0.2 0.1±0.1 Mold Base UNIT : mm
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QFP64-D1
QFP64 package
D1 Package
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QFP64-G1
Abstract: QFP64 package
Text: PACKAGE DIMENSIONS QFP64-G1 0~10° 16.0±0.4 14.0±0.3 33 32 64 17 14.0±0.3 49 16.0±0.4 48 16 0.35±0.1 0.12 +0.1 0.15 - 0.05 1.4±0.1 0.8 M 1.7MAX 1 0.5 0.10 +0.1 0.1 - 0.05 Mold Base UNIT : mm
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QFP64-G1
QFP64-G1
QFP64 package
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PDF
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diode k1
Abstract: No abstract text available
Text: PACKAGE DIMENSIONS QFP64-K1 12.0 ±0.2 0 ~ 10ﾟ 10.0TYP 32 64 17 10.0TYP 49 12.0 ± 0.2 33 48 16 1 0.2 ± 0.10 0.08 M 0.17 ± 0.05 1.70MAX 0.5 0.5 ±0.2 GD-Q06401Y-1 Ver.2005-11-22 0.1 ± 0.1 Mold Base UNIT : mm
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QFP64-K1
70MAX
GD-Q06401Y-1
diode k1
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PDF
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HC49
Abstract: QFP64 GOAL SEMICONDUCTOR
Text: VMX1020-C16/I16 VERSA MIX System Design Notes Description This application note is intended to provide hands-on information about the hardware requirements for a VERSA MIX based system. VMX1020 Pin configuration The VMX1020 is available in standard QFP64 package.
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VMX1020-C16/I16
VMX1020
QFP64
VMX1020.
VMX1020
16MHz
HC49
GOAL SEMICONDUCTOR
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PDF
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Untitled
Abstract: No abstract text available
Text: Adapters - Phyton, Inc. Page 1 of 1 Device Programmers and Development Tools for Microcontrollers Home Quick Links Help Desk Products E-Shop Support Contact News Site Map AE-Q64-HCS08-1 Downloads All Programmers DIP40/QFP64 specialized adapter for Motorola/Freescale microcontrollers.
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AE-Q64-HCS08-1
DIP40/QFP64
ChipProg-48
DIP-40
QFP-64
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PDF
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QFP64-H1
Abstract: QFP64 package
Text: PACKAGE DIMENSIONS QFP64-H1 PRELIMINARY 12.0±0.2 0 ~ 10° 10.0±0.2 32 64 17 10.0±0.2 0.2±0.1 0.08 1.4±0.2 +0.1 0.15- 0.05 M Mold Base 0.1 11.0±0.2 +0.15 0.1- 0.1 1.25TYP 0.5 0.5±0.2 16 1 1.85MAX 1.25TYP 49 12.0±0.2 33 48 UNIT : mm
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QFP64-H1
25TYP
85MAX
QFP64-H1
QFP64 package
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of QFP64 package SOT393-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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QFP64
OT393-1
OT393-1
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PDF
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QFP64-G1
Abstract: QFP64G1
Text: パッケージ外形図 QFP64-G1 0~10° 16.0±0.4 14.0±0.3 33 32 64 17 14.0±0.3 49 16.0±0.4 48 16 0.35±0.1 0.12 +0.1 0.15 - 0.05 1.4±0.1 0.8 M 1.7MAX 1 0.5 0.10 +0.1 0.1 - 0.05 ﾓｰﾙﾄﾞ 底 面 単位 : mm
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QFP64-G1
QFP64-G1
QFP64G1
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PDF
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QFP64 package
Abstract: QFP64-N1
Text: PACKAGE DIMENSIONS QFP64-N1 12.0 ± 0.1 0 to 10° 10.0 ± 0.1 32 64 17 10.0 ± 0.1 49 12.0 ± 0.1 33 48 16 1 0.5 0.2 ± 0.1 1.6 M AX 0.15 TYP 1.4 ± 0.05 0.076 0.6 ± 0.1 0.1 ± 0.05 Mold Base UNIT : mm Ver.2008-04-09
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QFP64-N1
QFP64 package
QFP64-N1
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PDF
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QFP64-H1
Abstract: No abstract text available
Text: PACKAGE DIMENSIONS QFP64-H1 12.0±0.2 0 ~ 10° 10.0±0.2 32 64 17 10.0±0.2 0.2±0.1 0.08 1.4±0.2 +0.1 0.15- 0.05 1.25TYP 0.5 M 0.5±0.2 16 1 1.85MAX 1.25TYP 49 12.0±0.2 33 48 Mold Base +0.15 0.1- 0.1 0.1 11.0±0.2 UNIT : mm Ver.2003-08-29
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QFP64-H1
25TYP
85MAX
QFP64-H1
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PDF
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QFP64-D1
Abstract: No abstract text available
Text: パッケージ外形図 QFP64-D1 12.0±0.4 0 ~10ﾟ 10.0±0.3 32 64 17 10.0±0.3 49 16 0.2±0.05 0.15 1.75±0.1 0.5 M 2.05M AX 1 +0.1 0.15 - 0.05 12.0±0.4 33 48 0.5±0.2 0.1±0.1 ﾓｰﾙﾄﾞ 底 面 単位 : mm
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QFP64-D1
QFP64-D1
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PDF
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QFP64-H1
Abstract: No abstract text available
Text: パッケージ外形図 QFP64-H1 12.0±0.2 0 ~ 10° 10.0±0.2 32 64 17 10.0±0.2 0.2±0.1 0.08 1.4±0.2 +0.1 0.15- 0.05 1.25TYP 0.5 M 0.5±0.2 16 1 1.85MAX 1.25TYP 49 12.0±0.2 33 48 Mold Base +0.15 0.1- 0.1 0.1 11.0±0.2 単位 : mm Ver.2003-08-29
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QFP64-H1
25TYP
85MAX
QFP64-H1
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PDF
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TLCS-90
Abstract: TMP93CS32 TMP93CS32F
Text: TO SH IB A TMP93CS32 Low Voltage / Low Pow er CM OS 16-bit Microcontrollers TMP93CS32F 1. Outline and Device Characteristics The TMP93CS32 is high-speed, advanced 16-bit microcontroller developed for controlling medium to large-scale equipment. The TMP93CS32 is housed in 64-pin flat package P-QFP64-1414-0.80A .
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OCR Scan
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TMP93CS32
16-bit
TMP93CS32F
TMP93CS32
64-pin
P-QFP64-1414-0
900/L
TLCS-90
TMP93CS32F
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PDF
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Untitled
Abstract: No abstract text available
Text: パッケージ外形図 QFP64-K1 12.0 ±0.2 0 ~ 10ﾟ 10.0TYP 32 64 17 10.0TYP 49 12.0 ± 0.2 33 48 16 1 0.2 ± 0.10 0.08 M 0.17 ± 0.05 1.70MAX 0.5 0.5 ±0.2 GD-Q06401Y-1 Ver.2005-11-22 0.1 ± 0.1 ﾓ-ﾙﾄﾞ 底 面 単位 : mm
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QFP64-K1
70MAX
GD-Q06401Y-1
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QFP64 package
Abstract: PRQP0064GB-A P-QFP64-14x14-0
Text: JEITA Package Code P-QFP64-14x14-0.80 RENESAS Code PRQP0064GB-A Previous Code FP-64A/FP-64AV MASS[Typ.] 1.2g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 48 33 32 49 bp c c1 HE *2 E b1 Reference
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P-QFP64-14x14-0
PRQP0064GB-A
FP-64A/FP-64AV
QFP64 package
PRQP0064GB-A
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PDF
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QFP64-P-1414-0
Abstract: SDIP64-P-750-1 3804 f
Text: APPENDIX 3.6 Package outline 3.6 Package outline 64P6N-A Plastic 64pin 14✕14mm body QFP EIAJ Package Code QFP64-P-1414-0.80 Weight g 1.11 Lead Material Alloy 42 MD e JEDEC Code – HD 64 b2 ME D 49 1 I2 48 Recommended Mount Pad HE E Symbol 33 16 A 32 L1
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64P6N-A
64pin
1414mm
QFP64-P-1414-0
64P4B
750mil
SDIP64-P-750-1
3804 f
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PDF
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QFP64-P-1414-0
Abstract: SDIP64-P-750-1
Text: APPENDIX 3.6 Package outline 3.6 Package outline 64P6N-A Plastic 64pin 14✕14mm body QFP EIAJ Package Code QFP64-P-1414-0.80 Weight g 1.11 Lead Material Alloy 42 MD e JEDEC Code – HD 49 b2 64 ME D 1 48 I2 HE E Recommended Mount Pad Symbol A A1 A2 b c D
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64P6N-A
64pin
1414mm
QFP64-P-1414-0
64P4B
LQFP64-P-1414-0
SDIP64-P-750-1
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PDF
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SOT319-1
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP64: plastic quad flat package; 64 leads lead length 1.95 mm ; body 14 x 20 x 2.7 mm; high stand-off height SOT319-1 c y X 51 A 33 52 32 ZE e E HE A A2 (A 3) A1 θ wM Lp pin 1 index bp L 20 64 detail X
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QFP64:
OT319-1
OT319-1
JFP64:
SOT319-1
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QFP64-N1
Abstract: No abstract text available
Text: パッケージ外形図 QFP64-N1 12 .0 ±0 .1 0 ～10ﾟ 10 .0 ±0 .1 32 64 17 1 0.0 ±0 .1 49 1 0.5 1 2.0 ±0 .1 33 48 16 0.2 ±0. 1 1.6 M AX 0. 15 TY P 1.4 ±0 .05 0.07 6 MI N 0.6 ±0.1 0. 1 ± 0.0 5 ﾓ -ﾙﾄﾞ 底 面 単位 : mm
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QFP64-N1
QFP64-N1
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MO-112
Abstract: QFP64
Text: PDF: 2003 Mar 28 Philips Semiconductors Package outline QFP64: plastic quad flat package; 64 leads lead length 1.95 mm ; body 14 x 20 x 2.7 mm; high stand-off height SOT319-1 c y X 51 A 33 52 32 ZE e E HE A A2 (A 3) A1 θ wM Lp pin 1 index bp L 20 64 detail X
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QFP64:
OT319-1
MO-112
MO-112
QFP64
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PDF
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DM-28
Abstract: No abstract text available
Text: TO SH IB A TMP93CS32 Low Voltage / Low Pow er CM OS 16-bit Microcontrollers TMP93CS32F 1. Outline and Device Characteristics The TM P9 3C S32 is high-speed, advanced 16-bit m icrocontroller developed for controlling m edium to large-scale equipm ent. The TM P9 3C S32 is housed in 64-pin fla t package P-QFP64-1414-0.80A .
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OCR Scan
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16-bit
TMP93CS32
TMP93CS32F
64-pin
P-QFP64-1414-0
900/L
TLCS-90
16M-byte
DM-28
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PDF
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MO-112
Abstract: QFP64
Text: PDF: 2000 Jan 20 Philips Semiconductors Package outline QFP64: plastic quad flat package; 64 leads lead length 1.95 mm ; body 14 x 20 x 2.7 mm; high stand-off height SOT319-1 c y X 51 A 33 52 32 ZE e E HE A A2 (A 3) A1 θ wM Lp pin 1 index bp L 20 64 detail X
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QFP64:
OT319-1
MO-112
MO-112
QFP64
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PDF
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QFP64 package
Abstract: MO-112 QFP64
Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline QFP64: plastic quad flat package; 64 leads lead length 1.95 mm ; body 14 x 20 x 2.8 mm SOT319-2 c y X 51 A 33 52 32 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 20 64 detail X 19 1 ZD w M bp e v M A
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QFP64:
OT319-2
MO-112
QFP64 package
MO-112
QFP64
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PDF
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QFP64-P-1414-0
Abstract: No abstract text available
Text: 64P6N-A Plastic 64pin 14✕14mm body QFP EIAJ Package Code QFP64-P-1414-0.80 Weight g 1.11 Lead Material Alloy 42 MD e JEDEC Code – HD 49 b2 64 ME D 1 48 I2 HE E Recommended Mount Pad Symbol 33 16 A 32 L1 c A2 17 b y A1 F e L Detail F A A1 A2 b c D E e
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64P6N-A
64pin
QFP64-P-1414-0
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PDF
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