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    84-1lmis

    Abstract: mold compound AND S6300H bond 84-1-lmis-r4
    Text: ASSEMBLY DIAGRAM CONTROLLED DOCUMENT Specification No : ADD-05457XXXEAK Effective : 06-DEC-2000 09:18:54 Package : EAK 14 LEAD PDIP Metal ID : Issue : 7 Status : RELEASED Scale : 20X Printed : 09-APR-2001 09:16:04 EST PLASTIC_PKG Data as of 09-APR-2001 09:16:05 by sherpa at farview


    Original
    ADD-05457XXXEAK 06-DEC-2000 09-APR-2001 84-1LMISR4 S6300H R004-0003 84-1lmis mold compound AND S6300H bond 84-1-lmis-r4 PDF

    84-1lmis

    Abstract: 84-1LMISR4
    Text: ASSEMBLY DIAGRAM CONTROLLED DOCUMENT Specification No : ADD-51928XXXEPN Effective : 27-SEP-2000 14:46:03 Package : EPN 40 LEAD PDIP Metal ID : Issue : 0 Status : RELEASED Scale : 20X Printed : 14-MAY-2001 08:56:04 EST PLASTIC_PKG Data as of 14-MAY-2001 08:56:27 by sherpa at farview


    Original
    ADD-51928XXXEPN 27-SEP-2000 14-MAY-2001 84-1LMISR4 S6300H R004-0041 84-1lmis 84-1LMISR4 PDF