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    SOLDERING GUIDELINES AND SMD FOOTPRINT DESIGN Search Results

    SOLDERING GUIDELINES AND SMD FOOTPRINT DESIGN Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    SOLDERING GUIDELINES AND SMD FOOTPRINT DESIGN Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Soldering guidelines and SMD footprint design

    Abstract: SOD87 footprint SMD footprint design Soldering guidelines SOD106 land pattern sod110 land sot89 stencil SC59 SOD110 footprint "msb900"
    Text: CHAPTER 4 SOLDERING GUIDELINES AND SMD FOOTPRINT DESIGN page Introduction 4-2 Axial and radial leaded devices 4-2 Surface-mount devices 4-3 Recommended footprints 4 - 14 Philips Semiconductors Discrete Semiconductor Packages Soldering guidelines and SMD footprint design


    Original     		OD106, OT223. MSB958 Soldering guidelines and SMD footprint design SOD87 footprint SMD footprint design Soldering guidelines SOD106 land pattern sod110 land sot89 stencil SC59 SOD110 footprint "msb900" PDF

    SOD80 footprint

    Abstract: SOD87 footprint Soldering guidelines and SMD footprint design SMD footprint design SOD106 land pattern land pattern sot346 SOD110 footprint SOD87 footprint pcb MLC745 smd footprint
    Text: DISCRETE SEMICONDUCTORS DATA SHEET Chapter 4 Soldering guidelines and SMD footprint design Discrete Semiconductor Packages File under Discrete Semiconductors, SC18 July 1997 Philips Semiconductors Discrete Semiconductor Packages Soldering guidelines and SMD


    Original     		MGK391 MSC422 OT457 SC-74) MSC423 SOD80 footprint SOD87 footprint Soldering guidelines and SMD footprint design SMD footprint design SOD106 land pattern land pattern sot346 SOD110 footprint SOD87 footprint pcb MLC745 smd footprint PDF

    aluminium pop rivet

    Abstract: to220 mica Soldering guidelines and SMD footprint design to220 torque for SELF TAPPING SCREW SC18 MGA768
    Text: MOUNTING AND SOLDERING INSTRUCTIONS Page SOLDERING GUIDELINES AND SMD FOOTPRINT DESIGN FOR AXIAL AND RADIAL LEADED PACKAGES AND MEDIUMPOWER SURFACE MOUNT PACKAGES This information is contained in Philips publication SC18 Discrete Semiconductor Packages, 1997 , section: 4.


    Original     		OD100, OD113, 220AB OT186; OT186A OT404 aluminium pop rivet to220 mica Soldering guidelines and SMD footprint design to220 torque for SELF TAPPING SCREW SC18 MGA768 PDF

    SOD87 footprint

    Abstract: Soldering guidelines and SMD footprint design sot3391h SOT-34 MSA460 MSA439 SOT343R footprint
    Text: SC18_1999_.book : SC18_CHAPTER_4_1999 1 Wed May 12 11:40:55 1999 CHAPTER 4 SOLDERING GUIDELINES AND SMD FOOTPRINT DESIGN page Introduction 4-2 Axial and radial leaded devices 4-2 Surface-mount devices 4-3 Recommended footprints 4 - 14 SC18_1999_.book : SC18_CHAPTER_4_1999


    Original     		MSD060 OT428. MSC422 OT457 SC-74) MSC423 SOD87 footprint Soldering guidelines and SMD footprint design sot3391h SOT-34 MSA460 MSA439 SOT343R footprint PDF

    MICRO SWITCH PRESSURE PCB

    Abstract: Vishay Siliconix soldering bga without underfill 71990 AN824 63Sm DG3000DB Si8900EDB Si8902EDB UP78
    Text: AN824 Vishay Siliconix PCB Design and Assembly Guidelines For MICRO FOOTr Products Johnson Zhao INTRODUCTION Vishay Siliconix’s MICRO FOOT product family is based on a wafer-level chip-scale packaging WL-CSP technology that implements a solder bump process to eliminate the need for an


    Original     		AN824 Si8902EDB Sn/37Pb 06-Jan-03 MICRO SWITCH PRESSURE PCB Vishay Siliconix soldering bga without underfill 71990 AN824 63Sm DG3000DB Si8900EDB UP78 PDF

    tssop 16 exposed pad stencil

    Abstract: C1316C SOIC 8 pcb pattern qfn 88 stencil SOIC 16 narrow body exposed pad pcb pattern 1316C land pattern for TSsOP 16 land pattern for TSSOP 24 pin jedec package MO-220 QFN-32 SOIC 8 narrow body pcb pattern
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		IPC-SM-782. OD-323 tssop 16 exposed pad stencil C1316C SOIC 8 pcb pattern qfn 88 stencil SOIC 16 narrow body exposed pad pcb pattern 1316C land pattern for TSsOP 16 land pattern for TSSOP 24 pin jedec package MO-220 QFN-32 SOIC 8 narrow body pcb pattern PDF

    qfn 32 land pattern

    Abstract: hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		IPC-SM-782. OD-323 qfn 32 land pattern hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782 PDF

    EP5368QI

    Abstract: No abstract text available
    Text: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP5368QI QFN Package Soldering Guidelines John D. Weld, Ph.D. 9/27/2007 1.0 INTRODUCTION Enpirion’s EP5368QI power converter package is designed with a plastic leadframe


    Original     		EP5368QI PDF

    SOD-323 land pattern

    Abstract: SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern
    Text: Application Note Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		IPC-SM-782. SoD-323 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern PDF

    QFN PACKAGE thermal resistance

    Abstract: No abstract text available
    Text: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP53XXXUI QFN Package Soldering Guidelines John D. Weld, Ph.D. 11/4/2008 1.0 INTRODUCTION Enpirion’s EP53XXXUI power converter packages are designed with a plastic leadframe


    Original     		EP53XXXUI QFN PACKAGE thermal resistance PDF

    EP53F8QI

    Abstract: No abstract text available
    Text: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP53F8QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EP53F8QI power converter packages are designed with a plastic leadframe


    Original     		EP53F8QI PDF

    pcb fabrication process

    Abstract: EP53
    Text: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP53XXXQI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EP53XXXQI power converter packages are designed with a plastic leadframe


    Original     		EP53XXXQI pcb fabrication process EP53 PDF

    ansoft hfss

    Abstract: A10137-R IEC 60068-2-14 standard IEC 60068-2-14 hfss smd resistance A10137 Ansoft A1013 PCB BOARD DIMENSION BY SMA CONNECT
    Text: GPS RADIONOVA Co-planar Antenna Part No. A10137 Product Specification 1 Features • GPS antenna designed for embedded applications. • Balanced antenna technology. • High efficiency. • Good resistance to de-tuning. • Designed for easy integration onto PCB.


    Original     		A10137 1575MHz) 06MD-0001-2-PS ansoft hfss A10137-R IEC 60068-2-14 standard IEC 60068-2-14 hfss smd resistance A10137 Ansoft A1013 PCB BOARD DIMENSION BY SMA CONNECT PDF

    C1316C

    Abstract: LPCC-16 land pattern for msOP 8 SOIC 8 pcb pattern jedec package MO-220 QFN-32 16 soic smd pcb footprint land pattern for TO 92 qfn 32 land pattern qfn32 land pattern land pattern for msOP 10
    Text: Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and Packaging Electronic Circuits surface


    Original     		IPC-SM-782. SC-70 10/02A C1316C LPCC-16 land pattern for msOP 8 SOIC 8 pcb pattern jedec package MO-220 QFN-32 16 soic smd pcb footprint land pattern for TO 92 qfn 32 land pattern qfn32 land pattern land pattern for msOP 10 PDF

    EP5382QI

    Abstract: No abstract text available
    Text: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP5382QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EP5382QI power converter packages are designed with a plastic leadframe


    Original     		EP5382QI PDF

    EN5394QI

    Abstract: QFN leadframe QFN PACKAGE thermal resistance qfn 44 PACKAGE footprint EN5394
    Text: Enpirion, Inc. 53 Frontage Road, Suite 210, Hampton, NJ 08827 Tel. 908.894.6000 Fax. 908.894.6090 www.enpirion.com EN5394QI QFN Package Soldering Guidelines 2/3/2010 1.0 INTRODUCTION Enpirion’s EN5394QI power converter packages are designed with a plastic leadframe


    Original     		EN5394QI QFN leadframe QFN PACKAGE thermal resistance qfn 44 PACKAGE footprint EN5394 PDF

    inspection mirror

    Abstract: QFN leadframe QFN PACKAGE thermal resistance qfn stencil
    Text: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EN5395QI QFN Package Soldering Guidelines John D. Weld, Ph.D. 6/18/2008 1.0 INTRODUCTION Enpirion’s EN5395QI power converter packages are designed with a plastic leadframe


    Original     		EN5395QI inspection mirror QFN leadframe QFN PACKAGE thermal resistance qfn stencil PDF

    EN5366QI

    Abstract: en5366 stencil qfn stencil
    Text: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EN5366QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5366QI power converter packages are designed with a plastic leadframe


    Original     		EN5366QI en5366 stencil qfn stencil PDF

    qfn 44 PACKAGE footprint

    Abstract: EN5365QI EN5365 QFN PACKAGE thermal resistance
    Text: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EN5365QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5365QI power converter packages are designed with a plastic leadframe


    Original     		EN5365QI qfn 44 PACKAGE footprint EN5365 QFN PACKAGE thermal resistance PDF

    EN5311Qi

    Abstract: EN5311 IPC-7095 IPC-7095B QFN PACKAGE thermal resistance "exposed pad" PCB via qfn 32 land pattern qfn stencil
    Text: Enpirion, Inc. EN5311QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5311QI power converter packages are designed with a plastic leadframe package technology that utilizes copper leadframes and mold caps with System in Package SiP construction to form a Quad Flat No-lead (QFN) package. QFN package


    Original     		EN5311QI EN5311 IPC-7095 IPC-7095B QFN PACKAGE thermal resistance "exposed pad" PCB via qfn 32 land pattern qfn stencil PDF

    EN5364QI

    Abstract: No abstract text available
    Text: Enpirion, Inc. 53 Frontage Road, Suite 210, Hampton, NJ 08827 Tel. 908.894.6000 Fax. 908.894.6090 www.enpirion.com EN5364QI QFN Package Soldering Guidelines 2/3/2010 1.0 INTRODUCTION Enpirion’s EN5364QI power converter packages are designed with a plastic leadframe


    Original     		EN5364QI PDF

    en5337qi

    Abstract: EN5337 qfn 32 stencil smd be
    Text: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EN5337QI QFN Package Soldering Guidelines John D. Weld, Ph.D. 2/3/2009 1.0 INTRODUCTION Enpirion’s EN5337QI power converter packages are designed with a plastic leadframe


    Original     		EN5337QI EN5337 qfn 32 stencil smd be PDF

    EP5352QI

    Abstract: No abstract text available
    Text: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP5352QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EP5352QI power converter packages are designed with a plastic leadframe


    Original     		EP5352QI PDF

    EN5335QI

    Abstract: qfn stencil EN5335Q qfn 32 stencil Thermal vias
    Text: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EN5335QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5335QI power converter packages are designed with a plastic leadframe


    Original     		EN5335QI qfn stencil EN5335Q qfn 32 stencil Thermal vias PDF