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    SOT310 Search Results

    SOT310 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT310-1 NXP Semiconductors Plastic quad flat package; 80 leads (lead length 1.6 mm); body 14 x 20 x 3.0 mm Original PDF

    SOT310 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    MS-022

    Abstract: QFP80
    Text: PDF: 2003 Mar 28 Philips Semiconductors Package outline QFP80: plastic quad flat package; 80 leads lead length 1.6 mm ; body 14 x 20 x 3 mm SOT310-1 c y X A 64 41 65 40 ZE e A A2 E HE (A 3) A1 θ wM Lp bp pin 1 index L 25 80 detail X 24 1 wM bp e ZD v M A


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    QFP80: OT310-1 134E14 MS-022 MS-022 QFP80 PDF

    QFP80

    Abstract: No abstract text available
    Text: Philips Semiconductors Package outlines QFP80: plastic quad flat package; 80 leads lead length 1.6 mm ; body 14 x 20 x 3.0 mm 1995 Feb 04 5-24 SOT310-1


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    QFP80: OT310-1 QFP80 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline QFP80: plastic quad flat package; 80 leads lead length 1.6 mm ; body 14 x 20 x 3 mm SOT310-1 c y X A 64 41 65 40 ZE e A A2 E HE (A 3) A1 wM θ Lp bp pin 1 index L 25 80 detail X 24 1 wM bp e ZD v M A D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)


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    QFP80: OT310-1 134E14 MS-022 PDF

    b0246

    Abstract: PH2955T 045H2 SMCP055 SGS-Ates B0246A B0-246 MJE2955T ST MJE2901K MJE2955K
    Text: POWER SILICON PNP Item Number Part Number I C 5 10 15 20 >= 30 SOT3805 SOT3825 SOT3825 SOT3825 SOT3105 SOT3115 SOT3125 ST29051 ~gH~g~ 35 40 SOT3807 SOT3827 SOT3827 SOT3827 2SB871A 2SB936A 2SB948A 2SB896A ~~~~~~~ 45 50 SK3183 BOW22 B0664 B0664 B0246 B0206


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    OT3116 OT3126 MJE2901 MJE2901K MJE2901T 2N3789 2N3791 B0246A B0246A O-111 b0246 PH2955T 045H2 SMCP055 SGS-Ates B0-246 MJE2955T ST MJE2955K PDF

    sot310

    Abstract: No abstract text available
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP80: plastic quad flat package; 80 leads lead length 1.6 mm ; body 14 x 20 x 3.0 mm SOT310-1 c y X A 64 41 65 40 ZE e E HE A A2 (A 3) A1 θ wM Lp bp pin 1 index L 25 80 detail X 24 1 wM bp e ZD v M A


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    QFP80: OT310-1 OT310-1 sot310 PDF

    QFP80

    Abstract: jedec QFP80 MS-022 QFP80 16 24
    Text: PDF: 2000 Jan 20 Philips Semiconductors Package outline QFP80: plastic quad flat package; 80 leads lead length 1.6 mm ; body 14 x 20 x 3.0 mm SOT310-1 c y X A 64 41 65 40 ZE e E HE A A2 (A 3) A1 θ wM Lp bp pin 1 index L 25 80 detail X 24 1 wM bp e ZD v M A


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    QFP80: OT310-1 134E14 MS-022 QFP80 jedec QFP80 MS-022 QFP80 16 24 PDF

    VSXO162

    Abstract: V68D VNC2 one chip tv ic QFP80 MHA495
    Text: INTEGRATED CIRCUITS DATA SHEET TDA9715H/A Y/C one-chip processor VHS standard Product specification Supersedes data of August 1993 File under Integrated Circuits, IC02 1996 Oct 21 Philips Semiconductors Product specification Y/C one-chip processor (VHS standard)


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    TDA9715H/A TDA9715H/A VSXO162 V68D VNC2 one chip tv ic QFP80 MHA495 PDF

    TQFP80 footprint dimensions

    Abstract: QFP44 footprint STK403-040
    Text: This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in


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    QFP64 TQFP80 footprint dimensions QFP44 footprint STK403-040 PDF

    Philips tea1090

    Abstract: tea1090 tea1402 pcf2705p philips TEA1090T SAA7321GP TDA2579A LMT 393 N TDA3653bq TEA5713
    Text: PHILIPS SEMICONDUCTORS PRODUCT DISCONTINUATION NOTICE NUMBER DN-41 DATED JUNE 30, 1999 EXHIBIT 'A' PHILIPS PHILIPS PHILIPS PART NUMBER PKG PART DESCRIPTION PHILIPS LAST TIME LAST TIME REPLACEMENT STATUS 12 NC NUMBER BUY DATE DLVY DATE PART CODES COMMENTS


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    DN-41 LO9585/WD LO9585 LO9700 OQ8845T/K3 OQ8868HP/K6 QFP47) X2G-BUK5R3-100B Philips tea1090 tea1090 tea1402 pcf2705p philips TEA1090T SAA7321GP TDA2579A LMT 393 N TDA3653bq TEA5713 PDF

    HITEX TELETEST 51

    Abstract: P83C852 Ashling CTS51 AVCASE51 icemaster-pe S87C00KSD OM4272 80C552 interfacing AN429 TrackPoint
    Text: Philips Semiconductors 80C51-Based 8-Bit Microcontrollers CONTENTS IC20: 80C51-BASED 8-BIT MICROCONTROLLERS Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


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    80C51-Based OM4272 82C150 82C250 OM4280 P83C852 PEB552 HITEX TELETEST 51 Ashling CTS51 AVCASE51 icemaster-pe S87C00KSD OM4272 80C552 interfacing AN429 TrackPoint PDF

    tip340

    Abstract: 2sb705 nec BUW23 2sA747A sanken 2SA747A BUW32A B0246C 2SB705 BOX20 2SA747 sanken
    Text: POWER SILICON PNP Item Number Part Number I C 5 10 15 20 25 30 35 40 >= 50 2SA747 2SA747 2SA878 2SA1067 2SA1040 TIP340 2SA1072 2SA1077 2~1:J10;j2K 55 60 2SB955K 2SA1007 2SA1232R 2SA1232Q 2SA1232P 2N6231 BOX20 BOX20 2SA747A ~~p~~1U6 65 70 2SB705 2SB863 2SA1265


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    204AA BUW32 2SC2818 SM216S B0287 218var tip340 2sb705 nec BUW23 2sA747A sanken 2SA747A BUW32A B0246C 2SB705 BOX20 2SA747 sanken PDF

    SOT411

    Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
    Text: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which


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    PDF

    045H8

    Abstract: B0208 SOT-380-2 SOT380-2 SOT-3802 BOT94 B0246B 045H10 B0246A
    Text: POWER SILICON PNP Item Number Part Number I C 5 10 15 20 >= 30 2SA1291Q 2SA1471 2SA1443 2SA1291R 2SA1291 RCA1C08 SML3127 SML3802 SML3804 ~~t~ggg 35 40 45 50 55 - 60 -65 -70 75 80 85 90 95 SML3107 BOT94 BOT94 BOT94 BOV94 BOW22B BOW22B BOW22B SSP68B TIP34B


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    O-220 045H8 B0208 SOT-380-2 SOT380-2 SOT-3802 BOT94 B0246B 045H10 B0246A PDF

    JEDEC TRAY DIMENSIONS

    Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
    Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors


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    manuf86 TQFP80 OT357 TQFP64 OT543 TFBGA64 JEDEC TRAY DIMENSIONS HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package PDF

    pp td 40

    Abstract: AG55-57 d2004-3 sot310 vs38
    Text: INTEGRATED CIRCUITS im m mm TDA9715H/A Y/C one-chip processor VHS standard Preliminary specification Supersedes data of November 1992 File under Integrated Circuits, IC02 August 1993 Philips Semiconductors PHILIPS Philips Semiconductors Preliminary specification


    OCR Scan
    TDA9715H/A TDA9715H/A SCD21 pp td 40 AG55-57 d2004-3 sot310 vs38 PDF