Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SOT632 Search Results

    SOT632 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT632a NXP Semiconductors leadless surface mounted package; plastic cap; 12 terminations Original PDF

    SOT632 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    BGY282

    Abstract: ECEV1VA101P GSM1800 GSM900 v-band P925
    Text: DISCRETE SEMICONDUCTORS DATA SHEET M3D727 BGY282 dual band UHF amplifier module for GSM900 and GSM1800 Preliminary specification 2001 Dec 04 Philips Semiconductors Preliminary specification dual band UHF amplifier module for GSM900 and GSM1800 BGY282 PINNING - SOT632A


    Original
    M3D727 BGY282 GSM900 GSM1800 OT632A GSM900) BGY282 ECEV1VA101P GSM1800 v-band P925 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline Leadless surface-mounted package; plastic cap; 12 terminations ZD 2x e 1 (4×) 2 e1 (4×) SOT632A Z5 (4×) Z (2×) 3 4 5 e2 (2×) 12 6 Z2 (6×) Z7 (4×) Z4 (8×) L (12×) 11 b (8×) 10 9 b1 (4×) 8 7 Z8 Dimensions of terminations Z1 (4×)


    Original
    OT632A PDF

    Z5.4

    Abstract: sot632
    Text: PDF: 2001 Nov 20 Philips Semiconductors Package outline Leadless surface mounted package; plastic cap; 12 terminations ZD 2x SOT632A e1 (4×) e (4×) 1 Z5 (4×) Z (2×) 2 3 4 5 e2 (2×) 12 6 Z2 (6×) Z7 (4×) Z4 (8×) L (12×) 11 b (8×) 10 9 b1 (4×) 8


    Original
    OT632A Z5.4 sot632 PDF

    MBL253

    Abstract: P925 SMD Transistor z6 GSM1800 BGY282 ECEV1VA101P GSM900 v-band sot632
    Text: DISCRETE SEMICONDUCTORS DATA SHEET M3D727 BGY282 Dual band UHF amplifier module for GSM900 and GSM1800 Preliminary specification 2002 Apr 9 Philips Semiconductors Preliminary specification Dual band UHF amplifier module for GSM900 and GSM1800 BGY282 PINNING - SOT632A


    Original
    M3D727 BGY282 GSM900 GSM1800 OT632A GSM900) MBL253 P925 SMD Transistor z6 GSM1800 BGY282 ECEV1VA101P v-band sot632 PDF

    Untitled

    Abstract: No abstract text available
    Text: DISCRETE SEMICONDUCTORS DATA SHEET M3D727 BGY282 dual band UHF amplifier module for GSM900 and GSM1800 Preliminary specification 2001 Dec 11 Philips Semiconductors Preliminary specification dual band UHF amplifier module for GSM900 and GSM1800 BGY282 PINNING - SOT632A


    Original
    M3D727 BGY282 GSM900 GSM1800 GSM900 BGY282 SCA73 PDF

    Untitled

    Abstract: No abstract text available
    Text: DISCRETE SEMICONDUCTORS DATA SHEET M3D727 BGY282 Dual band UHF amplifier module for GSM900 and GSM1800 Preliminary specification 2002 Feb 26 Philips Semiconductors Preliminary specification Dual band UHF amplifier module for GSM900 and GSM1800 BGY282 PINNING - SOT632A


    Original
    M3D727 BGY282 GSM900 GSM1800 GSM900 BGY282 SCA73 PDF

    BC548 TRANSISTOR REPLACEMENT

    Abstract: TYN612 pin diagram 1n4007 smd, toshiba S0817MH TYN604 scr pin diagram kmz51 compass TRANSISTOR S1A 64 smd toshiba l 300 laptop motherboard circuit diagram JFET TRANSISTOR REPLACEMENT GUIDE j201 replacements for transistor NEC D 587
    Text: 5.2 5.4 5.46 5.124 5.130 5.130 5.140 5.180 Introduction Diodes & Rectifiers Transistors Triacs,Thyristors and Diacs Sensors Cross Reference General Application discretes Cross Reference Power discretes Cross Reference RF discretes Discrete Components 5.1 Introduction


    Original
    BAP1321-02 BAP65-05 BAP65-03 BAP65-05W BAP65-02 BAP63-03 BAP63-02 BAP64-03 BAP64-02 BB143 BC548 TRANSISTOR REPLACEMENT TYN612 pin diagram 1n4007 smd, toshiba S0817MH TYN604 scr pin diagram kmz51 compass TRANSISTOR S1A 64 smd toshiba l 300 laptop motherboard circuit diagram JFET TRANSISTOR REPLACEMENT GUIDE j201 replacements for transistor NEC D 587 PDF

    SOT411

    Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
    Text: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which


    Original
    PDF