Untitled
Abstract: No abstract text available
Text: RECOMMENDED P.C. BOARD LAYOUT ROR INl/INL STANDARD MERSIO REV. A 0.1400 0.0770(PLATED THRU HOLE * FOR STENCIL * FOR BOARD .0020 [.04] —— SOLDER LOCKS CARD LENGTH - .085 0.2000 40" 0 . 1100 - MISC\MKTG\FOOTPRNT (PLATED THRU HOLE) * FOR STENCIL * INLSTAND ARD
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Untitled
Abstract: No abstract text available
Text: Philips Semiconductors Video Transistors and Modules for Monitors General MOUNTING AND SOLDERING Stencilling Mounting methods In this method a stencil with etched holes to pass the paste is used. The thickness of the stencil determines the amount of amount of solder paste that is deposited on the
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stencil tension
Abstract: IPC-SM-785 PT100 bridge AN-1112 GENERAL SEMICONDUCTOR MARKING UM Solder paste stencil life WLCSP stencil design
Text: National Semiconductor Application Note 1112 June 2001 CONTENTS Introduction to Micro SMD Package Construction Micro SMD Package Data Surface Mount Assembly Considerations PCB Layout Stencil Printing Process Component Placement Solder Paste Reflow and Cleaning
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AN-1112
stencil tension
IPC-SM-785
PT100 bridge
AN-1112
GENERAL SEMICONDUCTOR MARKING UM
Solder paste stencil life
WLCSP stencil design
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JESD30E
Abstract: JESD-30 QFN footprint AN1152 PQFN footprint AN-1152
Text: Application Note AN-1152 Dual 5x6 Power QFN Technology Inspection and Footprint / Stencil Recommendation Application Note By Behnia Barzegarian Table of Contents Page Inspection Techniques . 2
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AN-1152
JESD30E
JESD-30
QFN footprint
AN1152
PQFN footprint
AN-1152
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IPC-SM-785
Abstract: GENERAL SEMICONDUCTOR MARKING UM micro solder ball AN-1112 WLCSP stencil design BGA and CSP
Text: National Semiconductor Application Note 1112 March 2002 CONTENTS Introduction to Micro SMD Package Construction Micro SMD Package Data Surface Mount Assembly Considerations PCB Layout Stencil Printing Process Component Placement Solder Paste Reflow and Cleaning
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AN-1112
IPC-SM-785
GENERAL SEMICONDUCTOR MARKING UM
micro solder ball
AN-1112
WLCSP stencil design
BGA and CSP
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PQFN footprint
Abstract: IRFH7911PbF PQFN AN-1154 JESD-30 JESD30E
Text: Application Note AN-1154 Power QFN Technology Footprint / Stencil Recommendation Application Note By Behnia Barzegarian Table of Contents Page Inspection Techniques . 3 Examples of Proper Mounting . 3
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AN-1154
127mm
102mm
PQFN footprint
IRFH7911PbF
PQFN
AN-1154
JESD-30
JESD30E
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TEXAS INSTRUMENTS, Mold Compound QFN
Abstract: SLUA271 SLOA122 dsp layout guidelines QFN PACKAGE thermal resistance
Text: Application Report SLOA122 – July 2006 QFN Layout Guidelines Yang Boon Quek . HPL Audio Power Amplifiers 1 Introduction Board layout and stencil information for most Texas Instruments TI Quad Flat No-Lead (QFN) devices is
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SLOA122
TEXAS INSTRUMENTS, Mold Compound QFN
SLUA271
SLOA122
dsp layout guidelines
QFN PACKAGE thermal resistance
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3SD4-90
Abstract: No abstract text available
Text: Surface Mount Gas Tube Surge Arrester Part Number: 3SD4-90 Units: mm 7.2 4.4 1.2 0.6 2.9 2.9 4.4 φ 3.8 0.6 Recommended Pad Layout 4.5 2.4 4.8 8.4 Applications: 150µm 0.006" Stencil Recommended Transient Voltage Surge Suppression Telephone Network Interfaces
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3SD4-90
3SD4-90
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BGA-3000
Abstract: smd ic marking A9 smd a10 shaker smd diode A4 smd marking a7 smd transistor A6 transistor SMD a4 top mark smd A9 250 micro solder ball
Text: National Semiconductor Application Note 1112 August 2000 CONTENTS Package Construction Key attributes for micro SMD 4, 5, and 8 bump Smallest Footprint Micro SMD Handling Surface Mount Technology SMT Assembly Considerations Printed Circuit Board Layout Stencil Printing Solder Paste
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s2083
Abstract: PQFN IPC-SM-782 MO-220
Text: Surface Mount Instructions for PQFN Packages S2083 V6 Introduction The layout of the surface mount board plays a critical role in product design and must be done properly to achieve the intended performance of an integrated circuit. An accurate PCB pad and solder stencil
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S2083
s2083
PQFN
IPC-SM-782
MO-220
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Untitled
Abstract: No abstract text available
Text: Surface Mount Gas Tube Surge Arrester Part Number: 3SD4-145 Units: mm 7.2 4.4 1.2 0.6 2.9 2.9 4.4 φ 3.8 0.6 Recommended Pad Layout 4.5 2.4 4.8 8.4 Applications: 150µm 0.006" Stencil Recommended Transient Voltage Surge Suppression Telephone Network Interfaces
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3SD4-145
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surge arrester Ac
Abstract: MARKING L2E
Text: Surface Mount Gas Tube Surge Arrester Part Number: 3SD4-200 Units: mm 7.2 4.4 1.2 0.6 2.9 2.9 4.4 φ 3.8 0.6 Recommended Pad Layout 4.5 2.4 4.8 8.4 Applications: 150µm 0.006" Stencil Recommended Transient Voltage Surge Suppression Telephone Network Interfaces
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3SD4-200
surge arrester Ac
MARKING L2E
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Untitled
Abstract: No abstract text available
Text: Surface Mount Package Information The following pages contain information about ON Semiconductor’s Surface Mount Pacakages including: • Mimium Recommended Footprint • Power Dissipation • Soldering Precautions • Solder Stencil Guidelines • Typical Solder Heating Profile
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Sankosha USA
Abstract: No abstract text available
Text: Surface Mount Gas Tube Surge Arrester Part Number: 3SD4-230 Units: mm 7.2 4.4 1.2 0.6 2.9 2.9 4.4 φ 3.8 0.6 Recommended Pad Layout 4.5 2.4 4.8 8.4 Applications: 150µm 0.006" Stencil Recommended Transient Voltage Surge Suppression Telephone Network Interfaces
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3SD4-230
Sankosha USA
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Untitled
Abstract: No abstract text available
Text: 8 7 THIS DRAWING IS UNPUBLISHED. RELEASED FOR PUBLICATION ALL RIGHTS RESERVED. BY TYCO ELECTRONICS CORPORATION. W-C COPYRIGHT - 6 - D C TYP RECOMMENDED PCB LAYOUT B A RECOMMENDED PCB LAYOUT LOR USE WITH .008 THICK STENCIL AMP 4805 REV 31MAR2000 5 f 4 3 2 1
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31MAR2000
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IR 423f
Abstract: 30392 stencil Layout AV01-0210EN stencil MGA-635T6 JEDEC SMT reflow profile solder powder a/IR 423f
Text: MGA-635T6 UTSLP Package Application Note 5278 Introduction PCB Land Pattern and Stencil Design Avago Technologies's MGA-635T6 UTSLP 2x1.3x0.4 is an economical ,easy to use GaAs MMIC GPS Low Noise Amplifier LNA with bypass and Shutdown mode. The exposed die-attach
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MGA-635T6
AV01-0210EN
IR 423f
30392
stencil Layout
stencil
JEDEC SMT reflow profile
solder powder
a/IR 423f
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QFN-48 LAND PATTERN
Abstract: QFN PACKAGE thermal resistance QFN-48 footprint qfn 48 7x7 footprint ipc-SM-782 thermal analysis on pcb SMD transistor Mo FOOTPRINT PCB qfn 48 7x7 stencil AN5060
Text: Optimum PCB and Stencil Layout for WirelessUSB QFN Package Introduction When designing a system board using the WirelessUSB™ LS/LR QFN chip for wireless product applications, there are several important factors to consider. It is advised to pay critical attention to PCB design and assembly aspects when
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Untitled
Abstract: No abstract text available
Text: 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 6 5 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. ALL RIGHTS RESERVED. A REF B SPACES 2.54 : [.100 ] D 4.88 [.192] C 2A TYP B A RECOMM ENDED PCB LAYOUT FOR USE WITH .0 0 8 THICK STENCIL AMP 4805 REV 31MAR2000
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31MAR2000
30SEP94
30SEP94
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1-146134-7
Abstract: No abstract text available
Text: 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 6 5 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. ALL RIGHTS RESERVED. A REF B SPACES @ 2.54 = [.1 0 0 ] C D 4.Í [.1 92] C 2A TYP RECOMMENDED PCB LAYOUT B A R ECOM MENDED PCB LAYOUT ROR USE WITH .0 0 8 THICK STENCIL
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31MAR2000
30SEP94
1-146134-7
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Untitled
Abstract: No abstract text available
Text: RECOMMENDED P.C. BOARD & STENCIL LAYOUT FOR S Q T / E S Q T WITH - M W OPTION REV. B - NO OF POS X .07874 - .07874[ 2.00] [ 2.00] (NO OF POS X .07874) [ 2.00] ,063±.003 DIA [1.60±.08] ,034±.003 DIA [,86±.08] PLATED THRU HOLES .07874 [ 2.00] PCB LAYOUT
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sot89 stencil
Abstract: sot89 land pattern Loctite 218 RG200 substrate 5989-0810EN LOCTITE-96sc Getek LOCTITE 384 RG200 laser gun
Text: SOT89 Package Application Note 5051 Introduction PCB Land Pattern and Stencil Design Avago Technologies SOT89 is a 3 I/O pins Figure 1 package platform designed to offer excellent heat dissipation and wide RF frequency response. The SOT89 package itself is lead free with a dimension of 4.1 mm
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5989-0810EN
sot89 stencil
sot89 land pattern
Loctite 218
RG200 substrate
LOCTITE-96sc
Getek
LOCTITE 384
RG200
laser gun
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Untitled
Abstract: No abstract text available
Text: RECOMMENDED P.C. BOARD/STENCIL LAYOUT FOR MB1 SINGLE SURFACE MOUNT REV. A BOARD LAYOUT ST E N C IL L A Y O U T + .003 +.08 -0.053-,000 [01.52-,00] PLATED THROUGH (TYP 2 PLCS) .044 [1.12]- 40' 0 £^_ 0.0600 40° o+ o OO [01.524] 0.1400 [03.556](No OF POS) x .03937 [1.00] + .1137 [2.0
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30392
Abstract: ALM-1106 stencil Layout JEDEC SMT reflow profile stencil
Text: ALM-1106 MCOB Package Packge Application Note 5282 Introduction PCB Land Pattern and Stencil Design Avago Technologies’s ALM-1106 MCOB 2.0x2.0x1.1mm is an economical , easy to use GaAs MMIC GPS Low Noise Amplifier LNA with bypass and Shutdown mode. The exposed die-attach paddle acts as device grounding,
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ALM-1106
ALM-1106
AV01-0246EN
30392
stencil Layout
JEDEC SMT reflow profile
stencil
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Untitled
Abstract: No abstract text available
Text: 7 8 THIS DRAWING IS UNPUBLISHED. Ew COPYRIGHT - By - RELEASED FOR PUBLICATION - ALL RIGHTS RESERVED. c B A RECOMMENDED PCB LAYOUT EOR USE WITH .008 THICK STENCIL 4805 3/ 11 6 5 4 3 2 1 LOC DIST AD 00 R E V IS IO N S P LTR H3 DESCRIPTION REVISED PER DATE
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