IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies
Abstract: J-STD-003 BGA reflow guide teBGA J-STD-015 SIZE OF 4V7& PADS FOR REFLOW BGA PROFILING PMC-970951 IPC-D-275 JESD22-A113
Text: APPLICATION NOTE PMC-970951 ISSUE 1 PMC-Sierra,Inc. SURFACE MOUNT ASSEMBLY of PBGA/TEBGA PACKAGES SURFACE MOUNT ASSEMBLY OF PBGA/TEBGA PACKAGES Issue 1: Sept. 1997 PMC-Sierra, Inc. 105-8555 Baxter Place, Burnaby, BC Canada V5A 4V7 604 415 - 6000 PMC-Sierra,Inc.
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PMC-970951
PMC-970951R1
IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies
J-STD-003
BGA reflow guide
teBGA
J-STD-015
SIZE OF 4V7& PADS FOR REFLOW
BGA PROFILING
IPC-D-275
JESD22-A113
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BGA-484P-M09
Abstract: No abstract text available
Text: PLASTIC BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 484 PIN PLASTIC BGA-484P-M09 484-pin plastic TEBGA Ball pitch 1.00 mm Package width x package length 27.00 mm × 27.00 mm Lead shape Ball Sealing method Plastic mold Mounting height 2.36 mm Max
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BGA-484P-M09
484-pin
BGA-484P-M09)
BGA484009Sc-1-1
BGA-484P-M09
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nitto GE
Abstract: GE-100L SXVX-50BHG nitto GE-100L SXVX-210BHG SXVX-50 HL832NX SXVX-210 Nitto GE 100 HL832HS
Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1008-07 Product Affected: DATE: September 17, 2010 MEANS OF DISTINGUISHING CHANGED DEVICES: 17mm x 17mm TEBGA-580 (Green) Product Mark
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A1008-07
TEBGA-580
facilitSD22-A110
JESD22-A104
JESD22-A103
JESD22-A113
SXVX-110BHG
SXVX-200BHG
SXVX-210BHG
nitto GE
GE-100L
SXVX-50BHG
nitto GE-100L
SXVX-210BHG
SXVX-50
HL832NX
SXVX-210
Nitto GE 100
HL832HS
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Marking Code 2K
Abstract: No abstract text available
Text: EEPROM & Memory Card Code Information 1/2 Last Updated : August 2009 S5XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 12. Package Type 1 : TEBGA A : SDIP C : CHIP BIZ E : LQFP G : CLCC J : ELP L : CERDIP N : COB Q : QFP S : SOP V : SSOP Y : FBGA 2. Large Classfication : MOS (5)
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8K/16K
32K/64K
128K/256K
Marking Code 2K
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543-pin
Abstract: BGA-543P-M01 bga543
Text: PLASTIC BALL GRID ARRAY PACKAGE FUJITSU MICROELECTRONICS DATA SHEET 543 PIN PLASTIC BGA-543P-M01 543-pin plastic TEBGA Lead pitch 1.00 mm Package width x package length 27.00 mm × 27.00 mm Lead shape Ball Sealing method Plastic mold Mounting height 2.36 mm MAX
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BGA-543P-M01
543-pin
BGA-543P-M01)
BGA543001Sc-2-1
BGA-543P-M01
bga543
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SiSm672
Abstract: attansic f1 sis968 asus t12c J6001 Attansic l1 rlt8201bl Asus SiS307ELV INVERTER BOARD Asus A6
Text: 5 4 3 2 1 X51C Main BD. R1.0 BLOCK DIAGRAM CLOCK GEN. ICS9LPR363CGLF-T D Merom CPU D PAGE 29 FAN + Thermal sensor 478B uFCPGA PAGE 50 PAGE 3,4 FSB 800 MHz LVDS SiS307ELV PAGE 46 TV PAGE 45 167 BGA SiSM672 PAGE 25 DDR2 667MHz PAGE 7,8,9 CRT 847 TEBGA PAGE 10,11,12,13,14,15,16
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ICS9LPR363CGLF-T
SiS307ELV
SiSM672
667MHz
SiS968
RLT8201BL-10/100
ALC660
R5C832
MIC5235
SI4800BDY
attansic f1
sis968
asus t12c
J6001
Attansic l1
rlt8201bl
Asus
INVERTER BOARD Asus A6
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cd 4553
Abstract: ic cd 4553 cmos 4553 ATM machine working circuit diagram GPON block diagram ic 4553 master 5087 mii to hdlc DS34S101 DS34S102
Text: ABRIDGED DATA SHEET Rev: 101708 DS34S101, DS34S102, DS34S104, DS34S108 Single/Dual/Quad/Octal TDM-over-Packet Chip General Description These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial
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DS34S101,
DS34S102,
DS34S104,
DS34S108
cd 4553
ic cd 4553
cmos 4553
ATM machine working circuit diagram
GPON block diagram
ic 4553
master 5087
mii to hdlc
DS34S101
DS34S102
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te0509
Abstract: 7253X
Text: 7A ug us t, 20 05 09 :4 7: 19 PM PM7389 FREEDM 84A1024 Data Sheet Released ed ne sd ay ,1 FREEDM -84A1024 DATA SHEET Released Issue 4: March 2003 Do wn lo ad ed by Co nt e nt Te a m of Pa rtm in er In co n W Frame Engine and Datalink Manager 84A1024 Proprietary and Confidential to PMC-Sierra, Inc., and for its Customers’ Internal Use
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PM7389
84A1024
PMC-2000689,
84A1024
FREEDMTM-84A1024
PMC-2000689
31x31
te0509
7253X
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32A1024
Abstract: No abstract text available
Text: PM7386 FREEDM 32A1024 Frame Engine and Datalink Manager FEATURES • Single-chip multi-channel packet processor supporting a maximum aggregate bandwidth of 64 Mbit/s for line rate throughput transfers of packet sizes from 40 to 9.6 Kbytes, for up to an aggregate of 32 T1s or 32 E1s.
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PM7386
32A1024
PM7342
PM7324
PM73122
PMC-2020870
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EZR0
Abstract: SRAM SAMSUNG
Text: FREEDM -336A1024 PRELIMINARY DATA SHEET ISSUE 9 FRAME ENGINE AND DATA LINK MANAGER 336A1024 19 Ju ly, 20 02 11 :26 :56 AM PMC-1991476 ies Inc on Fr ida y, FREEDM™-336A1024 DATA SHEET PROPRIETARY AND CONFIDENTIAL PRELIMINARY ISSUE 9: MAY, 2002 Do wn loa
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PMC-1991476
FREEDMTM-336A1024
336A1024
EZR0
SRAM SAMSUNG
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CS251
Abstract: No abstract text available
Text: FUJITSU SEMICONDUCTOR DATA SHEET DS601-00003-0v01-E Semicustom CMOS Standard Cell CS251 Series • DESCRIPTION The CS251 series of 55 nm standard cells is a line of CMOS ASICs that satisfy demands for lower power consumption, higher speed and higher integration.
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DS601-00003-0v01-E
CS251
CS201
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Untitled
Abstract: No abstract text available
Text: DS21448 3.3V E1/T1/J1 Quad Line Interface www.maxim-ic.com GENERAL DESCRIPTION FEATURES The DS21448 is a quad-port E1 or T1 line interface unit LIU for short-haul and long-haul applications. It incorporates four independent transmitters and four independent receivers in a single 144-pin PBGA or
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DS21448
144-pin
128-pin
-15dB,
32-Bit
128-Bit
048MHz
DS21448L
DS21448L
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TCXO A31 10MHZ
Abstract: MT48LC4M32B2TG-6 L1V16 Datum OCXO
Text: PRELIMINARY PRODUCT BRIEF: SUBJECT TO CHANGE Rev: 091407 DS34S108, DS34S104, DS34S102, DS34S101 Description Abridged General Description Features The IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC draft-compliant DS34S108 allows up to eight T1/E1 links or frame-based serial HDLC links to be
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DS34S108,
DS34S104,
DS34S102,
DS34S101
DS34S108
823/G
board25
DS34S108
TCXO A31 10MHZ
MT48LC4M32B2TG-6
L1V16
Datum OCXO
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC8314EEC Rev. 2, 11/2011 MPC8314E PowerQUICC II Pro Processor Hardware Specifications This document provides an overview of the MPC8314E PowerQUICC II Pro processor features, including a block
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MPC8314EEC
MPC8314E
MPC8314E
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44L-84L
Abstract: 20L-28L LGA 16L SOT23 2A6
Text: SPECIFICATION NO. REV. 2000-0026 A DOCUMENT TITLE: SMD PACKAGE MOISTURE SENSITIVE TABLE OWNER: RELIABILITY MANAGER REQUIRED APPROVALS: RELIABILITY MANAGER QUALITY MANAGER AFFECTED PARTY NOTIFICATION: DO NOT INCLUDE REGULAR DISTRIBUTION PACKAGE ENGINEER DIRECTOR
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18-6731TO
KS8721SL
KS8001SL
MLF88Q-64LD,
MLF2025
022709PM09
44L-84L
20L-28L
LGA 16L
SOT23 2A6
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BSP29 transistor
Abstract: C14R RSL2 RELAY 6 PORT LIU AISi12 LASCS rsl2 24 DS26324 DS26334 DS26334G
Text: DS26334 3.3V, 16-Channel, E1/T1/J1 Shortand Long-Haul Line Interface Unit www.maxim-ic.com GENERAL DESCRIPTION FEATURES The DS26334 is a 16-channel short/long-haul line interface unit LIU that supports E1/T1/J1 from a single 3.3V power supply. A single bill of material can
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DS26334
16-Channel,
DS26334
16-channel
256-pin
16channel
BSP29 transistor
C14R
RSL2 RELAY
6 PORT LIU
AISi12
LASCS
rsl2 24
DS26324
DS26334G
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LA-4611P
Abstract: KB926QFA1 south bridge SIS 968 la4611 sis m672 307ELV SiS307ELV ICS9LPR600 JP36B kb926qf
Text: A B PJP1 PJP1 14W_DCIN 15W_DCIN 14W_45@ 15W_45@ C D E 1 1 Compal Confidential KSW01/91 Schematics Document 2 2 Intel Merom Processor with SiSM672/FX + DDRII + SiS968 + SiS307ELV 2008-08-01 ZZZ9 3 REV: 0.2 PCB ZZZ1 ZZZ3 ZZZ4 ZZZ5 ZZZ6 PCB LA-4611P LS-4243P
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KSW01/91
SiSM672/FX
SiS968
SiS307ELV
14WDAZ@
LA-4611P
14WDA@
LS-4243P
LS-4244P
LA-4611P
KB926QFA1
south bridge SIS 968
la4611
sis m672
307ELV
ICS9LPR600
JP36B
kb926qf
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AL491
Abstract: KB926QFA1 LA-3961P south bridge SIS 968 kb926 ISL6251 LA-3541P apa2057a apa2056 kb926qf
Text: A B PJP1 PJP1 14W_DCIN 15W_DCIN 14W_45@ C D E 15W_45@ 1 1 ZZZ1 PCB <BOM Structure> Compal Confidential JFWXX Schematics Document 2 2 Intel Merom Processor with SiSM672MX + DDRII + SiS968 + SiS307LV 2007-09-06 REV: 0.3 3 4 4 B C Title Cover Page D Size B Date:
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SiSM672MX
SiS968
SiS307LV
PC207
AL491
KB926QFA1
LA-3961P
south bridge SIS 968
kb926
ISL6251
LA-3541P
apa2057a
apa2056
kb926qf
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ic cd 4553
Abstract: cd 4553 Y1453 cts ocxo 10MHz TEBGA-484 RFC-5087 DS34S101 ic 4553 DS34S104GN DS34S108GN
Text: ABRIDGED DATA SHEET Rev: 032609 DS34S101, DS34S102, DS34S104, DS34S108 Single/Dual/Quad/Octal TDM-over-Packet Chip General Description These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial
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DS34S101,
DS34S102,
DS34S104,
DS34S108
DS34S101
DS34S102
ic cd 4553
cd 4553
Y1453
cts ocxo 10MHz
TEBGA-484
RFC-5087
ic 4553
DS34S104GN
DS34S108GN
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marking code G qfn 12
Abstract: uLGA MARKING CODE analog marking code 14 Analog Marking Information 3 mobile Camera Module package marking WF 5 marking 5 qfn marking z linear marking code
Text: Telephone Code Information • MOS • Linear-IC -1- Part Number Decoder MOS Code Information 1/2 S5XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 1. System LSI (S) 9~10. Mask Option 2. Large Classification : MOS (5) 11. " - " 3. Small Classification
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RISC-Processor s3c2410
Abstract: MR16R1624DF0-CM8 arm9 samsung s3c2440 architecture chip 3351 dvd sp0411n K9W8G08U1M sandisk micro SD Card 2GB arm9 s3c2440 K9F1G08U0A K6X8008C2B
Text: A Section MEMORY Table of Contents SECTION A PAGE DRAM SDRAM 3a – 4a DDR SDRAM 5a – 6a DDR2 SDRAM 7a RDRAM 8a NETWORK DRAM 8a MOBILE SDRAM 9a GRAPHICS DDR SDRAM 10a DRAM ORDERING INFORMATION 11a –13a NAND FLASH COMPONENTS, SMART MEDIA, COMPACT FLASH
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BR-04-ALL-005
BR-04-ALL-004
RISC-Processor s3c2410
MR16R1624DF0-CM8
arm9 samsung s3c2440 architecture
chip 3351 dvd
sp0411n
K9W8G08U1M
sandisk micro SD Card 2GB
arm9 s3c2440
K9F1G08U0A
K6X8008C2B
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fBGA package tray 12 x 19
Abstract: FCCSP HT80C51 a44e SecuCalm cortex my uLGA ARM10 I18N 64 pin IC microcontroller LCD
Text: Microcontroller Code Information 1/3 Last Updated : August 2009 S3XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 7. Rom Master 0 : 0K byte 2 : 2K byte 4 : 4K byte 6 : 6K byte 8 : 8K byte A : 48K byte C : 96K byte E : 176K byte G : 384K byte I : 768K byte (S-SIM)
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16-bit
32-bit
ARM10
16-bit
HT80C51
SC-200
128-bit
fBGA package tray 12 x 19
FCCSP
a44e
SecuCalm
cortex my
uLGA
ARM10
I18N
64 pin IC microcontroller LCD
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iMX536
Abstract: sahara lcd monitor circuit diagram free us10 sd diode samsung lpddr2 Mobile RAM Automotive Telematics On-board unit Platform emmc jedec mechanical standard Samsung board Board design guide eMMC emmc 4.5 spec samsung sony bullet camera sd 3.0 emmc 4.4
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53AEC Rev. 5, 12/2012 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Silicon Version 2.1
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IMX53AEC
MCIMX53xA
MX53xA
MX53xA)
1080i/p
iMX536
sahara lcd monitor circuit diagram free
us10 sd diode
samsung lpddr2 Mobile RAM
Automotive Telematics On-board unit Platform
emmc jedec mechanical standard
Samsung board Board design guide eMMC
emmc 4.5 spec samsung
sony bullet camera
sd 3.0 emmc 4.4
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Untitled
Abstract: No abstract text available
Text: FREEDM -336A1024 PRELIMINARY DATASHEET ISSUE 11 FRAME ENGINE AND DATA LINK MANAGER 336A1024 ce m be r, 20 02 01 :5 5: 39 PM PMC-1991476 Tu es da y, 03 De FREEDM™-336A1024 DATASHEET PROPRIETARY AND CONFIDENTIAL PRELIMINARY ISSUE 11: NOVEMBER 2002 Do wn
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-336A1024
336A1024
PMC-1991476
IncPMC-1991476
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