se97btp
Abstract: SE97B hwson8 footprint SE97 JESD22-A114 JESD22-A115 JESD78 TSE2002B1
Text: SE97B DDR memory module temp sensor with integrated SPD Rev. 01 — 27 January 2010 Product data sheet 1. General description Meets JEDEC Specification 42.4 TSE2002B1, 3 Jun 2009. The NXP Semiconductors SE97B measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C
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Original
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SE97B
TSE2002B1,
SE97B
JC-42
se97btp
hwson8 footprint
SE97
JESD22-A114
JESD22-A115
JESD78
TSE2002B1
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PDF
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SE97BTP
Abstract: DDR3 memory SE97 SE97B
Text: SE97B DDR memory module temp sensor with integrated SPD Rev. 01 — 27 January 2010 Product data sheet 1. General description Meets JEDEC Specification 42.4 TSE2002B1, 3 Jun 2009. The NXP Semiconductors SE97B measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C
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Original
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SE97B
TSE2002B1,
SE97B
JC-42
771-SE97BTP547
SE97BTP
DDR3 memory
SE97
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PDF
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Untitled
Abstract: No abstract text available
Text: SE97B DDR memory module temp sensor with integrated SPD Rev. 01 — 27 January 2010 Product data sheet 1. General description Meets JEDEC Specification 42.4 TSE2002B1, 3 Jun 2009. The NXP Semiconductors SE97B measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C
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Original
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SE97B
TSE2002B1,
SE97B
JC-42
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PDF
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