UCI702 Search Results

2N4065

Abstract: DIE 3N163 UC1700 3N163 3N164 UCI700 UCI702
Text: -ß a tttr o n P -C H A N N E L E N H A N C E M E N T M O S FE T Dev/ces. /ne CHIP NUMBER CONTACT METALLIZATION Top Contact: > 12,000 A Aluminum Backside Contact: 3,000 A Gold ASSEMBLY RECOMMENDATIONS . 021 " 0.533mm It is advisable that: a) the die be eutectically mounted with gold silicon preform 98/2%.