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    Abstract: Lithography Ushio Taiwan LS365 Ushio America 5440
    Text: 【UX4-3Di Product Data Sheet】 Comparison between lithography methods available for HVM of 3D LSIs UX4-3Di FFPL 200 Specifications Resolution: Wavelength: Overlay Accuracy: Throughput: Wafer Size: Wafer Transfer Method: 3 µm L/S 365 nm Top ±1 µm, bottom ±1 µm


    Original     		CA90630 200-mm ushio Lithography Ushio Taiwan LS365 Ushio America 5440 PDF