Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    X597 Search Results

    SF Impression Pixel

    X597 Price and Stock

    Maxim Integrated Products MAX5976AETE-T

    IC HOT SWAP CTRLR GP 16TQFN
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey MAX5976AETE-T Reel 2,500 2,500
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $3.475
    Buy Now

    Maxim Integrated Products MAX5974CETE-T

    IC OFFLINE SWITCH FWD 16TQFN
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey MAX5974CETE-T Digi-Reel 2,425 1
    • 1 $4.1
    • 10 $2.643
    • 100 $1.8319
    • 1000 $1.38161
    • 10000 $1.38161
    Buy Now
    MAX5974CETE-T Cut Tape 2,425 1
    • 1 $4.1
    • 10 $2.643
    • 100 $1.8319
    • 1000 $1.38161
    • 10000 $1.38161
    Buy Now

    Maxim Integrated Products MAX5976AETE-

    IC HOT SWAP CTRLR GP 16TQFN
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey MAX5976AETE- Tube 2,368 1
    • 1 $8.49
    • 10 $5.843
    • 100 $4.3921
    • 1000 $3.60652
    • 10000 $3.475
    Buy Now

    Maxim Integrated Products MAX5974AETE-T

    IC OFFLINE SWITCH FWD 16TQFN
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey MAX5974AETE-T Cut Tape 2,158 1
    • 1 $2.73
    • 10 $1.793
    • 100 $1.2766
    • 1000 $1.225
    • 10000 $1.225
    Buy Now
    MAX5974AETE-T Digi-Reel 2,158 1
    • 1 $2.73
    • 10 $1.793
    • 100 $1.2766
    • 1000 $1.225
    • 10000 $1.225
    Buy Now

    Maxim Integrated Products MAX5974DETE-T

    IC REG CTRLR MULT TOP 16TQFN
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey MAX5974DETE-T Cut Tape 1,841 1
    • 1 $7.67
    • 10 $5.124
    • 100 $3.7086
    • 1000 $3.2
    • 10000 $3.2
    Buy Now
    MAX5974DETE-T Digi-Reel 1,841 1
    • 1 $7.67
    • 10 $5.124
    • 100 $3.7086
    • 1000 $3.2
    • 10000 $3.2
    Buy Now

    X597 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    MO-83-AF

    Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original
    PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 MO-83-AF PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128

    Clock Distribution

    Abstract: XC3000 XC3100 XC4000 XC5200
    Text:  Set-up and Hold Times June 1, 1996 Version 1.0 Application Brief By PETER ALFKE Beware of hold-time problems, because they can lead to unreliable, temperature-sensitive designs that can fail even at low clock rates. This means that the data source, usually another IC driven


    Original
    PDF XC4000 XC5200 XC4000 XC5200, X5971 Clock Distribution XC3000 XC3100

    A7 SMD TRANSISTOR

    Abstract: fnd 503 7-segment 4013 FLIP FLOP APPLICATION DIAGRAMS SMD fuse P110 HP 1003 WA transistor SMD making code GC 1736DPC verilog code for 32 BIT ALU implementation xilinx xc95108 jtag cable Schematic RCL TOKO data
    Text: Data Book The Programmable Logic Data Book Success made simple Click anywhere on this page to continue 9/96 On behalf of the employees of Xilinx, our sales representatives, our distributors, and our manufacturing partners, welcome to our 1996 Data Book, and thank you for your interest in


    Original
    PDF

    Clock Distribution

    Abstract: Delay chip XC3000 XC3100 XC4000 XC5200 X5971
    Text: APPLICATION NOTE APPLICATION NOTE  XAPP 095 November 24, 1997 Version 1.0 Set-up and Hold Times 13* Introduction Beware of hold-time problems, because they can lead to unreliable, temperature-sensitive designs that can fail even at low clock rates. “Set-up time” and “hold time” describe the timing requirements on the data input of a flip-flop or register with respect


    Original
    PDF

    apple ipad 2 circuit schematic

    Abstract: SMD TRANSISTOR MARKING P28 fnd 503 7-segment apple ipad schematic drawing smd code marking NEC tantalum capacitor marking w25 SMD 32 pin eprom to eprom copier circuit pin DIAGRAM OF IC 7400 smd TRANSISTOR code marking bu TRANSISTOR SMD MARKING CODE W25
    Text: Data Book The Programmable Logic Data Book Success made simple Click anywhere on this page to continue 1996 On behalf of the employees of Xilinx, our sales representatives, our distributors, and our manufacturing partners, welcome to our 1996 Data Book, and thank you for your interest in


    Original
    PDF CH-4450 2-765-1488w apple ipad 2 circuit schematic SMD TRANSISTOR MARKING P28 fnd 503 7-segment apple ipad schematic drawing smd code marking NEC tantalum capacitor marking w25 SMD 32 pin eprom to eprom copier circuit pin DIAGRAM OF IC 7400 smd TRANSISTOR code marking bu TRANSISTOR SMD MARKING CODE W25

    interfacing cpld xc9572 with keyboard

    Abstract: VERIFY 93K template 34992 XC95288XL evaluation board schematic XCR3032C XcxxX xilinx logicore core dds XC2S15-VQ100 creative labs model 3400 FXS-100
    Text: The Programmable Logic Data Book 2000 R R , XC2064, NeoCAD PRISM, XILINX Block Letters , XC-DS501, NeoROUTE, XC3090, FPGA Architect, XC4005, FPGA Foundry, XC5210, Timing Wizard, NeoCAD, TRACE, NeoCAD EPIC, XACT are registered trademarks of Xilinx, Inc. , all XC-prefix product designations, AllianceCore, Alliance Series, BITA, CLC, Configurable Logic Cell, CoolRunner, Dual Block, EZTag, Fast CLK, FastCONNECT,


    Original
    PDF XC2064, XC-DS501, XC3090, XC4005, XC5210, interfacing cpld xc9572 with keyboard VERIFY 93K template 34992 XC95288XL evaluation board schematic XCR3032C XcxxX xilinx logicore core dds XC2S15-VQ100 creative labs model 3400 FXS-100

    A23 780-4

    Abstract: vhdl code for 8-bit BCD adder star delta wiring diagram with timer CI 7448 XC6200 XC4013XL PIN BG256 100352 The 555 Timer Applications Sourcebook schemat xilinx xc3000a MARKING CODE
    Text: The Programmable Logic Data Book April 1998 R , XILINX, XACT, XC2064, XC3090, XC4005, XC-DS501, FPGA Architect, FPGA Foundry, NeoCAD, NeoCAD EPIC, NeoCAD PRISM, NeoROUTE, Plus Logic, Plustran, P+, Timing Wizard, and TRACE are registered trademarks of Xilinx, Inc.


    Original
    PDF XC2064, XC3090, XC4005, XC-DS501, Versa108 XC95144 XC95216 XC95288 XC9536 XC9572 A23 780-4 vhdl code for 8-bit BCD adder star delta wiring diagram with timer CI 7448 XC6200 XC4013XL PIN BG256 100352 The 555 Timer Applications Sourcebook schemat xilinx xc3000a MARKING CODE

    XC4000

    Abstract: XC3000-series XC1700 XC2000 XC3000 XC5200
    Text:  June 1, 1996 Version 1.0 Xilinx FPGAs can be configured in a common daisy-chain structure, where the lead device generates CCLK pulses and feeds serial configuration information into the next downstream device, which in turn feeds data into the next


    Original
    PDF XC2000, XC3000, XC4000, XC5200 XC4000 XC1700 XC4000/XC5200 XC4000 XC3000-series XC2000 XC3000

    2sk523

    Abstract: exview HAD CCD CM500S CXD1267AN ICX055BL ICX255AL ccd sony exview HAD
    Text: ICX255AL 対角6mm(1/3型)CCIR白黒用固体撮像素子 概 要 ICX255ALはCCIR方式の対角6mm(1/3型)白黒ビ デオカメラに適したインタライン型CCD固体撮像素 子です。EXview HAD CCD技術の採用により,現行


    Original
    PDF ICX255AL 6mm13CCIR ICX255ALCCIR6mm13 ICX055BL ICX055BL, 945nm ICX055BLIR -20dB 2sk523 exview HAD CCD CM500S CXD1267AN ICX055BL ICX255AL ccd sony exview HAD

    XC4000

    Abstract: xc4000 pin XC5200 XC1700 XC2000 XC3000
    Text: APPLICATION NOTE APPLICATION NOTE Configuring Mixed FPGA Daisy Chains  XAPP 091 November 24, 1997 Version 1.0 13* Application Note by Peter Alfke Overview Xilinx FPGAs can be configured in a common daisy-chain structure, where the lead device generates CCLK pulses


    Original
    PDF XC2000, XC3000, XC4000, XC5200 XC4000 XC4000E, XC4000X) XC1700: XC2000 xc4000 pin XC1700 XC3000

    schematic impulse sealer

    Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original
    PDF

    SERVICE MANUAL OF FLUKE 175

    Abstract: SHARP IC 701 I X11 dot led display large size with circuit diagram IR power mosfet switching power supply The 555 Timer Applications Sourcebook interfacing cpld xc9572 with keyboard distributed control system of power plant 100352 XC3090-100PG175 xc95144 pinout
    Text: R , XILINX, XACT, XC2064, XC3090, XC4005, XC-DS501, FPGA Architect, FPGA Foundry, NeoCAD, NeoCAD EPIC, NeoCAD PRISM, NeoROUTE, Plus Logic, Plustran, P+, Timing Wizard, and TRACE are registered trademarks of Xilinx, Inc. , all XC-prefix product designations, XACTstep, XACTstep Advanced, XACTstep Foundry, XACT-Floorplanner,


    Original
    PDF XC2064, XC3090, XC4005, XC-DS501, SERVICE MANUAL OF FLUKE 175 SHARP IC 701 I X11 dot led display large size with circuit diagram IR power mosfet switching power supply The 555 Timer Applications Sourcebook interfacing cpld xc9572 with keyboard distributed control system of power plant 100352 XC3090-100PG175 xc95144 pinout

    footprint jedec MS-026 TQFP

    Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original
    PDF

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
    Text: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original
    PDF FG860 FG900 FG1156 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228

    XC3000A

    Abstract: XC3000L XC3100L XC4000E XC4000EX XC4000XL XC5200L XC7300 XC9500 X5970
    Text:  3.3 V and Mixed Voltage Compatible Products August 6, 1996 Version 1.1 In anticipation of the market shift from 5 V to 3.3 V products, Xilinx introduced the Zero+ product line, the industry’s first 3.3 V FPGAs, in 1993. The number of 3.3 V product offerings has since tripled and includes high-performance


    Original
    PDF XC3000L, XC4000L XC3000L X4000E/EX XC4000E/EX XC3000A XC3100L XC4000E XC4000EX XC4000XL XC5200L XC7300 XC9500 X5970

    XC3000A

    Abstract: XC3000L XC3100A XC3100L XC4000E XC4000EX XC4000XL XC5200L XC7300 XC9500
    Text:  3.3 V and Mixed Voltage Compatible Products March 1, 1997 Version 2.0 The use of advanced deep-submicron IC fabrication processes is resulting in rapidly increasing density and performance for programmable logic devices, as evidenced by the XC4000XL FPGA family. However, as device geometries shrink below 0.5 microns, the smallest transistors cannot withstand 5 volts without damage. Thus, the largest and


    Original
    PDF XC4000XL voltagC4000E/EX XC4000E/EX XC3000A XC3000L XC3100A XC3100L XC4000E XC4000EX XC5200L XC7300 XC9500

    X5978

    Abstract: orcad schematic symbols library HP700 HW-130 XC2000 XC3000A XC3100A checking FND
    Text:  Development Systems Products Overview August 6, 1996 Version 1.1 XACTstep: Accelerating Your Productivity The newest version of the XACT development system, XACTstep, started shipping in the fourth quarter of 1995. XACTstep software features a revolutionary combination of


    Original
    PDF

    schematic impulse sealer

    Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
    Text: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original
    PDF FG860 FG900 FG1156 schematic impulse sealer leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481

    XC2000

    Abstract: XC2064 XC3000 XC4000 XC4085XL XC5200
    Text: APPLICATION NOTE APPLICATION NOTE  XAPP 090 November 24, 1997 Version 1.1 FPGA Configuration Guidelines 13* Application Note By Peter Alfke Summary These guidelines describe the configuration process for all members of the XC2000, XC3000, XC4000 and XC5200 FPGA


    Original
    PDF XC2000, XC3000, XC4000 XC5200 XC2000-, XC3000-, XC4000- XC5200-family XC4000/XC5200 XC3000 XC2000 XC2064 XC4085XL

    JEDEC Package Code MS-026-AED

    Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
    Text: • Packages and Thermal Characteristics  November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original
    PDF

    30h80

    Abstract: ICX405AL super had ccd sony super HAD H01H SONY 5003 VTBT ccd sony super HAD IR nm D3741 sony icx
    Text: SONY ICX405AL JiÄ6mm 1/3M IC X 405 A U i C C I R ^ < W Ä 6 mm ( l / 3Ü ) & B X 7 * * # * 7 ic à i t ^ • to y 9 y 4 >Mc ÎàÊ^pnoIC X 0 5 5 B L C ^ U J Jt, D S / N ^ ^ S W l É ^ ± i ( i S i ; f p ] ± L f L tZ o y 4 - ; i / KjgÄüMÄüi * y *


    OCR Scan
    PDF ICX405AL ICX405AUiCCIR tlCX055BLjfc) 2tlCX055BLjfc) ICX055BLj J00608D3Z 30h80 ICX405AL super had ccd sony super HAD H01H SONY 5003 VTBT ccd sony super HAD IR nm D3741 sony icx

    ccd sony super HAD II

    Abstract: V339M ccd sony super HAD CXD1267AN ICX207AK ccd sony super HAD 2 GFCF ALY J1 ALY 4E x597
    Text: SONY ICX207AK ICX207AKÍÍ, P A L ^ < 7 ? $ *7 - \ £ T * ¿i ¿ 7 Ltz-i ÿ 'i ^M CCD lH ^ítít^^tri-o Super HAD C Ç D & f â V f ô J ü t z X ¡9 , ÍÁÉ^pbICX087AKÍCM U Ü JÉ, ;l/ ^ t LfCo LT Y e, A 7 C y, M g, -f ^ 7 J — ' y - i 10mmÂ<7 14 t í > DIP (Plastic) £ f i


    OCR Scan
    PDF ICX207AK ICX207AK rqRICX087AK ICX087AKjt) ICX087AKit) 100mm ccd sony super HAD II V339M ccd sony super HAD CXD1267AN ccd sony super HAD 2 GFCF ALY J1 ALY 4E x597

    sony 330

    Abstract: ccd sony super HAD II CXD1267 ICX207AL LTCM500S super had ccd diode gp 537
    Text: SONY ICX207AL & Ä 4 .5 m m ' 1 / 4 S Ü C C IR & ICX207ALÜ, C C IR ^ ^ : (O yuA tfc > f super HAD CCD& '4ÏOfâJÏÏKX *9., « p dbICX087AOc£î U $J£, t^ o 7 - r - ; i / K ü Ä i l 5 : ^ ö ü L ^ ^ : 'e , Ifiis $ riiO ^ y jr- 'Jf i lOmm <£>14 fc? ^ DIP


    OCR Scan
    PDF ICX207AL ICX207ALÃ pnBlCX087ALtC^ 6dBiiICX087ALit) ICX087ALi 100mm K-K-25 sony 330 ccd sony super HAD II CXD1267 ICX207AL LTCM500S super had ccd diode gp 537

    sony IMX 135

    Abstract: 1CX405AK IMX* Sony sony IMX 45 sony IMX ICX405AK T 582 LTCM500S 2sk523 j51h
    Text: SONY * fÄ 6 m m U ICX 4 0 5 A K 1 /3 1 ! PA L* v - f f lllf tilf f g ICX405AK í i P A L ^ Ä O H \ÍT * ¿3 ¿ 7 ^ T -to D U M 6mm ¿J V ~ L tz 4 y 9 7 'f >M C C D H ^Íf f f « ¿ ä l C X O S S B K X ^ L , J$J^, X 5 7 , S /N ^ ^ * ^ # 1 É é ± i()S ^ íp ]± L tL /:0


    OCR Scan
    PDF ICX405AK nHnICX055BKtCiiL, flCX055BKJt) flCX055BKj 297iMSf J00607E91 1CX405AK sony IMX 135 1CX405AK IMX* Sony sony IMX 45 sony IMX ICX405AK T 582 LTCM500S 2sk523 j51h