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    470M

    Abstract: No abstract text available
    Text: 1. M echanical D im ensions: 2. Sch em atic: C 3.00 Max D 0.150 3. E lectrical Specification : TOP VIEW (SIDE VIEW) Inductance: 47uH±20% 100KHz 0.1V DCR: 268 mOhms Max Isat: 0.34Adc Max (Based on OCL drop by 30%) Irms: 0.75A Max (Based on 40% Temp Rise)


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    PDF 100KHz 34Adc MIL-STD-202, UL94V-0 E151556 XF505030SHâ Dec-16-03 470M

    Untitled

    Abstract: No abstract text available
    Text: 1. M echanical D im ensions: 2. Sch em atic: D 1.5Max 3. E lectrical Specification : INDUCTANCE: 10uH±20% 100KHz 0.1V DCR: 230 mOhms Max SIDE VIEW Isat: 0.57Adc Max, 30% drop in Inductance Irms: 0.78Adc Max, based on 40% temp rise 6.0 4.0 1 BOTTOM VIEW


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    PDF 100KHz 57Adc 78Adc MIL-STD-202, UL94V-0 E151556

    150M

    Abstract: No abstract text available
    Text: 2 . Sch em atic: 1. M echanical D im ensions: C 2.0Max 3. E lec trical S p ecificatio n : INDUCTANCE: 15uH±20% 100KH z 0.1V SIDE VIEW DCR: 210 mOhms Max Isat: 0.88Adc Max, 30% drop in Inductance Irm s: 0.97Adc Max, based on 40% te m p rise 6.0 4.0


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    PDF 100KHz 88Adc 97Adc MIL-STD-202, UL94V-0 E151556 XF505020SHâ Nov-18-03 150M

    Untitled

    Abstract: No abstract text available
    Text: 1. M echanical D im ensions: 2. Sch em atic: C 2.0Max D 0.15 3. E lectrical Specification : TOP VIEW INDUCTANCE: 10uH±20% @100KHz 0.1V DCR: 230 mOhms Max Isat: 0.57Adc Max, 30% drop in Inductance Irms: 0.78Adc Max, based on 40% temp rise SIDE VIEW 6.0


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    PDF 100KHz 57Adc 78Adc MIL-STD-202, UL94V-0 E151556 XF505020SHâ

    rb 503

    Abstract: No abstract text available
    Text: 1. M e c h a n i c a l D im e n s i o n s : 2 . S ch e m atic: c 2,0Max D 0.1 5 o- 3. E l e c t r i c a l S p e c i f i c a t i o n : INDUCTANCE: 3.5uH±20% @100KHz 0.1V TOP VIEW SIDE VIEW DCR: 503 mOhms Typ Isal: 1.82Adc Max, 30% drop in Inductance Irms: 1,73Adc Max, based on 40% temp rise


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    PDF 100KHz 82Adc 73Adc MIL-STD-202G, UL94V-0 E151556 -l-125 rb 503

    LF1608

    Abstract: XT2012
    Text: The flexibility of Surface Mount Technology is greatly expanded by the use of Multilayer Integrated Circuit Technology. The fine material particle size used in the construction of these components yields more layers and higher component densities than were previously possible. The end result is


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    PDF LF1608 LF2012 LR1608 XF3535 XF2525 XF5050 XT2012 IA3225 IF3225