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Koyo Encoder Inc JR120X130X30 NRB Solid Race Inner Ring, 120mm ID, 130mm OD, High Carbon Chrome Steel \| Koyo JR120X130X30
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	JR120X130X30	Bulk		3 Weeks	1	1 $208.95 10 $202.53 100 $202.53 1000 $202.53 10000 $202.53	Get Quote
SKF IR 120X130X30 NRB-NEEDLE ROLLER BEARING \| SKF IR 120X130X30
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	IR 120X130X30	Bulk		3 Weeks	1	1 $281.4 10 $281.4 100 $281.4 1000 $281.4 10000 $281.4	Get Quote
INA Bearings IR120X130X30-XL (ALTERNATE: 1946970) INNER RING 120MM X 130MM X 30MM \| INA Bearings (Schaeffler) IR120X130X30-XL
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	IR120X130X30-XL (ALTERNATE: 1946970)	Bulk			1	1 $250.79 10 $238.25 100 $213.17 1000 $213.17 10000 $213.17	Get Quote
Dichtomatik MA39-120X130X11.5 (ALTERNATE: 75189396) Oil Seal, 120mm ID, 130mm OD, 12.5mm Width \| Dichtomatik MA39-120X130X11.5
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	MA39-120X130X11.5 (ALTERNATE: 75189396)	Bulk		3 Weeks	27	1 - 10 - 100 $14.11 1000 $14.11 10000 $14.11	Get Quote
Oring Uszczelnienia Techniczne Z120X130X5/7P Wiipers Z; PU; Øout: 130mm; -30÷100°C; Shore hardness: 92; single
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TME	Z120X130X5/7P		9		1	1 $1.26 10 $1.14 100 $1.01 1000 $1.01 10000 $1.01	Buy Now

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120X130 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
heat sink Abstract: No abstract text available Text: Thermal Data  POWER DIP 24 20+2+2 leads 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach epoxy glue silver filled 15-50 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C	Original	PDF	063W/cm 152x160 120x130 heat sink
heat sink to220 Abstract: TH17023 Text: Thermal Data TO-220, PENTAWATT, HEPTAWATT 3,5,7 leads 5 leads 3 leads 7 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach sof solder	Original	PDF	O-220, 063W/cm O-220 120x130 TH17023 175x195 heat sink to220
Untitled Abstract: No abstract text available Text: Thermal Data POWER SIP Family 9,10 leads 9 leads 10 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm	Original	PDF	063W/cm 149x135 120x130 112x130 100x100
Untitled Abstract: No abstract text available Text: Thermal Data POWER SIP Family 9,10 leads 9 leads 10 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm	Original	PDF	063W/cm 149x135 120x130 112x130 100x100
EPOXY RESIN Abstract: No abstract text available Text: Thermal Data  POWER DIP 24 20+2+2 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach soft solder tin / lead 15-50 µm 0.5 W/cm°C molding compound epoxy resin 1.4 mm 0.0063W/cm°C	Original	PDF	063W/cm 152x160 120x130 EPOXY RESIN
a3020 Abstract: No abstract text available Text: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C	Original	PDF	063W/cm 152x160 120x130 a3020
Untitled Abstract: No abstract text available Text: Thermal Data TO-220, PENTAWATT, HEPTAWATT 3,5,7 leads 3 leads 5 leads 7 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach sof solder	Original	PDF	O-220, 063W/cm O-220 120x130 TH17023 175x195
Untitled Abstract: No abstract text available Text: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C	Original	PDF	063W/cm 152x160 120x130
Untitled Abstract: No abstract text available Text: Thermal Data CLIPWATT Family 8,11,15 leads 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin	Original	PDF	063W/cm 120x130 175x195
DIP18 Abstract: No abstract text available Text: Thermal Data POWER DIP 18 12+3+3 leads 12+3+3 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C	Original	PDF	063W/cm 165x220 120x130 DIP18
NF800-CEP Abstract: NF1250-SS DSN40 no-fuse Circuit breaker Mitsubishi Text: MITSUBISHI ELECTRIC Low Voltage Switchgears Moulded-Case Circuit Breakers Disconnectors WSS, PSS & Super Series 3 A – 1600 A Technical Catalogue 2004 AUDIN - 8, avenue de la malle - 51370 Saint Brice Courcelles - Tel : 03.26.04.20.21 - Fax : 03.26.04.28.20 - Web : http: www.audin.fr - Email : [email protected]	Original	PDF	RU-344041 ZA-1600 133207-D D-40880 NF800-CEP NF1250-SS DSN40 no-fuse Circuit breaker Mitsubishi
Untitled Abstract: No abstract text available Text: ADVANCED COOLING METHODS FOR HIGH POWER DENSITY IN ELECTRONIC By Dr. Ing. Cesare CAPRIZ AAVID THERMALLOY Director of European Business Development Via XXV Aprile 32 40057 Cadriano BO – ITALY Phone: +39 051 764011 Fax: +39 051 764090 e-mail: [email protected]	Original	PDF	300x180x15
Untitled Abstract: No abstract text available Text: Thermal Data POWER DIP 18 12+3+3 leads 12+3+3 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C	Original	PDF	063W/cm 165x220 120x130
Untitled Abstract: No abstract text available Text: Thermal Data CLIPWATT Family 8,11,15 leads 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin	Original	PDF	063W/cm 120x130 175x195