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    Untitled

    Abstract: No abstract text available
    Text: Thermal Data POWER SIP Family 9,10 leads 9 leads 10 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm


    Original     		PDF 063W/cm 149x135 120x130 112x130 100x100

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data POWER SIP Family 9,10 leads 9 leads 10 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm


    Original     		PDF 063W/cm 149x135 120x130 112x130 100x100